Our offered Product range includes Power Mosfet Transistor, rf power amplifier, 35 V Electrolytic Capacitor, Hyperfast Diode and Microprocessor IC Chip.
FeaturesHeat transfer through aluminium oxide ceramic isolated metal baseplate, Hard soldered joints for high reliability, UL recognized, file no. E 63 532
FeaturesTarget Applications, Glass passivated silicon chips, Low thermal impedance through use of direct copper bonded aluminum substrate (DCB) base plate