SCB Interconnection Solutions Pvt Ltd

Outer Ring Road, Bangalore, Karnataka

The Colenta IL-PCB Film processor range is a fully automatic dry to dry processing system designed for reliable processing of all types of common used PCB films. The processor incorporates a non opposed roller transport system which has been produced to ensure minimal contact with the film emulsion and has a series of intermediate wash water crossovers which safely transfer the film between each stage of processing to produce high quality PCB images requiring the minimum of operator involvement

Our Colenta PCB film processors are well established with a proven reputation for quality production, reliable performance and long life operation

Standard Features and accessories:

• Removable flat feed table
• upgradable on site for higher processing capacity
• Touch Free detection and area measurement of all material entering the processor
• Film area based precise replenishment of all chemical solutions
• Low level monitoring in all processing tank solutions.
• External filters for DEV / FIX & WASH
• Filter Change Alert.
• Automatic Standby and energy saving modes
• Work in Progress monitoring
• Integrated Replenishment storage tanks with level control
• Prepared for connection to an external exhaust air facility

AIN FEATURES

• PAlRS TRACKS >0.002 (0.05mm)
• Easy to use Tactile controls
• Fully Adjustable Low Pressure Weld Head
• Auto Electrode Contamination Indication
• Low Voltage Safety Circuitry
• 99 Prog. Memory with Manual Override
• Repairs Bare and Assembled PCBs
• Large Work-Piece Capacity
• Adjustable Worklamp Output
• Low Maintenance

Enabling High Yield Volume Production of Fine- Feature PCBsExposure on all UV, dry or liquid resists Imaging on inner and outer layers, SBU, flex PCBs and solder maskCompatible with Yellow Room environment.

The systems feature Orbotechs patented LSO Technology which can image ultra-fine lines down to 8m. For the FC-BGA/FC-CSP production our field proven system supports SAP and modified versions of SAP processes, while ensuring pitch down to 20m. For advanced BGA/CSP subtractive production, our system provides throughput of up to 160prints per hour Nuvogo LDI for Mass production.Nuvogo LDI for Mass production.

NuvogoTM 800 is a leading Direct Imaging (DI) solution for mass production digital imaging of fine-line HDI, Flex, Rigid-Flex and MLB applications. This cutting-edge system is powered by the new MultiWave Laser Technology, which simultaneously generates a multi-wavelength laser beam, offering maximum robustness on a vast range of resist types. Based on Orbotechs field-proven Large Scan Optics (LSO) Technology, the system is designed for unprecedented throughput of up to 7, 000 panels per day, helping to decrease overall cost of ownership while .maintaining optimal quality at high speed

This is the smallest configuration , and is generally recommended for ICT and on-board programming applications. It is characterized by a high level of ergonomy, small footprint, easy maintenance , low power consumption and enhanced operator safety.

Thanks to its reduced footprint, and compliance with WCM criteria, the system can be easily and successfully integrated in any production environment. Low management costs and high flexibility guaranteed.

Compact TK is especially suitable for:

• parametric and in-circuit tests
• Functional tests
• On-board programming
• Medium-volume and high-mix production
• Implement distributed test station
• Non-conveyable boards

Features

• Up to 1536 analog channels
• Up to 128 hybrid channels (digital channel up to 10 MHz)
• Up to 6 user power supply units
• 2-JOB parallel test with standard cabinet
• 4-JOB parallel test with double cabinet
• OPENFIX test to identify open pins on digital components and connectors
• Universal on-board programmer (up to 8 in parallel)
• Boundary-scan test
• Self-tes at the module level
• Receiver with pneumatic upper contrasts
• Off-line Programming and Repair Stations
• Barcode and 2D code reading management and automated statistic data collection
• Automated programming via CAD data import

The Pilot 4D V8 represents the latest frontier in flying probe test technology; it is the complete solution for those who want maximum performance: the highest test speed, low to medium volume, test coverage and flexibility, for prototyping, manufacturing, or repairing any type of board. Its vertical architecture is the optimum solution for probing both sides of the UUT simultaneously.

Pilot 4D V8 is suitable for:

• Vectorless and in-circuit tests
• Programming and functional tests
• Boundary Scan test
• Medium/high volumes with automatic loader
• Highly-integrated prototypes
• High-mixed products
• Boards not designed for testing
• Reverse Engineering and Repair

Features and capabilities

• 8-flying probe tester unit (4 on each side)
• Vertical architecture to reduce d.u.t. warpage and vibrations.
• Both top and bottom sides are equipped with power probe, capacitive probe and camera
• Manual or automatic d.u.t. loading (optional loader/unloader)
• In-circuit tests, on-board programming, boundary-scan
• Quick-test test for functional test sequence implementation
• Fixed channels available (connected manually or via connector)
• Off-line programming and repair stations
• Barcode reading capability and 2D; automated collection of statisctical data
• Automated programming with CAD data import
• Repair tool: PWMON (net analysis of powered board), thermal scan (temperature monitoring), DES (software to assess the error probability).

The salient features of Spray Coater are given below.

• Innovated Design with direct extraction.
• Solder mask application is very uniform irrespective of circuit pattern and thickness of Copper.
• Also coating thickness as compared to Screen printing is much more uniform over edges as well as on surface.
• Coating thickness can be controlled effectively.
• Minimum cleaning & maintenance efforts (extended filter-elements easy to replace).
• Long term approved ink supply system.
• Atomized air can be heated up till 100C (Solvent evaporates during coating transfer improved cosmetic and coverage).
• Design of extraction includes flash-off function.
• Easy operation via Touch-Panel.
• Optional transport-systems: Belt-, Pin-chain-, grip-chain-transport with cleaning function.
• Double-sided coating in one cycle.
• Minimum wastage of PISM ink compared to any other technology used for SMOBC.

Circut P-series

• Powered separator blade
• Separates up to 700mm panels
• One step separation & finishing
• Depanels boards with components up to 70mm high
• Compensates for inconsistent web thickness
• Hardened & ground blades and guides
• Separates from 0.5 - 3mm thick panels
• Precision board edge conditioning
• Handles intermittent scoring
• 3mm separator channel
• Variable speed control

Circut M-series

• Manually operated separator
• One step separation & finishing
• Superior micro-board processing
• Compensates for inconsistent web thickness
• Depanels boards with components up to 70mm high
• Accepts boards with component overhang
• Hardened &groundblades and guides
• Separates from 0.5 - 3mm thick panels
• Precision board edge conditioning
• 3mm separator channel
• Quick & simple set up

Featuring innovative DotStream Technology and UV LED curing, Sprint 120 delivers high speed and top quality printing for consistent, volume production of advanced legend designs.

Benefits

Consistent Printing with DotStream Technology

• Precise drop control at high speeds
• Optimized algorithms for fine text and filled areas
• Customized print heads for electronics industry challenges and processes
• Patented nozzle cleaning station
• Air scrubber for clean printing environment

Volume Production with Top Quality

• Advanced LED-based UV curing on-the-fly
• High production quality with less passes than previous systems
• Uniform printing over challenging surfaces
• Accurate results on features down to 0.5mm

Easy and Flexible Operation

• No screen mask preparation required
• Intuitive and user-friendly interface for fast set-up
• Automated data transfer from CAM
• Pinless alignment for reduced load/unload time
• Flexibility to print side A-A or A-B

PENTAGAL Chemie und Maschinenbau GmbH

HAL : Model PENTA 550

Penta 550 is a vertical hot air leveling system, which is equipped with the latest technology. User-friendly operation is guaranteed by a touch panel. A high-speed PLC allows high operation-speed. Penta 550 possesses the advantages of the Penta-series, such as top quality and longevity, low-priced and simple maintenance, low spare-part costs and user-friendliness. Because of the enclosed housing the production is emission-free. Of course Penta 550 is lead-free capable as well.

The external panels are made of stainless steel.

The clamp-lift-unit for the pcb-clamp is an electrically controlled, The dipping and exhausting speed is pilot controlled and safe in menu.

• BrklesMultilam multi daylight laminating system offered in a special package as a stand-alone productive system using the latest state of the art technology.
• Brkles robust solid steel machine design with platen guiding system.
• Thermal oil heating system providing unmatched platen heating uniformity. Includes thermal fluid piping for compact footprint.
• Automated or manually supported precision indexing Style Transport Loading system providing the ability to transfer heavy tools reliably time after time. No heavy lifting of tooling platens required.
• State of the Art Computer and Programmable Logic Controller system with Brkles Process Visualization and Wonder ware Human Machine Graphical Interface.

Features:

• Enclosed Vacuum Chamber
• Prismatic Vee Guided Platen Ways
• Spring Loaded Platen Suspension
• Electrically heated Thermal Oil
• Hydraulic Pressure system
• Heating System

Advance Performance within your reach

• Scanning TDR Technology
• Calibrate to National Standard
• Accurate over a wide range of measurement
• Powered by a high speed USB Connection
• Single and Differential Measurement
• Data Collection and Display Software
• Statistical Reporting of Result
• Affordable Price

The Zmetrix ST600 Impedance Test System bring a additional hardware and Software feature to the PCB Test market at a very affordable price The ST600 has 1% measurement accuracy calibrate to 25, 50, 75 and 100 ohm reference airline tracable to national standard

SURFACE TECHNOLOGY

• BRUSHING + CLEANING
• LEVELLING + CLEANING
• OXIDE REPLACEMENT
• STRUCTURING + CLEANING
• SURFACE FINISHING

RESIST TECHNOLOGY

• DES
• CHEMICAL MILLING
• REGENERATION
• SES

DESMEAR + METALLIZATION

• DESMEAR
• DIRECT METALLIZATION
• ELECTROLESS COPPER
• ELECTROPLATING
• IMMERSION TIN

AUTOMATION + MEASURING EQUIPMENT

• Buffer
• Conveyor
• Panel Measuring Table
• Unloader + Loader

VERTICAL PROCESSING

• VERTICAL SPRAY PROCESSING EQUIPMENT

Standard Brushing machine

The standard brushing machine is primarily used for the deburring and cleaning of drilled PCBs. Thin inner layers are brushed bi-directionally at a high oscillating frequency. The distance between the brushes and the panel is automatically adjustable. The copper centrifuge "Cecumat" removes the copper abrasion from the rinsing water.

DEVELOP-ETCH-STRIP======DES

Developing - Etching - Stripping. In a typical inner layer line the non-exposed resist is developed in the developer, the bare copper is sprayed with an acid etching solution in the etching module and removed down to the base material and the resist is stripped off by using an alkaline solution. With outer layers the photo resist is used to define the pattern of an additionally deposited metal resist layer and is removed in the stripper using an alkaline solution.

Strip Etch Strip====SES

Stripping - Etching - Tin stripping. In the production of outer layers, photo resist is used for the structuring of an additional, deposited layer of metal resist, and then removed again in the stripper. The exposed copper is etched off in the alkaline etching module down to the basic material and the metal resist (Sn) is removed in a tin stripping system

ELEctro Plating Line

The galvanic plating system NTwC features a segmented contact frame, which permits contact of the panels only along the side edges and ensures an even copper deposition. During the plating process, the pulse form is controlled by rectifiers. The targeted flooding with fluid jets provides an optimum electrolyte exchange.

Vertical Spray Processing Equipment

Vertical processing has many considerable advantages such as little footprint, a service-friendly design and a contact-free transport system. Most notably vertical processing allows a double-sided symmetric chemistry treatment by identical process conditions on both sides of the substrate.

This is especially beneficial in etching: by using a special chemistry that only is effective when hitting the substrate, the process result is absolutely homogeneous and the well-known puddling effect that occurs in horizontal etching is completely eliminated. Still up to today elaborate intermittent spraying techniques are necessary in trying to compensate this puddling effect.

The Vertical Transport with Clamping (VTwC) is available for all spray applications: precleaning, resist and soldermask developing, flash etching, CuCl etching, resist stripping and MEC etch bond.

The ProVia drillers provide the ultimate processing workstation for rigid boards, with high performance beam positioning for rapid point-to-point drilling and routing complex features. Choose a UV-only model, a CO-only model, or the hybrid version with both laser sources. The CO laser is appropriate for high speed drilling, cutting and skiving of dielectrics, while the UV laser is able to machine copper and provide higher process quality in many dielectrics. Whether your application is with glass- and aramid-reinforced epoxies or non-reinforced materials (e.g.resin-coated foil or polyimide), there is a ProVia model to meet your requirements.

ProVia Series

Integrated laser drilling / cuttingtool for high volume production

• High performance beam positioning for rapid, accurate panel processing
• CO 2, UV, and hybrid (UV+CO2) processing
• Zoom telescope provides continuously variable spot sizes
• Optional automatic load/unload and slip sheet handling
• Optional beam homogenizer for flat-top CO2 spots

The SP710avi Stencil printer continues to built upon speed print commitment t high performance and reliability with the addition of ADu providing even greater flexiblity and value within the same indusstry leading platform the system has been developed upon the industry award winning SP700 platform the delivers un paralleled performance manging the rigor of high volume

EUROPLACER

Europlacers Integrated IntelligenceTM is defined by the fact that the Pick and Place machines have been designed to be flexible from the outset. All aspects of the machine architecture (axis configuration, feeder inventory, turret head technology, software control, programming system, etc) have been designed to work together with intelligent feeders in a changing environment - this is truly Integrated IntelligenceTM.

As a result, Europlacer Surface Mount machines release usable productivity in day-to-day performance.

iineo-II

iineo is widely configurable, allowing for 24 different machine possibilities, for the dual head machine:

• Dual linear motor gantries including two rotary turret heads with 8 or 12 pickup nozzles
• 2 board positioning mechanisms
• Oversized board options
• Feeders in front and rear, or front only

The iineo platform features many improvements to the Europlacer machine range, such as an extremely high feeder count, largest industry board size and increased maximum component height.

The platform uses Europlacers unique Integrated IntelligenceTM plus proven core features:

• highly robust and flexible turret head
• intelligent feeders
• 3DPS
• powerful software tools

• High Precision Coordinate Scanning and Measuring Machine
• Measuring of Drilled Holes on PCBs with Scanner
• Contour Measuring
• QC5000 Metrology system

Matrix CCD camera

• Optical depth measuring
• High speed scanner

80mm line camera

Up to 1.000.000 features in seconds

• Contactless laser depth sensor

Fully integrated into QC5000 software

Depth profile measuring

• 3D sensor

High precision topography measuring

High tech diagnostic tools

Vacuum Plugging Machine VCP5000-1

• Panel is placed inside themachine and vacuum is optionallydrawn inside the chamberdepending on the hole fill requirements
• Utilizing a similar principle as the hand-held unit, compressed air is used to force the material into a designated head and then through the via holes
• Depending on factors, such as hole quality and paste rheology, holes up to 1:40 aspect ratio can be filled; the vacuum is not needed for through-holes
• Cu plated blind vias can be easily filled without any voids utilizing the vacuum
• Excess material is removed by squeegee system

Via Hole Filling VHF 300V w/ a Vacuum function

• Flexible plugging machine allowing different types of panels and pastes to be processed
• handles boards at the extreme ends of the board thickness spectrum (up to 350 mil)
• minimizes consumption and waste of paste (smaller heads can be used)
• Max. panel size 24 x 30
• Thickness range is up to 350 mil thick
• 480 Volt, 3 Phase power connection, 4 kW
• The touch panel display allows up to 50 recipes to be stored
• Head sizes available: 5-12"
• Speed of head movement in the X and Y direction

Plane Raze Device SV100 Uniform finish with fine surface roughness

• Superior sanding is achieved by sanding pressure controlled rotation and oscillation head motion
• Sanding after hole plugging
• Deburring and dressing after
• through hole drilling (thick panels
• Dressing after plating, built-up PCB
• Dressing and cleaning of stainless press plates
• Dressing of multilayers

RAPID LINE

The RAPID line flying probe test system designed specifically for testing any type of printed circuit board from simple single side circuits, to complex multi layers, inner-layers and ceramics. There are different types of models available with 4 probes and 8 probes systems, completely independent mobile probes, four probes on each board side. Model; S280 comes with 8 probes 4 on each side. Model S220 comes with 4 probes 2 on each side.

Thanks to the third generation of linear guide the S280 is able to achieve very high Speed with the maximum accuracy and measurement repeatability: the X and Y axes of the S280 utilize the roller bearings and powerful brushless motors coupled with pre-loaded, high precision ball screws to move the eight measurement probes. S280 is equipped with the new probes generation that can combine with the same probes traditional test (2wire) with Kelvin test (4wire).

DLG1+1Series Automatically Spindle switch over

The fully automatic drilling machine with an integrated load and unload system

Optimum machine utilisation with exceptional reliability of operation and improved quality fully automatic Model DLG from LENZ points the way. The space saving machine loading system operates as a combined unit.

LINEAR MOTORS for the X-and Y-AXIS (drive speed 80 m/min),

LINEAR MOTOR for the Z-AXIS (drive speed 50 m/min),

Laser check system for tool length, diameter and run out,

Quick drill (automatically adjustment of the H-value),

Clamping system, pneumatically for 3mm to 5mm pins

The magazine holds up to 20 PCB stacks, and is attached to the back of the drilling machine whilst remaining freely accessible

Pinless Machine is used for aligning inner layer and bonding one over other and thereafter welding by using inductive current. This makes ML production simple

The optical registration system gives many benefits, such as

• No pots etching punching /drilling necessary anymore.
• No rivets.
• Process cost reduction : no dedicated tools for inner layer registration and lamination press.
• Possibility to weld 10mm multilayer thick.
• If you need any additional information, kindly do let us know.

The fundamental objective of a dry-film laminator is to intimately bond the dry-film resin and the copper surface of the board, avoiding any air entrapment whatsoever. From a physical standpoint, this can only be correctly performed in the moment that the resin reaches the contact point, in a very fluid/gel like status. The high pressure of hot lamination rolls and a sufficient temperature of the board surface, contributes to a successful lamination process. Pits and scratches on the copper surface can then be totally filled with dry-film as shown in below figure.

Manual laminators are very close to this ideal lamination condition, since in these machines, the dry-film envelops the hot roll for more than a 1/4 of its circumference, maintaining heat and becoming gel like before coming into contact with the board surface. But generally, in the conventional process, boards are not preheated and therefore, the result is not perfect. Refer below figure

FEATURES

• Very high productivity/quality
• Tacking and cutting on flight (no stop process)
• Lamination rolls vibration
• Very high lamination pressure
• Adjustable dry-film preheating
• Excellent board preheating
• High lamination speed
• Suitable for inner layer and rigid board

Especially for the final curing of photo imageable soldermask in the worldwide shortes curing time of about 4 minutes.

Two installations in production prove the quality of the polymerisation of the soldermask

The secret of the super fast final curing process is a unique 2-step-process.

The lead time could be reduced from 60-90 minutes to about 4 minutes, i.e.

Short lead time for a fast delivery

• low energy cost per board
• low requirement of production area
• fully automatic process
• newest PLC-control with touch screen operation
• no condensation residues in the heating chamber
• capacity increase possible at any time by adding heating modules
• scaled cost of equipment due to modular construction

Low-pressure plasma

The innovative surface-treatment technology

Clean, reliable

Surface cleaning in industry is important for improving coating adhesion.

Conventional cleaning methods very quickly reach the limits of their capability and, following wet-chemical cleaning, detergent traces are still found on the surface and even after thorough rinsing and drying are not completely removed.

Low-pressure plasma cleaning results in surfaces with zero contamination. Treatment cycles of only a few minutes produce outstanding results with no surface residues.

Low-pressure plasma possesses excellent crack penetration. Even intricately shaped parts are perfectly cleaned since the gas readily penetrates minute gaps inaccessible to liquids

The decisive factor in the plasma cleaning process is the formation of gaseous and hence volatile products. The plasma constituents react with the organic contaminants and disintegrate into water and carbon dioxide even at room temperature (-CH2-CH2-)n + 3n O2 " 2n CO2 + 2n H2O

The reaction products are gaseous and hence easily removable from the reaction chamber.

The EdgeCut is incredibly quick, up to 60% faster than the manual methods of de-burring boards. It eliminates inferior and sub-standard results caused by filing or linishing.

The EdgeCutdeburrs frame centralising lugs in one pass, leaving a high quality routed edge with no need for futher inspection. The EdgeCut gives the operator total control of depth of cut with its unique micro adjuster and dial indicator.

The BevelCut eliminates the inaccuracies in PCB board edge bevelling. The uniqe depth adjustment and variable angle system (between 20 degree and 45 degree) ensures perfect results on every panel. The high speed bevelling tool seamlessly chamfers the most delicate boards without lifting or burring intricate tracking such as gold fingers.

The hardened and ground positioning table incorporates the extraction chamber for effective exhaust of dust.

Tab Cut

Unlike other de-panelling processes which use croppers to free the panel from the scrap (often causing edge de-lamination, component failure or even worse intermittent circuit faults), this process uses high speed routers to precisely remove the webs causing no stress to either the board or components and leaves the cut undetectable.

The machine uses a series of adjustable pins, which locate in the slots to ensure the tabs are removed accurately to either populated or unpopulated boards.

The new mark II version is easier to use than its predecessor. It now comes in its own mobile, purpose-built cabinet with fully interlocked safety switches and built in hepa-filtered extraction with bagged waste disposal.

Wet processing brushing machine for

METAL SURFACE TREATMENT

DEBURRING OF SHARP CORNERS, HOLE EDGES AND IRREGULAR PERIMETERS

Main features

• Vertical axis rotating and oscillating brushes
• No holes ovalization
• Control by PLC complete with touch screen
• Settable brush abrasion
• Automatic autozero procedure
• Adjustable brush speed
• Adjustable belt conveyor speed
• Different brush grits combinations are possible to perform different surface treatments

PCB CNC Scoring Machines

RM 650 CNC Scoring machine with numerically controlled 2 Z- Axis each with individual control

• Skipping device
• More than 8000 score program storage capacity.
• 200 cuts can be programmed
• PCB Thickness from .5 mm to 3.2 mm
• CNC Controlled
• Possible to process FR-2, FR-4, polyamides, Green Ceramics.

Reverse-engineering of boards and data Produce PCB fabrication Gerber and drill files from bare boards and / or artwork for PCB design and Legacy re engineering applications. Re-engineering application.

ScanCAD has been offering PCB Re-Engineering systems to the marketplace since 1990 and our systems are the leading systems in the world. We offer the only system that can generate all the Gerber data and Drill data to re-manufacture a PCB to the same Form, Fit and Function as the original PCB which eliminates the need for costly and time consuming testing and re-certification. In addition, we also offer additional software modules which can take the data back to schematic or into a CAD package for re-design

ScanFAB

ScanFAB is a flatbed scanner based re-engineering system that has the capability of scanning PCB's, film, stencils, etc and producing the Gerber data and Drill files necessary to manufacture the PCB. It also contains a full Gerber editor that can be used to modify the Gerber data as necessary

The high resolution scanner included with the system is calibrated with a NIST traceable glass plate ensuring an accurate image of the scanned film, stencil or PCB. The color scanning capability of the scanner and the powerful color separation software algorithms in the system permit the fast and easy color separation of images needed to vectorize multilayer PCBs. The system also includes some powerful raster filter, clean up and editing features to help massage the raster data prior to vectorization.

The full FAB product has all of the powerful vectorization functions that have made ScanCAD successful for the past 25 years. The resulting Gerber X data file sets the quality standard in the industry and is the reason why ScanFAB is the most successful and widely used PCB re-engineering system in the world today

Fully integrated, stand alone workstation

PC-based software integrated with a high-resolution, calibrated image processing unit

Reverse-engineering of boards and data

FLYING PROBE TESTER

ScanINSPECT FPT is a flying probe electrical tester suitable for fixture-less bare PCBs. It can also be used in combination with a grid tester for fault verification or to test nets exceeding test points of a grid tester

ScanINSPECT FPT is capable of performing electrical tests on PCBs in many situations such as:

• Prototypes
• Samples
• Small volume production
• Determination of golden board
• Combination test with a grid tester
• Fault verification

A PCB is tested against a netlist without the need for fixtures. Hence, test can commence immediately after PCB production

AUTOMATIC STENCIL CLEANERS

The Model 6000 Stencil & Pallet Cleaner is the "work horse" of the Smart Sonic Line of ultrasonic stencil cleaners. The Model 6000 is fully automatic and programmable. The operator simply places the stencil in the carrier basket and selects the desired cleaning profile. A 29" (740 mm) stencil can be washed and rinsed in less than 2 minutes! The Model 6000 is a modular design and can be configured with a second ultrasonic wash tank for cleaning other applications such as post solder flux from pallets, oven radiators and/or SMD adhesives. Or, the module may be configured with an automatic temperature controlled dryer. The Model 6000 is recommended for users requiring rapid cycle time for cleaning more than 20 stencils per day, automatic drying, or for cleaning multiple applications in the same machine.

The ErgoSonic Model Stencil & Pallet Cleaner is fully automatic and programmable. The operator loads the stencil into an empty chamber and selects the desired cleaning profile. The wash solution is uploaded to the wash chamber from a built-in reservoir and down loaded through a filtration system to the same reservoir after the wash cycle. The stencil is then spray rinsed and the cycle is complete. The total wash / rinse cycle time is approximately 10 minutes. The stencil is then removed and placed in the optional drying rack. Stencils are heat-sensitive and should NOT be dried using elevated temperatures. The ErgoSonic Stencil Cleaner is recommended for users desiring full automation and cleaning less than 20 stencils and/or pallets per day.

SEMI-AUTOMATIC STENCIL CLEANERS

It is important to note that Smart Sonic's semi-automatic stencil cleaners (500, 1500 and 2003 series) will clean just as fast and effectively as the fully automatic systems. This is because the process remains the same. The automatic and semi-automatic systems use the same chemistry and ultrasonic technology. While the 6000 and ErgoSonic models offer more automation and convenience, the Semi-automatic models do not sacrifice quality or efficiency.

The Model 1550 Stencil & Pallet Cleaner is our most popular semi-automatic system. It is designed to clean stencils up to 29" x 29" (740 x 740 mm) and fully equipped with the following integrated options:

• Heated Wash Tank
• Filter Recirculator
• Ultrasonic Timer
• Parts Basket
• Wash Tank Cover
• Hand Held Spray Rinse Assembly
• Power Drain
• Quick Kleen Liner
• Hand Held Air Blow-off

For those not requiring all options, the Model 1500 may be configured with specific options to suit specific applications.