Thickness of 0.2 to 3.2mm (with finished copper of 3 oz for outer layers and 2oz for inner layers) Line width and spacing of 6 6 mils (sample lots 55mils) Minimum finished hole size of 0.3mm Surface finish of Solder leveling Lead free hot air leveling Chemical Tin Chemical Gold.

Thickness of 0.2 to 3.2mm (with finished copper of 3 oz for outer layers and 2oz for inner layers)

Line width and spacing of 6 / 6 mils (sample lots 5/5mils)

Minimum finished hole size of 0.3mm

Surface finish of Solder leveling / Lead free hot air leveling / Chemical Tin / Chemical Gold.

temDescription1.Layer1- 2 Layers 2.MaterialAluminum Copper BasedManufacturerXimai (China) ; Bergquist (USA)3.Final Thickness0.02" - 0.18" (0.5mm- 4.6mm) tg130 - tg170

PCBsmade from FR2, CEM1 and FR4 laminates, meeting requirements of Automotive andentertainmentsectors.

Thickness of 0.2 to 3.2mm (with finish copper of 2 oz) Line width and spacing of 6 / 6 mils Minimum drilled hole of 0.35mm Minimum punched hole of 0.9mm Finish of UVSM / PISM with lead and lead free hot air leveling.

We have world class work place in Gujarat with highly qualified Engineers to develop PCBs design for following industries: - Power Supply and Transmission- Industrial Automation- Industrial Electronics- Aerospace and Defense- Railways and Telecom

We have state of the art production facility in Gandhinagar, Gujarat. Ronak Circuits is one of the best PCB manufacturer in Gujarat. Our plant is very near to Ahmedabad. We have best capabilities and expertise in delivering high end quality work. We are having expertise of more than 10 years in this industry which give us competitiveness, high tolerance, high flexibility, high quality work delivery to large volume work as well as small to medium volume production quantities.

PCBs made from CEM3 and FR4 laminates catering to Automotive, Energy, Peripherals, Industrial Automation sectors.

Thickness of 0.2 to 3.2mm (with finish copper of 3 oz) Line width and spacing of 6 / 6 mils (sample lots 5/5mils) Minimum finished hole size of 0.3mm Surface finish of Solder leveling / Lead free hot air leveling / Chemical Tin / Chemical Gold.

Thickness of 0.2 to 3.2mm (with finished copper of 3 oz for outer layers and 2oz for inner layers) Line width and spacing of 6 6 mils (sample lots 55mils) Minimum finished hole size of 0.3mm Surface finish of Solder leveling Lead free hot air leveling Chemical Tin Chemical Gold.

Thickness of 0.2 to 3.2mm (with finished copper of 3 oz for outer layers and 2oz for inner layers)

Line width and spacing of 6 / 6 mils (sample lots 5/5mils)

Minimum finished hole size of 0.3mm

Surface finish of Solder leveling / Lead free hot air leveling / Chemical Tin / Chemical Gold.

temDescription1.Layer1- 2 Layers 2.MaterialAluminum Copper BasedManufacturerXimai (China) ; Bergquist (USA)3.Final Thickness0.02" - 0.18" (0.5mm- 4.6mm) tg130 - tg170

PCBsmade from FR2, CEM1 and FR4 laminates, meeting requirements of Automotive andentertainmentsectors.

Thickness of 0.2 to 3.2mm (with finish copper of 2 oz) Line width and spacing of 6 / 6 mils Minimum drilled hole of 0.35mm Minimum punched hole of 0.9mm Finish of UVSM / PISM with lead and lead free hot air leveling.

We have world class work place in Gujarat with highly qualified Engineers to develop PCBs design for following industries: - Power Supply and Transmission- Industrial Automation- Industrial Electronics- Aerospace and Defense- Railways and Telecom

We have state of the art production facility in Gandhinagar, Gujarat. Ronak Circuits is one of the best PCB manufacturer in Gujarat. Our plant is very near to Ahmedabad. We have best capabilities and expertise in delivering high end quality work. We are having expertise of more than 10 years in this industry which give us competitiveness, high tolerance, high flexibility, high quality work delivery to large volume work as well as small to medium volume production quantities.

PCBs made from CEM3 and FR4 laminates catering to Automotive, Energy, Peripherals, Industrial Automation sectors.

Thickness of 0.2 to 3.2mm (with finish copper of 3 oz) Line width and spacing of 6 / 6 mils (sample lots 5/5mils) Minimum finished hole size of 0.3mm Surface finish of Solder leveling / Lead free hot air leveling / Chemical Tin / Chemical Gold.