Plating Thickness Testing Machine

We Offer Plating thickness testing machine.
Thick 800 is tailor made for rapid and non-destructive detection of plating thickness and elemental content in large size devices. Thick 800 adopts the top lightening structure, 3-D movable sample platform and laser positioning system, which enables the possibility of the point by point detection of plating thickness and elemental content on large size parts. Thick 800 is equipped with top lightening structure, 3-D movable sample platform, double laser positioning system and open sample chamber. The up and down movable glass shield cap helps prevent the leakage of X-rays. Thick 800 has the state-of-the-art outlook, structure and color design. A set of functional software is also fully supplied.
Specification :
Analysis Range: (K)~(U)
Many layers can be analyzed at a time.
The detection limit of thickness can reach 0.01 µm
More than five plating layers can be analyzed simultaneously.
Independent matrix effect correction models: most.
Advanced thickness analysis method.
Repeatability is up to 0.01µm
Stability is lower than 0.01µm
Ambient Temperature: 15-30°C
Input voltage: 220 ±5V50Hz (AC purified regulation power supply is suggested)