HandyLink I/O Interconnect System

Listing ID #3240104

The HandyLink™ interconnect product family from Molex includes a right-angle SMT receptacle, wire and PCB version plugs, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies.
An innovative compression-style contact design provides long-term performance and reliability that supports mating cycles up to 15,000. The compact size and continuous current-carrying capability of 1.5 to 3.0A depending on circuit configuration, provides an optimal solution for the mobile device industry. The patented integrated-latch design provides optimal Electrostatic Discharge (ESD) protection and mechanical integrity.