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    3D SOLDER PASTE INSPECTION

    • Supply TypeManufacturer, Exporter, Supplier, Retailer
    • Preferred Buyer Location All over the world

    The VP5200-V uses a highly accurate and repeatable, true 3D image acquisitions using Phase shift technology to perform complete PCB solder paste analysis. Potential PCB warpage is calculated at each inspection area and the camera will auto-focus to compensate prior to analysis. These features combine to achieve precise volume measurements at accuracy within three percent.
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    Company Information

    • calendar Member Since 16 Years
    • building Nature of Business Retailer

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