The machine is used in cutting,opening the window and uncovery for CVLFPCRF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc. Features: Precision：Adopting linear motor module，Servo control,sizing compensation,optical positioning and secondary positioning technologies. High quality: little carbonization; high density graphics cutting. Highly intelligent、efficient：With multi-panels cutting、auto-positioning、auto-correcting、automatic sizing compensation and exclusive cutting previews functions.