BURN IN TEST OVEN

Burn-in ovens are engineered for applications such as high dissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of IC, RAM, ROM, microprocessors and other semiconductor devices.

Integrated Circuits (IC’s) and other electronic devices are burned in at elevated temperatures to stress and exercise the devices under test. The high temperatures force early failure, known as “infant mortality”, at this point rather than later when they are in use in a finished product. This dramatically improves the reliability of the product. During burn-in the temperature rises as the air travels across the chamber due to the heat dissipated by the devices. High volume recirculation fans maintain consistent, uniform temperatures.