Company Information
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Contact SupplierWe are here to guide our clients with the secure payment procedures. With us, the customers get convenience to pay through both online and offline payment methods Only quality packaging material has been used for the packing of the products that we offer. Moreover, the entire packaging procedure is conducted under the supervision of the experts.
General Information:
Base Material: OFHC, Tungsten Copper, GLIDCOP, Molybdenum
With BeO substrate: W85Cu15+BeO, W85Cu15+BeO+Mo, OHFC+Mo+BeO+Mo
Pin Material: Copper-cored Kovar, ZrCu
Manufacturing Standard:
Complied with MIL-PRF-19500, MIL-STD-883 and screenedtested per MIL-PRF-38354
Performance and Reliability:
Hermeticity: ≤1X10-8 ATM(He) ccSec
Isolation Resistance: ≥109Ω
Temperature Cycle: -65-+175 500 times