Scantech Laser Pvt. Ltd.

Mumbai, Maharashtra

UV Laser wavelength ranges from 235 nm to 400 nm. Diode, DPSS or Nd:YAG laser are the commonly used laser to generate 1064 nm wavelength, it is than converted to Ultra Violet wavelength through third harmonic generator. It features precise temperature controller which is one of the critical part of UV laser. UV laser is colder wavelength compared to other wavelength which reduces overheating while processing as its absorption ratio on material is higher even at lesser power.UV Laser is highly used in Holographic, Bio-engineering, Photo Lithography, Tablet Printing, Fine Marking on Plastics & Metals, Nitinol Cutting and several other micro processing applications.

Features

• Phenomenal Beam Parameter Product (BPP)
• Steady BPP Over Entire Power Range
• Higher Wall-Plug Efficiency
• Maintenance Free Operation
• Easy 'Plug and Play' Design
• Extremely Compact and Easy to Install
• Higher Diode MTBF Life
• Allows Processing of Highly Reflective Materials
• High Photon Conversion Efficiency
• Higher Flexibility of Beam Delivery

Features

• High absorption rate for common processing materials
• Longer Rayleigh length for thicker materials
• Quick material processing capabilities
• Resolution is acceptable with shorter focal length
• Cost Effective & economical for various industries

Features

• Entire spectrum from UV to IR
• High peak power pulses thus quicker processing of thin materials
• Short pulse durations
• Fast repetition rates
• No temperature build up high temperature processing on low temperature substrates
• High throughput
• Stackable optical modules allow larger exposure areas
• Non-toxic (no Hg)
• High DPI capabilities
• Great for applications that need high power density (Metal Marking)
• Can be Q-Switched for pulsed or CW operation. (Allows for minor laser ablation)

Features

• High marking speed
• Excellent beam quality
• Pulse-to- pulse stability
• Power stability and low noise
• Low operating costs
• Useful for micro and marking applications

ProCut series includes high precision small size laser cutting machine for metal & non-metals. Laser cutting table is made of rigid steel structure for vibration free cutting. ProCut can is fixed with high accuracy servo or linear motor with optical encoders of high resolution for highest accuracy. Auto focus cutting head developed by Scantech Laser for precision cutting and it is an important aspect for optimal cutting. ProCut range of products variants of different laser wavelength like Fiber, CO2 & YAG laser power varies from 50W to 500W. ProCut series is compact in size with extremely less foot print area compared to conventional cutting machine.ProCut series of high accuracy laser cutting machines are highly used for applications like fine precious metal cutting, glass cutting, fabric cutting, Ceramic slicing, medical component making, nitinol cutting, stent cutting, Prototype Model Making etc

Scantech's Solar Cell Laser Scribing Machine Scribo is capable of scribing various materials like ceramic wafer, silicon wafer, solar etc., with its use spanning in industries like electronics, semiconductor and solar energy. It enables ultra-narrow c-Si solar cell line scribing. The edge isolation provided minimizes the sub-surface damages such as micro-cracking. Its auto focus system directs laser pulses around the perimeter of cells, scribing narrow grooves between the finger grid and the cell edges.

A non-contact process through which a laser creates a single weld to spot weld metal pieces together. Due to the keyhole effect when the beam is focused at a spot it vaporizes and melts the metal in the target area and once the laser retracts the liquefied metal flows into the dent and solidifies creating a spot weld.

Features

• 24-hr continuous operation
• Grooved output is ready for fracturing
• Fracturing set
• Customized control software
• Time sharing & Energy sharing equipment
• Pilot beam
• Versatile range available
• Machine driven Grooving head
• Maintenance free
• No consumable
• Optimized Size
• Comprehensive functions

Features

• Environmental friendly
• No Wastage
• Does not affect the base material
• Quick evacuation of Grease, epoxy, paints, dust, rust etc.
• Easy to carry
• Maintenance free
• Direct cleaning at site
• No pre-treatment required
• Compatible PC mounted on board
• No additive material
• Convenient to operate in remote location

Features

• Standalone marking station for Industrial Purpose
• Pilot Beam
• Class 1 Certification
• Class 4 Certification
• Easy changeover of lens to achieve different size marking areas
• Protection window for radiation protection
• Offline Marking
• Wi-Fi Controlled Marking
• High-precision vertical up & down working table
• Appropriate for Marking, etching, tempering, removing, engraving, deep engraving applications
• User interface for direct marking on the fly application
• Provision for rotary marking
• Programmed to mark on moving parts on high speed

we provide tablet drilling machine that is used to drill holes in the tablet for controlling the release of drug. We offer tablet drilling machine with automatic feeding system and color sensors to sense the drilling side and rejection chute. Whole size of our tablet drilling machine can be used to release the drug using osmosis technique. Moreover, tablet drilling machine can also be customized as per requirement of the customers. working description of tablet drilling machine for dual beam systems

• works as the rotating disk
• capable to convey tablet from the hopper vibratory stand alone with tablet dispensing on to inclined disk to the laser drilling station
• at drilling station, drilling of tablet coating will take place
• specially built custom electronics will decide which laser to be fired
• a highly reliable color sensor can differentiate between the contrasts of a bilayer tablets two sides
• sensor is placed just 1 index before the laser drilling location
• laser fire sensor is constantly looking for any reflection from the tablet of the irradiating laser pulse
• laser pulses are also very closely located in the vicinity of laser beam delivery lenses
• a positive decision is made by the controlling electronics as whether a particular tablet has been drilled either from side a or side b
• if no drilling has taken place, then an irradiating pressure pulse undrilled tablet falls back in to the recirculation via reject chute
• drilled tablets are removed
• nozzle, with the help of pressure pulse in to the production bin
• production is counted automatically
• why our tablet drilling machine?
  • precision engineered machine
  • high performance
  • highly efficient
  • less consumption of energy
  • .