The silver conductive paste has many uses. It is primarily used as a solder replacement for bonding heat-sensitive electronic components. It allows for quick cold soldering repairs, and is effective at bonding heat sinks to other components and PCBs. It also provides excellent EMIRFI shielding, and is very effective at filling in seems between metal plates. Its primary applications are repair and assembly of electronics in microelectronics and optoelectronics. It is used in the automobile, aerospace, marine communication, instrumentation, and industrial control equipment industries. The Silver Conductive Adhesive: Moderate Cure is an economical electronic epoxy with good electrical and thermal conductivities. This adhesive bonds very well to a variety of surfaces. It has a convenient 1-to-1 ratio, a workable ten minutes pot life, and a moderate curing rate. It achieves an operational level in five hours at room temperature. With heat, the silver conductive cures in less than 15 minutes and maximizes its conductivity. The cured adhesive bonds very well to most substrates used in electronic assemblies; resists thermal and mechanical shocks; and provides the low resistivity needed for many operating conditions. The silver epoxy adhesive is great for forming conductivity seals, bonding, and repairing of electronic devices. Good 0.017 �©�·cm electrical resistivity and 0.90 W(m�·K) thermal conductivity Adheres to most electronic substrates and very