The paste is automatically dispensed across the entire squeegee length, maintaining at 15mm rolling diameter, adopting the common 500 gram's solder paste jar. completely eliminates the wastage of solder paste overflowing to the sides of squeegee.

With SPI close-loop system, machine will automatically adjust and correct the print deposits based on the feedback given with regards to poor printing quality. This will facilitate improved print quality and production efficiency, by forming a complete printing feedback system.

• Optical resolution10 μm or 15 μm (factory setting)
• LightingLED lit fringe pattern
• Inspection speedUp to 90 cm2/sec @ 10 μm  Up to 200 cm2/sec @ 15 μm
• Inspection performanceHeight resolution 0.4 μm Min solder paste pitch 100 μm
• Camera type4 MP camera

INTRODUCTION Built around the successful and reliable TR518 series platform, the TR518 SII MDA now provides its excellent performance combined with friendly Windows 7 user interface design and USB interface connection to test PC or notebook. With up to 2560 analog test points, TestJet technology and many other features, the TR518 SII delivers high speed, high accuracy and high reliability testing.   ICT Key Features Tested, proven and reliable TR518 platform with USB interface Friendly Windows 7 user interface software USB interface for NB/Laptop/Desktop PC Small Tester Footprint :482(W)*353(H)*310(D) Up to 2560 Test Pin Counts High Speed, High Accuracy and High stability Friendly User Interface and Support Multi-Language Fixture and Test Program Compatible Full MDA test capability and Better Performance Open/Short Test, R/L/C Test, Diode Test, Transistors and FETs Test 6-wire Milliohm Measurement Clamping Diode Test TestJet Test Up to 100V High Voltage Zener Diode Test System Self-calibration and Diagnostics

• Support MethodMagnetic support pins, bars, blocks, vacuum suction  
• Process Alignment Capability2Cpk @ ± 25 microns 6 sigma
• Cleaning SystemAuto wet, dry, vacuum (software select)  
• Conveyor DirectionL to R, R to L, R to R, L to L (software control)  
• Core Cycle Time  (excluding printing & cleaning time)< 8.5 secs
• Max. Size (L x W)400mm x 300mm
• Conveyor Height900 ± 40mm  
• Product Changeover Time< 3 mins
• Min. Size (L x W)50mm x 50mm
• Conveyor SpeedMax. 1500 mm/s  
• New Product Set-up Time< 10 mins
• Thickness0.4 ~ 6mm
• Conveyor Width AdjustmentAutomatic  
• Stencil Frame Size (L X W)Adjustable, 470mm x 370mm to 737mm x 737mm
• PCB Thickness AdjustmentManual (Auto is option. PCB max. width reduced to 310mm)
• Power SupplyAC220V ± 10% 50/60Hz
• Print Gap (snap-off)0 ~ 20mm
• PCB Max. Weight3 KG  
• Power Consumption2.5 kW
• Printing Table Adjustment RangeX: ± 3mm, Y: ± 7mm : ± 2°
• PCB Edge Clearance3 mm  
• Air Supply4 ~ 6 Kgf/CM2
• Print Speed6 ~ 200 mm/s
• PCB Bottom Clearance15mm (7mm with optional auto PCB thickness adjustament)  
• Dimension (excluding signal tower)1.158mm (L) x 1.362mm (W) x 1.463mm (H)
• Squeegee Pressure0.5 ~ 10KG (program control)  
• PCB WarpageMax. 1% diagonally  
• Machine Weight1000kg
• Squeegee TypeStd.: Metal, Option: OPC, rubber  
• Clamping MethodTop clamp (manual) and motorized side clamp  
• Machine Alignment Capability2Cmk @ ± 12.5 microns 6 Sigma
• Squeegee AngleStd. 60°, Option 45°, 50°, 55°  

The paste is automatically dispensed across the entire squeegee length, maintaining at 15mm rolling diameter, adopting the common 500 gram's solder paste jar. completely eliminates the wastage of solder paste overflowing to the sides of squeegee.

With SPI close-loop system, machine will automatically adjust and correct the print deposits based on the feedback given with regards to poor printing quality. This will facilitate improved print quality and production efficiency, by forming a complete printing feedback system.

• Camera type4 MP camera
• Optical resolution10 μm or 15 μm (factory setting)
• LightingLED lit fringe pattern
• Inspection speedUp to 90 cm2/sec @ 10 μm  Up to 200 cm2/sec @ 15 μm
• Inspection performanceHeight resolution 0.4 μm Min solder paste pitch 100 μm

INTRODUCTION Built around the successful and reliable TR518 series platform, the TR518 SII MDA now provides its excellent performance combined with friendly Windows 7 user interface design and USB interface connection to test PC or notebook. With up to 2560 analog test points, TestJet technology and many other features, the TR518 SII delivers high speed, high accuracy and high reliability testing.   ICT Key Features Tested, proven and reliable TR518 platform with USB interface Friendly Windows 7 user interface software USB interface for NB/Laptop/Desktop PC Small Tester Footprint :482(W)*353(H)*310(D) Up to 2560 Test Pin Counts High Speed, High Accuracy and High stability Friendly User Interface and Support Multi-Language Fixture and Test Program Compatible Full MDA test capability and Better Performance Open/Short Test, R/L/C Test, Diode Test, Transistors and FETs Test 6-wire Milliohm Measurement Clamping Diode Test TestJet Test Up to 100V High Voltage Zener Diode Test System Self-calibration and Diagnostics

• Conveyor Width AdjustmentAutomatic  
• Stencil Frame Size (L X W)Adjustable, 470mm x 370mm to 737mm x 737mm
• PCB Thickness AdjustmentManual (Auto is option. PCB max. width reduced to 310mm)
• Power SupplyAC220V ± 10% 50/60Hz
• Print Gap (snap-off)0 ~ 20mm
• PCB Max. Weight3 KG  
• Power Consumption2.5 kW
• Printing Table Adjustment RangeX: ± 3mm, Y: ± 7mm : ± 2°
• PCB Edge Clearance3 mm  
• Air Supply4 ~ 6 Kgf/CM2
• Print Speed6 ~ 200 mm/s
• PCB Bottom Clearance15mm (7mm with optional auto PCB thickness adjustament)  
• Dimension (excluding signal tower)1.158mm (L) x 1.362mm (W) x 1.463mm (H)
• Squeegee Pressure0.5 ~ 10KG (program control)  
• PCB WarpageMax. 1% diagonally  
• Machine Weight1000kg
• Squeegee TypeStd.: Metal, Option: OPC, rubber  
• Clamping MethodTop clamp (manual) and motorized side clamp  
• Machine Alignment Capability2Cmk @ ± 12.5 microns 6 Sigma
• Squeegee AngleStd. 60°, Option 45°, 50°, 55°  
• Support MethodMagnetic support pins, bars, blocks, vacuum suction  
• Process Alignment Capability2Cpk @ ± 25 microns 6 sigma
• Cleaning SystemAuto wet, dry, vacuum (software select)  
• Conveyor DirectionL to R, R to L, R to R, L to L (software control)  
• Core Cycle Time  (excluding printing & cleaning time)< 8.5 secs
• Max. Size (L x W)400mm x 300mm
• Conveyor Height900 ± 40mm  
• Product Changeover Time< 3 mins
• Min. Size (L x W)50mm x 50mm
• Conveyor SpeedMax. 1500 mm/s  
• New Product Set-up Time< 10 mins
• Thickness0.4 ~ 6mm