PAM-4 (pluggable authentication module) signaling is the latest development in serial data signal formats. PAM-4 overcomes the challenges of NRZ signaling. However, implementation of PAM-4 requires an exceptionally low signal-to-noise ratio. BiPass™ IO and Backplane Assemblies use thin twinax cables that increase signal integrity and improve thermal management. BiPass Assemblies dramatically reduce insertion loss between the ASIC and the front panel IO, thus enabling the successful implementation of 56Gb PAM-4 and a technology path to 112Gb PAM-4 and 56Gb NRZ. In addition, BiPass Assemblies allow for significantly improved air flow and thermal management, which become critical at higher data rates and power dissipation needs.
System architects need agility to meet rapidly evolving demands. BiPass Assemblies are a complete solution that offers an integrated, one-piece design and board-mount connectors for easy installation.
As capability demands on data centers increase, space constraints in trays and panels also increase. BiPass Assemblies use near-ASIC connectors with low stack height for a smaller footprint within trays.

PAM-4 (pluggable authentication module) signaling is the latest development in serial data signal formats. PAM-4 overcomes the challenges of NRZ signaling. However, implementation of PAM-4 requires an exceptionally low signal-to-noise ratio. BiPass™ IO and Backplane Assemblies use thin twinax cables that increase signal integrity and improve thermal management. BiPass Assemblies dramatically reduce insertion loss between the ASIC and the front panel IO, thus enabling the successful implementation of 56Gb PAM-4 and a technology path to 112Gb PAM-4 and 56Gb NRZ. In addition, BiPass Assemblies allow for significantly improved air flow and thermal management, which become critical at higher data rates and power dissipation needs.
System architects need agility to meet rapidly evolving demands. BiPass Assemblies are a complete solution that offers an integrated, one-piece design and board-mount connectors for easy installation.
As capability demands on data centers increase, space constraints in trays and panels also increase. BiPass Assemblies use near-ASIC connectors with low stack height for a smaller footprint within trays.