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Contact SupplierDDR3, an established DDR DRAM interface technology supports data rates of 800 to 1600 Mbps with clock frequencies of 400 to 800 MHz; double that of DDR2. With a standard operating voltage of 1.5V, DDR3 cuts power consumption of DDR2 by 30%.
Molex offers low-profile and very-low-profile SMT and press-fit Aerodynamic DDR3 DIMM sockets that maximize air flow around memory modules during operation. With a 2.40mm seating plane, these sockets enable the use of very low-profile modules with maximum seating heights below 2.80mm, in ATCA* blade systems. Press-fit sockets feature smaller eye-of-needle compliant pins that increase trace-routing density between holes on the PCB for greater PCB real estate savings. SMT versions are halogen-free and lead-free. The sockets 10 milliohms low-level contact resistance make them excellent for power savings, especially in blade systems.
Molex offers ultra-low-profile DDR3 DIMM sockets with 1.10mm seating plane with low-level contact resistance of 10 milliohms. These sockets provide optimum design flexibility by allowing the use of very low-profile memory modules with maximum seating heights below 2.80mm in ATCA blade systems.