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Navank Consultants Noida, Uttar Pradesh

Noida, Uttar Pradesh, India
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Our Products

  1. Tapes 5 Products available
  2. Plastic Film

    2 Products available
  3. Yarn

    1 Products available
  4. Packaging Foils & Films

    1 Products available
  5. Insulated Cable

    1 Products available
  6. Chocolate Snack

    1 Products available
  7. Solar Cell

    1 Products available
  8. Electrical Panels & Distribution Box

    1 Products available
  9. Adhesives

    1 Products available
  10. Beams And Girders

    1 Products available
  11. Others Products 3 Products available

Other Products / Services #5587612

We offer the best product range of Solar Interconnect Ribbon, Solar Bus Bar and Solar Back Sheet.

Solar Cell

  • Solar Cell (3BB,4BB) :- 156±1mm (side to side)
  • Arc Glass :- L1960*W980*3.2mm
  • Solar interconnect ribbon :- 0.13*1.7mm 62:36:2 3BB , 0.13*1.3mm 62:36:2 4BB
  • Solar Bus bar :- 0.3*5.0mm 62:36:2
  • Junction Box :- 300w, 90cm cable, MC4 connector with TUV certificate
  • Solar Silicon Adhesive :- TUV UL Certificate , 25Kg/barrel
  • Solar EVA Film (Width 1000mm) :- L1500*W1000*0.45mm= 150sqm
  • Back sheet (Width 990mm) :- L1000*W1000*0.3mm=100sqm
  • Aluminum Frame :- 1966*986*40mm

A solar cell, or photovoltaic cell (previously termed "solar battery"[1]), is an electrical device that converts the energy of light directly into electricity by the photovoltaic effect, which is a physical and chemical phenomenon.[2]It is a form of photoelectric cell, defined as a device whose electrical characteristics, such as current, voltage, or resistance, vary when exposed to light.

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Solar Interconnect Ribbon

Interconnect ribbon is a hot dip tinned copper conductor installed in photovoltaic/solar panels. The interconnect ribbon is soldered directly onto silicon crystal to interconnect solar cells in a solar panel. The interconnect ribboncarries the current generated in solar cells to the PV bus bar.

Item :- Interconnect (Tin –Lead-Silver-62:36:2) - 3BB
Width :- 1.7 ± 0.1mm
Thickness :- 0.13 ± 0.01 mm (basic copper thickness)
Material :- Electrolytic tough pitched (ETP) copper as per IS: 191-1980
Surface Finish :-
  1. Coating -
    • Coated with 62:36:2 tin-lead-silver solder
    • Coating thickness 16-25microns on each side
    • Uniform &bright coating, good adhesion on either side
  2. Mechanical - natural rounded edges coated all round
Camber :- <5mm/meter
Functional Requirement:- Required to be attached to silicon solar cells by soldering
Packing & Marking :-
  1. To be supplied in spools
  2. To be labeled on the packing consignment
    Interconnect tin lead silver 62:36:2
    Dimensions: 1.7x 0.13mm
    Coating: 16 to 25microns
    Mfd. Month/year
Inspection :-
  1. Visual inspection, dimensional &properties evaluation
  2. Single sampling plan as per IS- 10673-1983, special inspection level S- 4, AQL- 1.0.
INTERCONNECT (TIN –LEAD-SILVER-62:36:2) - 4 BUS BAR PRODUCT SPECIFICATIONS

 

Item :- Interconnect (Tin –Lead-Silver-62:36:2) - 4BB
Width :- 1.3 ± 0.1mm
Thickness :- 0.13 ± 0.01 mm (basic copper thickness)
Material :- Electrolytic tough pitched (ETP) copper as per IS: 191-1980
Surface Finish :-
  1. Coating -
    • Coated with 62:36:2 tin-lead-silver solder
    • Coating thickness 16-25microns on each side
    • Uniform &bright coating, good adhesion on either side
  2. Mechanical - natural rounded edges coated all round
Camber :- <5mm/meter
Functional Requirement:- Required to be attached to silicon solar cells by soldering
Packing & Marking :-
  1. To be supplied in spools
  2. To be labeled on the packing consignment
    Interconnect tin lead silver 62:36:2
    Dimensions: 1.3x 0.13mm
    Coating: 16 to 25microns
    Mfd. Month/year
Inspection :-
  1. Visual inspection, dimensional &properties evaluation
  2. Single sampling plan as per IS- 10673-1983, special inspection level S- 4, AQL- 1.0.








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Solar Bus Bar

  • Width 5.0 ± 0.2mm
  • Thickness 0.3 ± 0.03mm( Basic Copper Thickness)
  • Item Bus Bar (Tin Lead Silver- 62:36:2)

Bus bar is a strip of platted copper that conducts electricity within a module, Panel, String Cells. The size of the bus bar determines the maximum amount of current that can be safely carried.

Material :- Electrolytic tough pitched (ETP) copper as per IS- 191-1980
Surface Finish :-
  1. Coating -
    • Coated with 62:36:2 tin-lead-silver solder
    • Coating thickness 16-25microns on each side
    • Uniform &bright coating, good adhesion on either side
  2. Mechanical - natural rounded edges coated all round
Camber :- <5mm/meter
Functional Requirement:- For interconnecting PV cell strings
Packing & Marking :-
  1. To be supplied in spools
  2. To be labeled on the packing consignment
    Interconnect tin lead silver 62:36:2
    Dimensions: 5x 0.3mm
    Coating: 16 to 25microns
    Mfd. Month/year
Inspection :-
  1. Visual inspection, dimensional &properties evaluation
  2. Single sampling plan as per IS- 10673-1983, special inspection level S- 4, AQL- 1.0.




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Junction Box

  • Application For connecting PV modules & power evacuation.
  • Certification TUV/ UL Approved
  • tem Junction Box with Cover & PV Connectors
  • Rated Current 12 A minimum
  • Rated Voltage 1000 VDC minimum
  • Degree of Protection IP 67 without Potting
  • Temperature Range 40˚C to +85˚C
  • Diode Connection Screwed Down
  • No. of Terminals 4(Four)
  • No. & Types of Diode Schottky Diodes (15A, 40V)
  • No. of Glands 2(Two)
  • Connecting Cables 2 no. Of 4s.mm - 100 cm length
  • Types of Connectors mc- 4 compatible clip on type
  • Ribbon Width 6-8mm
  • Housing Material PPE

A PV junction box is attached to the back of the solar panel (TPT) with silicon adhesive. It wires the (usually) 4 connectors together and is the output interface of the solar panel.

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Silicon Adhesive

  • Color :- White Or Bright White
  • Appearance :- Uncured- Thixotropic Paste, Cured- Elastic Rubber
  • Density Cured 1.04 minimum
  • Tack Free Time  5 minutes
  • Tensile Strength  1.6mpa Minimum
  • Elongation At Break Min 430%
  • Hardness Type A  26 Minimum
  • Adhesive Strength  1.3mpa Minimum
  • Volume Resistivity 2.0 X10(15) Minimum
  • Dielectric Strength  14kv/Mm Minimum
  • Temperature Resistance  -55 C to +200 C

Bonding and Sealing. PV cells made from laminated glass or high performance plastics have to be bonded into aluminium housings before mounting into position. High grade industrial silicone adhesive is normally used to make a strong yet flexible bond between the two surfaces.

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Solar Eva Film

  • Thickness 0.45 to 0.50mm
  • Width 985 ± 2m
  • Length in Roll Form of 100 linear Meters Each
  • Surface Type Inside- Matt, Outside- Polished/ Embossed
  • Tensile Strength  18 ± 3 MPa
  • Water Absorption  <0.1%
  • Thermal Conductivity  0.27w/M.K
  • Specific Heat  2.8j / g.K
  • Thermal Shrinkage  <1%
  • Adhesion To Back Sheet >70N / Cm
  • Adhesion To Glass  >70n/Cm
  • Optical Transmittance  >91%
  • UV Cut Off Wave Length  360nm
  • Refractive Index 1.48
  • Dielectric Strength  >25kv/mm
  • Volume Resistivity  1x 10(15) Minimum
  • Gel Content  >80%
  • Color  Transparent
  • Haze <7
  • Vinyl Acetate Content  26~33%

Its a most common encapsulation is with cross linkable EVA with the help of lamination machine. The cells are laminated between the films of EVA in a vacuum which is under compression. With the EVA the solar cells are floating between the glass & back sheet helping to softens shock & vibration therefore, protecting the solar cell & circuits.

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Solar Back Sheet

  • Country of Origin India
  • Application As Back Cover For Lamination of PV module Along With Eva
  • Width 985 ± 2mm
  • Thickness 0.30mm minimum

t is a outermost layer of the p.v module. Solar back sheet is a design to protect the inner component of the module. PV back sheet is a photovoltaic laminate that protects the PV module from UV, moisture and weather while acting as an electrical insulator.

ITEM

Laminated Composite Back Sheet for Photo Voltaic Module 3 Layered Structure with Outerlayer fluro-Polymer, Middle Layer Pet And inner Layer of FluroPolymer / UV Resistant Polymer)

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Aluminum Frames

  • Anodic coating thickness 18 ± 3 microns per IS 1868 (AC 15 grade )
  • Surface texture Natural matte finish

Aluminium frames provide stability without the weight of a material like steel, making it possible to positionsolar panels for optimal energy efficiency.

SCOPE

This specification covers the requirement of electrolytic ally formed anodic coating on aluminum & al alloy parts which are exposed to direct action of climatic elements.

GENERAL

  1. Aluminum parts to be anodized are made of Al alloy (63400/6063) as per IS- 733 & supplied in W P / t6 condition.
  2. End use of components is for solar photovoltaic module framing.
  3. Anodizing process as per type- I:IS -7088
  4. Type of sealing as per IS-7088

VISUAL REQUIREMENT

The anodic coating, shall be continues, smooth, adherent, uniform in appearance and shall be free from powdery areas, loose films, and discontinuities such as break, scratches and damages.

DIMENTIONAL REQUIREMENT

After anodic coating the parts shall comply with dimensional requirements of the applicable drawings.

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Water Blocking Yarn

High expansivity high tensile strength heat resistance chemical stability and no corrosively Water blocking yarn has the characteristics of quick water absorption, high expansivity, high tensile strength, no acid-basis, no consistency influence with cables, heat resistance, chemical stability and no corrosively etc. In the production of cables by using water blocking yarn, the materials of water blocking tape, polyester yarn and ointment could be omitted. Besides that, water blocking yarn is convenient in using, simple in techniques, stable in structure, reliable in water blocking, clean in environment, and no greasy pollution, especially, used in waterproof communication cable, dry-type cable, and insulation electronic cable, especially benthic cables.

No. Performance Unit Skills Requirements
      ZS-0.5
(18000D)
ZS-1.0
(9000D)
ZS-1.5
(6000D)
ZS-2.0
(4500D)
ZS-3.0
(3000D)
ZS-3.6
(2500D)
ZS-4.5
(2000D)
ZS-6.0
(1500D)
1 Liner Density m/kg 500 1000 1500 2000 3000 3600 4500 600
2 Tensile Strength N ≥300 ≥250 ≥200 ≥150 ≥100 ≥70 ≥60 ≥50
3 Elongationat Bleak % ≥15 ≥15 ≥15 ≥15 ≥15 ≥15 ≥15 ≥15
4 Swelling Speed ml/g/lst ≥40 ≥45 ≥50 ≥55 ≥60 ≥60 ≥60 ≥60
5 Swelling AIlloun
(150âã24h)
long ternl(150âã24h)
ml/g ≥50 ≥50 ≥55 ≥65 ≥65 ≥65 ≥65 ≥65
6 (230âãlOmin)
shortterlll(230âãlOmin)
ml/g ≥40 ≥45 ≥50 ≥55 ≥60 ≥65 ≥65 ≥65
7 Water Content(150âï¼1rain) % ≤9 ≤9 ≤9 ≤9 ≤9 ≤9 ≤9 ≤9











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Lamination Foil

Apply for overall or individual twisted pair shield for electronic cable and local network cables protect from external electromagnetic interface LUBRITAPERprovide the lubricating features to decrease friction of almunium or PET surface, TW spool is avialable.

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Polyester Film

Polythelene terepthalate(PET) used extensively in the production of a high-strength moisture-resistant and insulate film for cable core wrap, thickness from 12 micron to 125 micron, features option of spool packing.

HANDLING

The skilled operator should take or lay the materials gently, carefully to avoid scrap and crash problems.

STORAGE

Keep the clean standard stock, away from light direct irradiation pollutionand all kinds of mechanical outside force.

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Steel Wire Armored 3 Core Copper XLPE Insulated Cable

Semi conductive screen material is divided into two categories: cross-linking semi-conductive shielding compounds and thermoplastic semi-conductive shielding compound. Mainly applied to shielding of medium & low voltage power cables, and production of semi-conductive shielding for 10KV aerial cables( Used with silane aerial materials).

Processing temperature of the cress-linking semi =-conductive shielding compounds: 70-110C; Processing temperature of the thermoplastic semi-conductive shielding compounds: 90-140C.

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Silicon Wafer

  • Diameter 50mm-300mm
  • Type  P or N
  • Drientation  <100><111>
  • Resistivity  As Specified
  • TTV  As Specified
  • Site Flatness  As Specified
  • Final Thickness >=50um (dependant on wafer diameter)
  • Surface Finishes  Lapped, Ground, Etched, Polished

A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.

We are selling high grade, factory sealed silicon wafers since the 2006s. Wafers are available from our stock in every diameter and grade, with an emphasis on 100mm, 200mm and 300mm Prime and Test device quality wafers.

MG maintains a large inventory of Cz, FZ, low defect, ultra flat, and tightly controlled metals specifications etc. Because wafer specifications are unique to every semiconductor design, we offer the possibility to custom build to your requirements.

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