MediSpec LDS Capabilities 3D Circuitry

Molex combines advanced MID technology with LDS antenna expertise to deliver integrated fine-pitch 3D circuitry with shielding in a single molded device for high-density medical devices and other applications
This capability combines the versatility of the two-shot molding process for MID, with the speed and precision of Laser Direct Structuring (LDS) technology to create compact, high-density medical applications that meet required medical-grade, electronic device guidelines. LDS allows micro-line electronic circuitry to be imaged onto a variety of RoHS-compliant molded plastics using a 3-axis laser with the added flexibility of making pattern changes. Lines and spaces down to 0.10 mm and circuitry pitch down to 0.35mm are possible in high-volume. A host of other multi-function features including laser-drill via holes, switch pads, sensors, or even antennas, can be added if needed.