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Contact SupplierItem :- | Interconnect (Tin –Lead-Silver-62:36:2) - 3BB |
Width :- | 1.7 ± 0.1mm |
Thickness :- | 0.13 ± 0.01 mm (basic copper thickness) |
Material :- | Electrolytic tough pitched (ETP) copper as per IS: 191-1980 |
Surface Finish :- |
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Camber :- | <5mm/meter |
Functional Requirement:- | Required to be attached to silicon solar cells by soldering |
Packing & Marking :- |
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Inspection :- |
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Item :- | Interconnect (Tin –Lead-Silver-62:36:2) - 4BB |
Width :- | 1.3 ± 0.1mm |
Thickness :- | 0.13 ± 0.01 mm (basic copper thickness) |
Material :- | Electrolytic tough pitched (ETP) copper as per IS: 191-1980 |
Surface Finish :- |
|
Camber :- | <5mm/meter |
Functional Requirement:- | Required to be attached to silicon solar cells by soldering |
Packing & Marking :- |
|
Inspection :- |
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