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  1. Cables And Wire Accessories 21 Products available
  2. Fibers 4 Products available
  3. Nuts Bolts And Fasteners 26 Products available
  4. Adapter 4 Products available
  5. Optical & Laser Instruments 3 Products available
  6. Wires 5 Products available
  7. Others 78 Products / Services available

Telecommunication Equipment & System #4537200

CXP Interconnect System

  • Networking Blade server, Computing systems, Data networking equipment-Servers Data networking equipment-Servers
Molex's CXP interconnect system enables pluggable copper or optical options to increase the flexibility of system-level hardware for end users. The dual paddle-card system was adopted as the InfiniBand* CXP, 12x QDR and IEEE 802.3ba as the 100G Ethernet standard, providing 10 lanes of 10 Gbps data rates. By leveraging high-speed wafer technology and compliant-pin tails, Molex has developed two integrated-connector offerings. The enhanced- footprint version is a high-density, 10-chanel connector, conforming to IEEE 802.3ba requirements for the 10-channel 100 Gigabit Ethernet interface. The standard version is a high-density, 12-channel connector capable of achieving Quad Data Rates (QDR) of 10 Gbps. The one-piece press-fit connector and cage assembly provides one-step placement to the board and is offered in both single and stacked dual-port configurations. Copper cables are designed to accommodate single, ganged or stacked connector configurations in extremely high-density requirements. Low profile CXP optical 4.50mm round cable assemblies offer improved fiber management over traditional flat cables for connecting CXP transceivers.
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Interconnect System

  • Data/Communications High-end servers
  • Networking Fibre Channel and Gigabit Ethernet
zSFP+ SMT 20-circuit connectors and cage assemblies provide excellent signal integrity and EMI protection. zSFP+ SMT connectors support current 10 Gbps Ethernet and 16 Gbps Fibre Channel applications, with the ability to support up to 25 Gbps serial lanes. The preferential coupling design uses a narrow-edge, coupled blanked- and formed-contact geometry and insert molding to optimize electrical performance. The zSFP+ SMT connector shares the same PCB footprint, mating interface and EMI cage dimensions as the SFP+ SMT form factor, making it backward compatible. Single-port and 1x ganged cages are available to support multiple design options. Single-port cages feature press-fit, solder-post and PCI (1) versions, providing a flexible solution for use with various board thicknesses and assembly processes at a comparable cost to SFP+ cages. EMI ganged cages utilizing new Gen II EMI belly gaskets provide superior EMI shielding compared to SFP+ cages. The press-fit tails accommodate belly-to-belly applications for both single and ganged cages to ensure the best use of PCB space. Cages will offer optional rear- and side-mounted lightpipe cover assemblies to allow for flexibility of PCB signal routing for LEDs. LC duplex cable assemblies, with optical mode three and four (OM3, OM4) fiber, are used with zSFP+ optical modules. LC duplex assemblies offer a high-performance interconnect solution with customization options for cable length and strain-relief boots including straight, 45 and 90. LC loopback assemblies provide a stable and convenient means for testing SFP and SFF devices in many applications.
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HandyLink I/O Interconnect System

  • Defense Hand-held field device
  • Automotive Audio, navigation, infotainment GPS
The HandyLink interconnect product family from Molex includes a right-angle SMT receptacle, wire and PCB version plugs, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies. An innovative compression-style contact design provides long-term performance and reliability that supports mating cycles up to 15, 000. The compact size and continuous current-carrying capability of 1.5 to 3.0A depending on circuit configuration, provides an optimal solution for the mobile device industry. The patented integrated-latch design provides optimal Electrostatic Discharge (ESD) protection and mechanical integrity.
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LFH Interconnect System

  • Data/Communications Mainframe Computers Mass Storage
  • Networking Router/Switch
Designed with the patented Helix contact for high-pin count Molexs LFH interconnect system is ideal for signal applications where reliability and performance are a necessity. The Helix plug pin interfaces with a split-beam receptacle contact providing a low insertion force with 2-point contact reliability. The LFH connectors are available in Matrix 50 and Matrix 75 configurations. The Matrix 50 layout is based on four contact rows on a 1.27 x 1.27mm spacing grid, with circuits ranging from 60 to 200. The Matrix 75 is based on five contact rows on a 1.90 x 1.90mm spacing grid, with circuits ranging from 96 to 130. Both systems feature IO shielding and support vertical and right-angle board mounting. Additional LFH features include optional hardware for docking applications, various 26 to 36 AWG wire types and compatibility with high-speed applications.
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HD Interconnect System

  • Category: I/O Connectors
  • Current: 1.0A
  • Data Rate: 12 Gbps
  • Lanes: 4, 8, 16
Molex's iPass+ HD system, referenced as mini-SAS HD in the SAS 2.1 standard, meets SAS-3 next-generation speed and density requirements. The low-profile system provides 4x and 8x cable-plug options, and the external IO connectors includes eight sideband signals per 4x port. These additional signals enable active copper and optical cables, as well as active pluggable modules for extended-length applications in data centers. iPass+ HD connectors mate to all current mini-SAS HD cable assemblies, and the Active Optical Cables (AOCs) reach up to 100m with low-power consumption while reducing cable-management challenges. Additionally, these connectors and cables are the chosen interface for the PCI Express (PCIe) External Cable Work Groups Generation 3 Cable specification.
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HS AutoLink Interconnect Systems

  • Category Transportation
  • Pitch 0.80mm (HSAutoLink™) 1.27 (HSAutoLink™ II)
  • Current 1.5A contact Molex for higher rating options
The Connected Vehicle industry has seen the rapid proliferation of in-vehicle cameras, digital high-resolution displays and 24-bit color imagery. This has led to a sharp increase in bandwidth requirements for automotive and commercial vehicles. The next-generation HSAutoLink Interconnect System addresses these ever-increasing requirements by providing a robust, sealed and cost-competitive system with data rates up to 5 Gbps. Supporting multiple high-speed communication protocols such as LVDS, USB 2.0, USB 3.0 and DisplayPort, the HSAutoLink Interconnect System has the bandwidth to support advanced infotainment, telematics and camera devices across the automotive and commercial vehicle industries.
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PLC Communications Modules

  • Category SST™ Industrial Communications
  • Protocols PROFIBUS, MODBUS, AS-i
  • Controller Type: CompactLogix
Machine builders and OEMs using CompactLogix platforms struggle to stay competitive in the growing global landscape. To further complicate matters, applications across multiple industries now require third-party networks such as PROFIBUS and MODBUS to easily interface with devices such as flow meters, drives and actuators. PACPLC communication modules are available for various industrial networks and fieldbus including: MODBUS Serial, MODBUS TCP, PROFIBUS DP and AS-interface. All modules offer common features such as a micro SD card slot for file storage allowing for fast and easy module replacement, a convenient 10100Mb Ethernet port for quick downloads and network monitoringdiagnostics and superior electrical noise isolation specifications. Built-in LEDs on the front of each module make it easy to see the status of the module and the network. To keep machine builders and OEMs using the CompactLogix platform competitive in the growing global landscape, all SST CompactLogix in-rack modules are offered at extremely cost-effective price points. Module hardware and software are 100 percent designed, developed and produced in Molex facilities. Molex is a Rockwell Encompass global partner.
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Remote Communication Modules

  • Industrial Oil and gas production Pharmaceutical manufacturing Wastewater treatment
  • Category: SST™ Industrial Communications
SST PB3 Remote Modules for PROFIBUS* are linking devices with on-board PROFIBUS and Ethernet communication ports providing a fast, easy solution for adding PROFIBUS Master and Slave connectivity to Rockwell Logix controllers (ControlLogix, CompactLogix, SoftLogix etc.) in factory-automation, process-control and complex machine applications. Molex offers both in-chassis and on-machine mount PROFIBUS remote modules to meet a range of customer design requirements. The unique harsh-duty, IP67-rated module offers extra functionality over the in-chassis modules; allowing for on-machine or in-field mounting and reducing expensive PROFIBUS cabling costs. The SST Remote Scanner for DeviceNet* controls and monitors IO devices connected to a DeviceNet network without the need of a local PC. DIN rail mountable, multiple SST Remote DeviceNet Scanners can be connected to one Ethernet switch, which is then connected back to a PC residing on an Ethernet network. The PC allows users to remotely access IO and diagnostic information from the SST Remote DeviceNet Scanner and the DeviceNet network.
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Retailer of Telecommunication Equipment & System from Delhi, Delhi by Molex India Private Limited
Post Buy Requirement
MI
Delhi, India
Add Review

Our Product / Services

  1. Adapter 4 Products available
  2. Optical & Laser Instruments 3 Products available
  3. Wires 5 Products available
  4. Cables And Wire Accessories 21 Products available
  5. Fibers 4 Products available
  6. Nuts Bolts And Fasteners 26 Products available
  7. Others 78 Products / Services available

Telecommunication Equipment & System #4537200

CXP Interconnect System

  • Networking Blade server, Computing systems, Data networking equipment-Servers Data networking equipment-Servers
Molex's CXP interconnect system enables pluggable copper or optical options to increase the flexibility of system-level hardware for end users. The dual paddle-card system was adopted as the InfiniBand* CXP, 12x QDR and IEEE 802.3ba as the 100G Ethernet standard, providing 10 lanes of 10 Gbps data rates. By leveraging high-speed wafer technology and compliant-pin tails, Molex has developed two integrated-connector offerings. The enhanced- footprint version is a high-density, 10-chanel connector, conforming to IEEE 802.3ba requirements for the 10-channel 100 Gigabit Ethernet interface. The standard version is a high-density, 12-channel connector capable of achieving Quad Data Rates (QDR) of 10 Gbps. The one-piece press-fit connector and cage assembly provides one-step placement to the board and is offered in both single and stacked dual-port configurations. Copper cables are designed to accommodate single, ganged or stacked connector configurations in extremely high-density requirements. Low profile CXP optical 4.50mm round cable assemblies offer improved fiber management over traditional flat cables for connecting CXP transceivers.
View Complete Details

Interconnect System

  • Data/Communications High-end servers
  • Networking Fibre Channel and Gigabit Ethernet
zSFP+ SMT 20-circuit connectors and cage assemblies provide excellent signal integrity and EMI protection. zSFP+ SMT connectors support current 10 Gbps Ethernet and 16 Gbps Fibre Channel applications, with the ability to support up to 25 Gbps serial lanes. The preferential coupling design uses a narrow-edge, coupled blanked- and formed-contact geometry and insert molding to optimize electrical performance. The zSFP+ SMT connector shares the same PCB footprint, mating interface and EMI cage dimensions as the SFP+ SMT form factor, making it backward compatible. Single-port and 1x ganged cages are available to support multiple design options. Single-port cages feature press-fit, solder-post and PCI (1) versions, providing a flexible solution for use with various board thicknesses and assembly processes at a comparable cost to SFP+ cages. EMI ganged cages utilizing new Gen II EMI belly gaskets provide superior EMI shielding compared to SFP+ cages. The press-fit tails accommodate belly-to-belly applications for both single and ganged cages to ensure the best use of PCB space. Cages will offer optional rear- and side-mounted lightpipe cover assemblies to allow for flexibility of PCB signal routing for LEDs. LC duplex cable assemblies, with optical mode three and four (OM3, OM4) fiber, are used with zSFP+ optical modules. LC duplex assemblies offer a high-performance interconnect solution with customization options for cable length and strain-relief boots including straight, 45 and 90. LC loopback assemblies provide a stable and convenient means for testing SFP and SFF devices in many applications.
View Complete Details

HandyLink I/O Interconnect System

  • Defense Hand-held field device
  • Automotive Audio, navigation, infotainment GPS
The HandyLink interconnect product family from Molex includes a right-angle SMT receptacle, wire and PCB version plugs, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies. An innovative compression-style contact design provides long-term performance and reliability that supports mating cycles up to 15, 000. The compact size and continuous current-carrying capability of 1.5 to 3.0A depending on circuit configuration, provides an optimal solution for the mobile device industry. The patented integrated-latch design provides optimal Electrostatic Discharge (ESD) protection and mechanical integrity.
View Complete Details

LFH Interconnect System

  • Data/Communications Mainframe Computers Mass Storage
  • Networking Router/Switch
Designed with the patented Helix contact for high-pin count Molexs LFH interconnect system is ideal for signal applications where reliability and performance are a necessity. The Helix plug pin interfaces with a split-beam receptacle contact providing a low insertion force with 2-point contact reliability. The LFH connectors are available in Matrix 50 and Matrix 75 configurations. The Matrix 50 layout is based on four contact rows on a 1.27 x 1.27mm spacing grid, with circuits ranging from 60 to 200. The Matrix 75 is based on five contact rows on a 1.90 x 1.90mm spacing grid, with circuits ranging from 96 to 130. Both systems feature IO shielding and support vertical and right-angle board mounting. Additional LFH features include optional hardware for docking applications, various 26 to 36 AWG wire types and compatibility with high-speed applications.
View Complete Details

HD Interconnect System

  • Category: I/O Connectors
  • Current: 1.0A
  • Data Rate: 12 Gbps
  • Lanes: 4, 8, 16
Molex's iPass+ HD system, referenced as mini-SAS HD in the SAS 2.1 standard, meets SAS-3 next-generation speed and density requirements. The low-profile system provides 4x and 8x cable-plug options, and the external IO connectors includes eight sideband signals per 4x port. These additional signals enable active copper and optical cables, as well as active pluggable modules for extended-length applications in data centers. iPass+ HD connectors mate to all current mini-SAS HD cable assemblies, and the Active Optical Cables (AOCs) reach up to 100m with low-power consumption while reducing cable-management challenges. Additionally, these connectors and cables are the chosen interface for the PCI Express (PCIe) External Cable Work Groups Generation 3 Cable specification.
View Complete Details

HS AutoLink Interconnect Systems

  • Category Transportation
  • Pitch 0.80mm (HSAutoLink™) 1.27 (HSAutoLink™ II)
  • Current 1.5A contact Molex for higher rating options
The Connected Vehicle industry has seen the rapid proliferation of in-vehicle cameras, digital high-resolution displays and 24-bit color imagery. This has led to a sharp increase in bandwidth requirements for automotive and commercial vehicles. The next-generation HSAutoLink Interconnect System addresses these ever-increasing requirements by providing a robust, sealed and cost-competitive system with data rates up to 5 Gbps. Supporting multiple high-speed communication protocols such as LVDS, USB 2.0, USB 3.0 and DisplayPort, the HSAutoLink Interconnect System has the bandwidth to support advanced infotainment, telematics and camera devices across the automotive and commercial vehicle industries.
View Complete Details

PLC Communications Modules

  • Category SST™ Industrial Communications
  • Protocols PROFIBUS, MODBUS, AS-i
  • Controller Type: CompactLogix
Machine builders and OEMs using CompactLogix platforms struggle to stay competitive in the growing global landscape. To further complicate matters, applications across multiple industries now require third-party networks such as PROFIBUS and MODBUS to easily interface with devices such as flow meters, drives and actuators. PACPLC communication modules are available for various industrial networks and fieldbus including: MODBUS Serial, MODBUS TCP, PROFIBUS DP and AS-interface. All modules offer common features such as a micro SD card slot for file storage allowing for fast and easy module replacement, a convenient 10100Mb Ethernet port for quick downloads and network monitoringdiagnostics and superior electrical noise isolation specifications. Built-in LEDs on the front of each module make it easy to see the status of the module and the network. To keep machine builders and OEMs using the CompactLogix platform competitive in the growing global landscape, all SST CompactLogix in-rack modules are offered at extremely cost-effective price points. Module hardware and software are 100 percent designed, developed and produced in Molex facilities. Molex is a Rockwell Encompass global partner.
View Complete Details

Remote Communication Modules

  • Industrial Oil and gas production Pharmaceutical manufacturing Wastewater treatment
  • Category: SST™ Industrial Communications
SST PB3 Remote Modules for PROFIBUS* are linking devices with on-board PROFIBUS and Ethernet communication ports providing a fast, easy solution for adding PROFIBUS Master and Slave connectivity to Rockwell Logix controllers (ControlLogix, CompactLogix, SoftLogix etc.) in factory-automation, process-control and complex machine applications. Molex offers both in-chassis and on-machine mount PROFIBUS remote modules to meet a range of customer design requirements. The unique harsh-duty, IP67-rated module offers extra functionality over the in-chassis modules; allowing for on-machine or in-field mounting and reducing expensive PROFIBUS cabling costs. The SST Remote Scanner for DeviceNet* controls and monitors IO devices connected to a DeviceNet network without the need of a local PC. DIN rail mountable, multiple SST Remote DeviceNet Scanners can be connected to one Ethernet switch, which is then connected back to a PC residing on an Ethernet network. The PC allows users to remotely access IO and diagnostic information from the SST Remote DeviceNet Scanner and the DeviceNet network.
View Complete Details
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