The LGG is designed to grind and regroove the wire guides from slurry wafering saws or diamond wire saws to any pitch size. Detailed Specs The machine is designed to regrind OD and regroove the wire guides from e. g. Logomatic (Diamond Multi Wire Saw), Linton, HCT, Meyer+Burger, Themis, NTC-Japan, Toyo and Takatory and all other slurry or diamond wire saws, which need refurbishing of wire guide rolls. This machine can grind OD sizes from 2 – 13 inches (50-350 mm), with high precision pitch for a length from 100 – 1000 mm.
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HSR Layout, Bangalore, Karnataka