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Molex India Private Limited
location Nehru Place, Delhi

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Our Product / Services

  1. Nuts Bolts And Fasteners 26 Products available
  2. Cables And Wire Accessories 21 Products available
  3. Telecommunication Equipment & System 8 Products available
  4. Electric Circuit Components & Parts 6 Products available
  5. Wires 5 Products available
  6. Fibers 4 Products available
  7. Adapter 4 Products available
  8. Optical & Laser Instruments 3 Products available

  9. Laces, Interlinings & Other Accessories

    2 Products available

  10. Sensors

    2 Products available
  11. Others Products / Services 70 Products / Services available

Electric Circuit Components & Parts

Our Complete range of products are Polymicro Technologies Micro Components, FlexPlane Optical Flex Circuits, Membrane Switches and Rubber Keypads.

Polymicro Technologies Micro Components

Polymicro Technologies Micro Components
  • Category Fiber Optic Product Families
  • Tubing Material: Fused silica, quart tubing
  • Fiber Type: Silica/Silica, Silica/Teflon®
Micro components are products manufactured by laser andor mechanical machining operations. The machining alters the initial shape of the fused silica or quartz starting material to yield the desired finished product geometry. These micro components are capillary and fiber-based. Fiber-based micro components are manufactured from Polymicro Technologies optical fiber. Polymicro Technologies components are an ideal solution when a simple, flat, fiber end face is not feasible. With the latest technological advances in laser micro-machining, it is now possible to incorporate special optical coupling features onto the end of an optical fiber, alleviating critical design issues. This technology greatly improves in and out light flow by having interface features micro-machined into the fiber material. Production capabilities include integral sculpted tips including side-fire designs, as well as polishing, shaping, and finishing of fiber tips. These are especially important in high-power laser applications. Capillary micro components are fused silica or quartz tubing, which has been reshaped to modify the end face geometry andor the axial diameter. Ferrules and sleeves used in optical fiber applications are typically 2.00mm or less in outer diameter; the choice of material is often based on the application wavelength. Insertion flares are common and can be machined into single (one) or dual flared (both) ends as needed. For applications such as DWDM, shaped internal geometries have been manufactured.
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FlexPlane Optical Flex Circuits

FlexPlane Optical Flex Circuits
  • Category Optical Connectivity
  • Mode Singlemode, Multimode, Hybrid
  • Routing Standard, 3D
  • Defense Avionics Electronic warfare systems
As telecommunications and networking technology advances, systems increasingly call for optical backplanes with high-fiber counts and cross-connect systems. Molex's FlexPlane Optical Backplane Circuitry provides a manageable means of fiber routing from card-to-card or shelf-to-shelf. Designed for versatility, standard FlexPlane Circuitry provides high-density routing on a flexible, flame-resistant substrate. As applications grow more demanding, available real estate on PCBs shrinks and adequate airflow becomes a vital part of design requirements. 3D FlexPlane Optical Backplane Circuits provide almost a 50% substrate size reduction compared to standard FlexPlane Circuitry. 3D FlexPlane routes the fiber on multiple stacked substrates to achieve a compact routing area while the standard routes flex circuits on a single substrate. Telecommunication and networking modules often need to be quickly replaced on backplanes without disrupting the entire system. System architects also need design flexibility to meet the particular demands of each application. Blind Mate MTP (BMTP), High Density Blind Mate MT (HBMT ), Blind Mate LC (BLC ) and Blind Mate SC (BSC ) Optical Backplane Connector Systems can be used to connect FlexPlane Optical Flex Circuits to individual cards in a shelf. Available in any routing scheme, fiber can be routed point-to-point, in a shuffle or in a logical pattern to meet specific requirements. Direct or fusion-spliced terminations are available.
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FlexPlane Optical Flex Circuits

FlexPlane Optical Flex Circuits
  • Category Optical Connectivity
  • Mode Singlemode, Multimode, Hybrid
  • Routing: Standard, 3D
  • Connector Type: MTP, HBMT, MXC, LC, SC
As telecommunications and networking technology advances, systems increasingly call for optical backplanes with high-fiber counts and cross-connect systems. Molex's FlexPlane Optical Backplane Circuitry provides a manageable means of fiber routing from card-to-card or shelf-to-shelf. Designed for versatility, standard FlexPlane Circuitry provides high-density routing on a flexible, flame-resistant substrate. As applications grow more demanding, available real estate on PCBs shrinks and adequate airflow becomes a vital part of design requirements. 3D FlexPlane Optical Backplane Circuits provide almost a 50% substrate size reduction compared to standard FlexPlane Circuitry. 3D FlexPlane routes the fiber on multiple stacked substrates to achieve a compact routing area while the standard routes flex circuits on a single substrate. Telecommunication and networking modules often need to be quickly replaced on backplanes without disrupting the entire system. System architects also need design flexibility to meet the particular demands of each application. Blind Mate MTP (BMTP), High Density Blind Mate MT (HBMT ), Blind Mate LC (BLC ) and Blind Mate SC (BSC ) Optical Backplane Connector Systems can be used to connect FlexPlane Optical Flex Circuits to individual cards in a shelf. Available in any routing scheme, fiber can be routed point-to-point, in a shuffle or in a logical pattern to meet specific requirements. Direct or fusion-spliced terminations are available.
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FlexPlane Optical Flex Circuits

FlexPlane Optical Flex Circuits
  • Category Optical Connectivity
  • Mode Singlemode, Multimode, Hybrid
  • Routing Standard, 3D
As telecommunications and networking technology advances, systems increasingly call for optical backplanes with high-fiber counts and cross-connect systems. Molex's FlexPlane Optical Backplane Circuitry provides a manageable means of fiber routing from card-to-card or shelf-to-shelf. Designed for versatility, standard FlexPlane Circuitry provides high-density routing on a flexible, flame-resistant substrate. As applications grow more demanding, available real estate on PCBs shrinks and adequate airflow becomes a vital part of design requirements. 3D FlexPlane Optical Backplane Circuits provide almost a 50% substrate size reduction compared to standard FlexPlane Circuitry. 3D FlexPlane routes the fiber on multiple stacked substrates to achieve a compact routing area while the standard routes flex circuits on a single substrate. Telecommunication and networking modules often need to be quickly replaced on backplanes without disrupting the entire system. System architects also need design flexibility to meet the particular demands of each application. Blind Mate MTP (BMTP), High Density Blind Mate MT (HBMT ), Blind Mate LC (BLC ) and Blind Mate SC (BSC ) Optical Backplane Connector Systems can be used to connect FlexPlane Optical Flex Circuits to individual cards in a shelf. Available in any routing scheme, fiber can be routed point-to-point, in a shuffle or in a logical pattern to meet specific requirements. Direct or fusion-spliced terminations are available
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Membrane Switches

Membrane Switches
  • Category Membrane Switch and Capacitive Switch Products
  • Industrial Automation equipment Barcode Scanners Battery chargers Fluid detection Forkl
  • Defense Aviation controls Communication systems Sighting systems Targeting systems
Molex standard membrane switches are thin, low-profile, micro-motion assemblies, with one or more layers of silver or carbon conductors printed on polyester substrate layers. Pressure-sensitive adhesives are used to bond the layers together. Assemblies can be designed as thin as 1.00mm. Tactile metal domes provide the "snap" or tactile feedback and audible sound when the switch is actuated. Available options include non-tactile membrane switches (ex, microwave ovens, treadmills), poly-domes and silicone rubber keypads with carbon or gold contacts. Molex membrane switch assemblies incorporate electronic components, such as LEDs, seven-segment LEDs, photo diodes resistors and capacitors that are integrated to the membrane switch substrate using conductive adhesive technology. Molexs advanced manufacturing can print double-sided silver circuits producing the equivalent of four layer PCBs or the elimination of printed crossovers for environmentally exposed applications. These advances are customized in a variety of configurations to fit increasingly smaller, more demanding and cost competitive applications. For higher level integration, Molex has experience and manufacturing to include copper flex circuits and PCB assemblies, LCDs, plastic housings or metal backers and lenses.
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Rubber Keypads

Rubber Keypads
  • Category Membrane and Capacitive Switch Products
  • Defense Aviation controls Communication systems Sighting systems Targeting systems
Membrane switches incorporate silicone-rubber keypads to improve the aesthetic look and feel of a switch. Designs have a large variety of effects from embossed and debossed features, printed text, painted icons, backlighting and even rockertoggle actuators. Polyurethane, epoxy and UV coatings available can protect keypads from the environment and abuse. The keypad utilizes a variety of contact systems ranging from carbon pills, to gold pills, to actuating tactile metal domes in a membrane-switch assembly. Mounting methods used to apply the rubber actuator to the switch may vary. One simple method of mounting rubber actuator is double-sided pressure-sensitive silicone-rubber adhesive. This is applied to a carrier on one side, and the applicable mounting adhesive is applied to the other. Another mounting method includes a simple pull-through molded into the rubber itself. The pull-through is then pulled through a printed circuit board substrate, where an interference fit secures the rubber component to the assembly.
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