Molexs DDR4 DIMM sockets feature high dimensional stability and excellent compatibility in lead-free and halogen-free technologies. The use of less moisture-sensitive, high-temperature housing material minimizes the incidence of blistering on the connector housing and enables the sockets to withstand high IR or reflow processing temperatures. Reduced yield losses during assembly processes increase customer cost savings. Additionally, DDR4 features key capabilities that support up to three unique module variations across all DIMM form factors. These include *UDIMMs, RDIMMs and LRDIMMs.
The Press-fit DDR4 DIMM socket offers benefits of lower cost of operation (clean, solderless process); elimination of added heat-cycle that can cause stress to the PCB or degrade electronic components; ease-of application and connection-failure traceability, rework and termination quality inspection; repair capability and more.
With a 1.10mm seating plane, Molex’s soon-to-be-released ultra-low-profile DDR4 DIMM socket maximizes vertical space and power savings for ATCA* blade systems and other networking devices requiring high-speed, high-density memory modules.

Molexs DDR4 DIMM sockets feature high dimensional stability and excellent compatibility in lead-free and halogen-free technologies. The use of less moisture-sensitive, high-temperature housing material minimizes the incidence of blistering on the connector housing and enables the sockets to withstand high IR or reflow processing temperatures. Reduced yield losses during assembly processes increase customer cost savings. Additionally, DDR4 features key capabilities that support up to three unique module variations across all DIMM form factors. These include *UDIMMs, RDIMMs and LRDIMMs.
The Press-fit DDR4 DIMM socket offers benefits of lower cost of operation (clean, solderless process); elimination of added heat-cycle that can cause stress to the PCB or degrade electronic components; ease-of application and connection-failure traceability, rework and termination quality inspection; repair capability and more.
With a 1.10mm seating plane, Molex’s soon-to-be-released ultra-low-profile DDR4 DIMM socket maximizes vertical space and power savings for ATCA* blade systems and other networking devices requiring high-speed, high-density memory modules.