Solder Paste

SH-6209

PAI tin/lead/silver no-clean solder pastes are made from a special formulation of highest purity ingredients to ensure the process consistency of today’s demanding ultra-fine-pitch challenges. Our formulation offers a wide processing window and excellent shelf life, with full wetting and clean-ability features to prolong stencil life.

SH-6209  is a Sn62Ag2Pb36 alloy with Type 3 & Type 4  and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.

• High print speed (0-120 mm/sec)
• Excellent wettability
• Reflow with or without nitrogen
• Low void
• Over 8 hours stencil life
• Extended tack time > 12 hours

Download – Technical Data Sheet