The trend in miniaturization in the telecommunications industry and PCB manufacturing has created the need for ever-smaller RF interconnectors. However, visual alignment is more difficult than with larger components, often resulting in assembly errors during manufacturing. Small components are also more prone to damage: A large connector can tolerate “forced” alignment, but subminiatures call for engineered solutions.
SMP-MAX 50 Ohm Board-to-Board RF Connectors employ patented technology to increase misalignment tolerances for simple and reliable connections, even in blind-mate applications. In turn, the extra misalignment headroom ensures the SMP-MAX Connectors are less prone to damage and simplify design requirements.

The trend in miniaturization in the telecommunications industry and PCB manufacturing has created the need for ever-smaller RF interconnectors. However, visual alignment is more difficult than with larger components, often resulting in assembly errors during manufacturing. Small components are also more prone to damage: A large connector can tolerate “forced” alignment, but subminiatures call for engineered solutions.
SMP-MAX 50 Ohm Board-to-Board RF Connectors employ patented technology to increase misalignment tolerances for simple and reliable connections, even in blind-mate applications. In turn, the extra misalignment headroom ensures the SMP-MAX Connectors are less prone to damage and simplify design requirements.