Thin film circuit metallization schemes at HHV are deposited by magnetron sputtering method and the deposited metal layers show excellent adhesion compared to other non vacuum deposition methods.These metallization schemes start with abonding layer of TiW or Cr and a conductive layer of Au Cu on the ceramic substrates.
Member Since 8 Years
Nature of Business Retailer
For Buyer 
For Seller 
Help 
Peenya, Bangalore, Karnataka