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UZ – 35/03 Lead Free Solder Paste

UZ – 35/03 Lead Free Solder Paste

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Melting Point172°C
FeaturesModerate temperature, high cost performance.
Powder Shape≥95 %
AlloySn64.7-Bi35-Ag0.3
Flux Content11.5±1%
Supply TypeExporter, Supplier
Preferred Buyer Location All over the world

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Company Information

Aarkay Associate

Shastri Puram, Agra, Uttar Pradesh

Member Since 8 Years
Nature of Business Retailer
GST No. 09AAEFA2539A1ZY

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Product Details

Melting Point172°C
AlloySn64.7-Bi35-Ag0.3
Flux Content11.5±1%
Powder Shape≥95 %
FeaturesModerate temperature, high cost performance.

Details

Good Printing and rolling performance and leak printing performance even
the spacing of solder pad is low to 0.4mm , can also complete a exquisite
printing .
Can complete continuous printing for a long time almost without collapse
after printing for a few hours small viscosity change SMD Components are
not easyto move.
Excellent soldering performance can complete a good wetting in different
parts
Less residue after soldering transparent appearance high insulation
resistance do not corrode the PCB and meet the disposable requirement.
Better ICT Test performance will not appear the false judgement.

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Seller Contact Details

SellerAarkay Associate
Address Shastri Puram, Agra, Uttar Pradesh

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