Fiber Silicon Wafer Laser Scribing Machine

Backed by our in-depth industry expertise, we offer a qualitative range of Fiber Silicon Wafer Laser Scribing Machine to our clients at reasonable prices. These Fiber Silicon Wafer Laser Scribing Machines are capable of scribing cutting various silicon wafer, solar cell and ceramic wafer. It is also capable of scribing cutting thin metal sheet (~0.5 mm thick maximum). We also meet the bulk demand of pour clients within the committed time frame.
Features
Excellent beam quality and system reliability
High-speed scribing (up to 300 mms), very low-defective index
Compact design, dual protective systems
Precise CNC worktable
Friendly man-machine interface and simple software operation