Hyderabad, Telangana, India
Verified
Add Review
Our Product / Services
Zinc plating involves the electrolytic application of zinc by immersing clean steel parts in a zinc salt solution and applying an electric current. We carry four different zinc plating products that are sure to fit your metal plating needs. They include: An Alkaline non-cyanide zinc plating, Bright Acid chloride zinc plating, Zinc-nickel alloy plating Cyanide zinc plating Our zinc plating process is suitable for rack or barrel plating and large volume batches.
Acid Chloride Zinc
A mixed ammonium/potassium chloride bright zinc plating process It produces brilliant, level and ductile deposits even on difficult substrates such as cast iron, heat treated and carbonitrited steel. The water soluble brightener goes into solution much more readily than a solvent based brightener.
A bright chloride zinc plating solution.
It has the same inherent advantages and benefits as but uses a different carrier component. SMF is an expert metal finishing and metal plating company, and is also a member of ASTM International. For more information about ASTM International, click here.
It is a thoroughly tested, stable and production proven zinc plating brightener process. It provides better zinc metal distribution than traditional alkaline zinc or chloride zinc plating systems. Operating parameters are wide and therefore it is an easy process to maintain. The process was developed to replace cyanide zinc plating without sacrificing the quality of the zinc deposit. Waste treatment is simplified and requires only a simple pH adjustment to precipitate zinc metal as zinc hydroxide.
Benefits of Alkaline Zinc Plating:
Color is gray white in plated condition, had very high luster in fused condition. Soft, but is very ductile. Corrosion resistance is good. (Coated items should meet 24 hour 5% salt spray requirement.) Solder ability is excellent. Tin is not good for low temperature applications (changes structure and loses adhesion when exposed to temperatures below -40 degrees C). If a bright finish is desired to be used in lieu of fused tin, specify Bright Tin plate. Thickness can exceed that of fused tin and in deposit shows excellent corrosion resistance and solder ability.
Type I: Electrodeposited
Type II: Hot dipped
Silver platingoffers the highest electrical conductivity of all metals. It is not a precious metal and will oxidize rapidly. Silver plating is best suited for engineering purposes for solderable surfaces, electrical contact characteristics, high electrical and thermal conductivity, thermocompression bonding, wear resistance of load-bearing surfaces, and spectral reflectivity electrical applications, good corrosion resistance, good solderability, and other applications.
Silver Plating Specification:
Specification: Mil-QQ-S-365 Silver Plating, Electrodeposited
Silver Plating - Grades:
Silver Plating - Tarnish-Resistance:
Several options are available as supplementary coating for increasing tarnish resistance. Depending on solderability, or subsequent finishing steps such as painting or powder coating, we will recommend specific tarnish resistant coatings.
Goldis unique with its yellow color. Also, gold is a precious metal, which means that it will not oxidize in air, so its electrical conductivity stays uniform over long periods of time. It is ideally suited for gold electroplating applications. Gold plating offers good corrosion resistance, good solderability, and when alloyed with cobalt, it has very good wear resistance. Gold is commonly used in electrical switch contacts, connector pins and barrels, and other applications where intermittent electrical contact occurs.
Specification:MIL-G-45204 Gold Plating, Electrodeposited
Gold Plating & Gold Electroplating - purity and coating thickness:
Co-deposited impurities can make soldering more difficult, and for this reason high purity gold plating is preferred. Soldering requirements are best achieved when gold electroplating coatings range between 0.00005 and 0.0001 inch (50 and 100 micro inches) thickness.
Gold Plating & Gold Electroplating - Hardness Grades:
A. 90 knoop, maximumB. 91-129 knoop, inclusiveC. 130-200 knoop, inclusiveD. 201 knoop, minimum
Specification: ASTM B 488 Standard Specification for ElectrodepositedCoatings of Gold for Engineering UsesType-I 99.7% gold minimum; hardness grade A, B, or C *Type-II 99.0% gold minimum; hardness grade B, C, or D *Type-III 99.9 % gold minimum; hardness grade A only *
Specification:AMS 2422 Gold Plating for Electronic and Electrical Applications
An underplate of copper (from a copper cyanide solution) is required unless the base material is copper or a copper alloy containing less that 15% zinc.
Copper Thickness:Not less than 0.0001" A layer of nickel (from a Watt's or chloride solution) is required over the copper underplate or copper base material.
Nickel Thickness:Not less than 0.0001" The gold (from a cyanide solution) is to be deposited directly on the nickel layer.
Gold Thickness:Not less than 0.00005" on all functional surfaces. Gold Purity: Not less than 99.0% pure.
About solderability: MIL-G-45204 extract:Codeposited impurities can make soldering more difficult, and for this reason high purity gold coatings should be used for those applications. Excellent solderability is best achieved when the gold thickness is between 0.00005 and 0.0001 inch.
About Undercoating: MIL-G-45204 extract:a) Unless otherwise specified, gold over silver underplate combinations should be excluded from electronics hardware (3.4).b) When gold is applied to a copper rich surface such as brass, bronze, or beryllium copper, an antidiffusion underplate such as nickel should also be applied (3.4).
Gold over silver is not recommended for electronics hardware:
Gold Plating - Underplate Recommendations Gold Electroplating - When gold is applied to a copper rich surface such as brass, bronze, or beryllium copper, metal ions from these base metals will diffuse into the gold layer and degrade its hardness and non-oxidizing properties. An antidiffusion underplate such as nickel (electroless or sulfamate) should be applied to prevent this. We recommend electroless nickel under gold where part flexure of deformation is not expected and a bight finish is desirable. Where part flexure or deformation is expected, we recommend sulfamate nickel as the underplate because of its higher ducility.
Electroless means that the process used to plate the gold onto a surface is not the traditional electroplating cell having electrodes and an external power supply. Electroless gold is deposited from a solution purely as the result of the reaction of chemicals in the bath. The electroless plating bath is comprised of several of the same items found in an electrolytic gold plating bath, but it also includes chemicals (reducing agents) to provide electrons for the reaction and other chemicals (chelating agents and stabilizers) to control the reaction so that it can be predictable and controllable as a manufacturing process.
Why Does It Matter Which Process is Used to Plate?Is the Deposit the Same?To plate a part using an electrolytic process, every surface to be plated must be connected electrically so that it can act as the cathode in the plating cell. This becomes difficult for many products but especially for electronic circuits that generally need to have electrically isolated surfaces to be functional. Over the course of the development of the electronics industry it has become common practice to design in connections to tie different surface metal patterns together just for plating and then to remove these connections after plating. The manufacturing inefficiencies of this are obvious but a greater problem is the restriction this places on the final performance and circuit density of the component.
Using electroless gold plating, circuits can be designed and fabricated in their final configuration. This saves the manufacturer several steps but more importantly it allows the circuit design to place primary consideration on optimum circuit performance and minimum circuit size.
The electroless gold deposit is identical to an electrolytic pure gold deposit (i.e., Mil-G-45204 C Type III or ASTM B488 Type 1 hardness code A) in essentially every way; thickness, purity, hardness, grain size, density and color. The primary difference from an electrolytic gold deposit is it's second distinct advantage. improved thickness distribution.
Electrolytic plating creates deposits that have thickness variations resulting primarily from the shape of the electrical field between the cathode surfaces and the anode. These deposits are thicker on corners and edges and surfaces where the distance to the anode is shortest. They are also thinner in the middle of surfaces, inside of holes and on surfaces facing away from the anode.
Electroless plating completely eliminates this source of variation. Electroless gold plated deposits are uniform in thickness around corners, on both sides of a part, even on the inside walls of small holes that may be very deep.
Similar to stainless steel in color, Plates uniformly in recesses and cavities (does not build up on edges). Corrosion resistance is good for coatings over .001 thicknesses. Electro less Nickel is used extensively in salvage of miss-machined parts. Also for inside dimensions and irregular shapes (where assembly tolerances need uniformity provided by Electro less process).
Class 2 Baking Schedule to Achieve Hardness
Class 1 As coated.
Class 2 Steel, copper, nickel, cobalt-titanium based alloys and any basis metal not adversely affected by heating as specified.
Class 3 Aluminum alloys non-heat-treatable, and beryllium alloys processedto improve adhesion of nickel deposit.
Class 4 Aluminum alloy, heat-treatable, processed to improve adhesion of the
nickel deposit.
Grade A .001 Min. thickness
Grade B .0005 Min. thickness
Grade C .0015 Min. thickness (for severe corrosion protection).
Nickel can be deposited soft or hard-dull or bright, depending on process used and conditions employed in plating. Thus, hardness can range from 150500 Vickers. Can be similar to stainless steel in color, or can be dull gray or light gray (almost white) color. Corrosion resistance is a function of thickness.Class 1A: For corrosion protection
Grade A: .0016 Min. thickness
Grade B: .0012 Min. thickness
Grade C: .0010 Min. thickness
Grade D: .0008 Min. thickness
Grade E: .0006 Min. thickness
Grade F: .0004 Min. thickness
Grade G: .0002 Min. thickness
Class 2: For engineering applications Electro less Nickel plating, Nickel is generally used as a semi-bright white corrosion resistant finish. Electro less nickel plates with unusually uniform dimensional build up on parts so that you dont get thick regions at outside corners and thin regions at inside corners and in cavities. Also, E-Nickel is hard and offers good wear resistance. The corrosion resistance improves with increasing phosphorous content. We offer both mid-phosphorus and high-phosphorus E-Nickel solutions. E-Nickel (Plating is) plates very well to many types of aluminum and therefore serves as an excellent base for precious metals, which generally dont adhere well to aluminum. Mil Spec C26074
