Memsstar’s XERIC dry release etch process module is available using vapor Hydrogen Fluoride (HF) andXenon DiFluoride (XeF2) chemistries. Offers solutions for commercial R&D through to full-scale high volume manufacturing. XERIC Etch process module offers the strongest approach to effectively releasing MEMS structures from the sacrificial layer, while eliminating the problems associated with alternative approaches, including stiction, incompatible and poorly controlled wet chemistries, poor control and monitoring of stagnant gas systems, and multiplicity of unit
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