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Molex India Limited
Chennai, Tamil Nadu, India
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  1. Audio Recorders, Mixers & Transmitters 5 Products available
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  4. Telecommunication Equipment & System 9 Products available
  5. Cables And Wire Accessories 15 Products available
  6. Binding Systems 3 Products available
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Telecommunication Equipment & System #4537173

CXP Interconnect System

CXP Interconnect System
  • Lanes 10x, 12x
  • Category: iPass™ Interconnect System
  • Current 0.5A
  • Data Rate: 100 Gbps
Molexs CXP interconnect system enables pluggable copper or optical options to increase the flexibility of system-level hardware for end users. The dual paddle-card system was adopted as the InfiniBand* CXP, 12x QDR and IEEE 802.3ba as the 100G Ethernet standard, providing 10 lanes of 10 Gbps data rates. By leveraging high-speed wafer technology and compliant-pin tails, Molex has developed two integrated-connector offerings. The enhanced- footprint version is a high-density, 10-chanel connector, conforming to IEEE 802.3ba requirements for the 10-channel 100 Gigabit Ethernet interface. The standard version is a high-density, 12-channel connector capable of achieving Quad Data Rates (QDR) of 10 Gbps. The one-piece press-fit connector and cage assembly provides one-step placement to the board and is offered in both single and stacked dual-port configurations. Copper cables are designed to accommodate single, ganged or stacked connector configurations in extremely high-density requirements. Low profile CXP optical 4.50mm round cable assemblies offer improved fiber management over traditional flat cables for connecting CXP transceivers.
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Remote Communication Modules

Remote Communication Modules
  • appliacation , Industrial Automation
SST PB3 Remote Modules for PROFIBUS are linking devices with on-board PROFIBUS and Ethernet communication ports providing a fast, easy solution for adding PROFIBUS Master and Slave connectivity to Rockwell Logix controllers (ControlLogix, CompactLogix, SoftLogix etc.) in factory-automation, process-control and complex machine applications. Molex offers both in-chassis and on-machine mount PROFIBUS remote modules to meet a range of customer design requirements. The unique harsh-duty, IP67-rated module offers extra functionality over the in-chassis modules; allowing for on-machine or in-field mounting and reducing expensive PROFIBUS cabling costs. The SST Remote Scanner for DeviceNet* controls and monitors IO devices connected to a DeviceNet network without the need of a local PC. DIN rail mountable, multiple SST Remote DeviceNet Scanners can be connected to one Ethernet switch, which is then connected back to a PC residing on an Ethernet network. The PC allows users to remotely access IO and diagnostic information from the SST Remote DeviceNet Scanner and the DeviceNet network. SST Remote Module hardware and software are 100% designed, developed and produced in Molex facilities.
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zSFP+ Interconnect System

ZSFP+ Interconnect System
  • Category I/O Connectors
  • Industry Standards Ethernet, Fibre Channel
  • Data Rate: 56 Gbps
  • features Provides superior signal integrity (SI) performance and EMI protection, Supports current 10 G
zSFP+ SMT 20-circuit connectors and cage assemblies provide excellent signal integrity and EMI protection. zSFP+ SMT connectors support current 10 Gbps Ethernet and 16 Gbps Fibre Channel applications, with the ability to support up to 25 Gbps serial lanes. The preferential coupling design uses a narrow-edge, coupled blanked- and formed-contact geometry and insert molding to optimize electrical performance. The zSFP+ SMT connector shares the same PCB footprint, mating interface and EMI cage dimensions as the SFP+ SMT form factor, making it backward compatible. Single-port and 1x ganged cages are available to support multiple design options. Single-port cages feature press-fit, solder-post and PCI (1) versions, providing a flexible solution for use with various board thicknesses and assembly processes at a comparable cost to SFP+ cages. EMI ganged cages utilizing new Gen II EMI belly gaskets provide superior EMI shielding compared to SFP+ cages. The press-fit tails accommodate belly-to-belly applications for both single and ganged cages to ensure the best use of PCB space. Cages will offer optional rear- and side-mounted lightpipe cover assemblies to allow for flexibility of PCB signal routing for LEDs. LC duplex cable assemblies, with optical mode three and four (OM3, OM4) fiber, are used with zSFP+ optical modules. LC duplex assemblies offer a high-performance interconnect solution with customization options for cable length and strain-relief boots including straight, 45 and 90. LC loopback assemblies provide a stable and convenient means for testing SFP and SFF devices in many applications. Temp-Flex 28 Gbps cable assemblies deliver next-generation data rates while delivering significant insertion loss improvements and enhanced cost efficiencies.
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iPass+ HD Interconnect System

IPass+ HD Interconnect System
  • Category I/O Connectors
  • Lanes 4, 8, 16
  • Current: 1.0A
  • Data Rate: 12 Gbps
  • features Enables storage companies to deploy larger systems. Allows customers to scale up with added stor
Molexs iPass+ HD system, referenced as mini-SAS HD in the SAS 2.1 standard, meets SAS-3 next-generation speed and density requirements. The low-profile system provides 4x and 8x cable-plug options, and the external IO connectors includes eight sideband signals per 4x port. These additional signals enable active copper and optical cables, as well as active pluggable modules for extended-length applications in data centers. iPass+ HD connectors mate to all current mini-SAS HD cable assemblies, and the Active Optical Cables (AOCs) reach up to 100m with low-power consumption while reducing cable-management challenges. Additionally, these connectors and cables are the chosen interface for the PCI Express (PCIe) External Cable Work Groups Generation 3 Cable specification.
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HandyLink I/O Interconnect System

HandyLink I/O Interconnect System
  • Category I/O Connectors
  • Current 1.0A
  • Features Supports USB transmission speeds 500 ns rise time and 2 pF capacitance, Reduces real estate and minim
The HandyLink interconnect product family from Molex includes a right-angle SMT receptacle, wire and PCB version plugs, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies. An innovative compression-style contact design provides long-term performance and reliability that supports mating cycles up to 15, 000. The compact size and continuous current-carrying capability of 1.5 to 3.0A depending on circuit configuration, provides an optimal solution for the mobile device industry. The patented integrated-latch design provides optimal Electrostatic Discharge (ESD) protection and mechanical integrity.
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LFH Interconnect System

LFH Interconnect System
  • Category I/O Connectors
  • Pitch 1.27mm, 1.90mm
  • Data Rate: 5 Gbps
  • Features More terminals in a smaller package, Flexibility in many different applications
Designed with the patented Helix contact for high-pin count Molexs LFH interconnect system is ideal for signal applications where reliability and performance are a necessity. The Helix plug pin interfaces with a split-beam receptacle contact providing a low insertion force with 2-point contact reliability. The LFH connectors are available in Matrix 50 and Matrix 75 configurations. The Matrix 50 layout is based on four contact rows on a 1.27 x 1.27mm spacing grid, with circuits ranging from 60 to 200. The Matrix 75 is based on five contact rows on a 1.90 x 1.90mm spacing grid, with circuits ranging from 96 to 130. Both systems feature IO shielding and support vertical and right-angle board mounting. Additional LFH features include optional hardware for docking applications, various 26 to 36 AWG wire types and compatibility with high-speed applications.
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HSAutoLink Interconnect Systems

HSAutoLink Interconnect Systems
  • Category Transportation
  • Pitch 0.80mm (HSAutoLink™) 1.27 (HSAutoLink™ II)
  • Current 1.5A contact Molex for higher rating options
  • Features Rugged connectors meet USCAR requirements, Superior signal performance and reduced Electro M
The Connected Vehicle industry has seen the rapid proliferation of in-vehicle cameras, digital high-resolution displays and 24-bit color imagery. This has led to a sharp increase in bandwidth requirements for automotive and commercial vehicles. The next-generation HSAutoLink Interconnect System addresses these ever-increasing requirements by providing a robust, sealed and cost-competitive system with data rates up to 5 Gbps. Supporting multiple high-speed communication protocols such as LVDS, USB 2.0, USB 3.0 and DisplayPort, the HSAutoLink Interconnect System has the bandwidth to support advanced infotainment, telematics and camera devices across the automotive and commercial vehicle industries.
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HSAutoLink Interconnect Systems

HSAutoLink Interconnect Systems
  • Category Transportation,
  • Current 1.5A contact Molex for higher rating options
  • features Rugged connectors meet USCAR requirements, Superior signal performance and reduced Electro M
The Connected Vehicle industry has seen the rapid proliferation of in-vehicle cameras, digital high-resolution displays and 24-bit color imagery. This has led to a sharp increase in bandwidth requirements for automotive and commercial vehicles. The next-generation HSAutoLink Interconnect System addresses these ever-increasing requirements by providing a robust, sealed and cost-competitive system with data rates up to 5 Gbps. Supporting multiple high-speed communication protocols such as LVDS, USB 2.0, USB 3.0 and DisplayPort, the HSAutoLink Interconnect System has the bandwidth to support advanced infotainment, telematics and camera devices across the automotive and commercial vehicle industries.
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Standard signal interconnect system

Standard Signal Interconnect System
  • Category Power Connectors
  • circuits 1, 2, 3, 4, 5, 6, 9, 12
  • Features Male and female terminals may be used in either plug or receptacle housings, Free-hanging or panel mo
A power or signal interconnect system rated up to 5.0A per circuit with standard brass terminals. Tough Nylon housings and robust terminal design create a durable, long lasting product. The Standard .062" products are reliable, economical and offer high value in features and price. These products are an excellent choice for power or signal interconnect applications. Fast assembly reduces applied costs. Round terminals may be oriented in any direction for fast assembly. Circuit identifiers and polarized housing design ensure accurate assembly. Dual terminal lock lances provide optimum contact stability. Wide range of crimp tooling to support any manufacturing need. With a variety of housing circuit sizes ranging from single circuit to 36 circuits, allowing customers to select the product size that best fits the application. Standard .062" products have a wide range of product options including free hanging or panel mount housings and 18-30 AWG terminals in brass and phosphor bronze base materials and tin or gold plating offer flexibility in design.
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Retailer of Telecommunication Equipment & System from Chennai, Tamil Nadu by Molex India Limited
Product / Services
Post Buy Requirement
MI

Molex India Limited
Tharamani, Chennai, Tamil Nadu

Add Review
Call Now Call Now

Our Product / Services

  1. Nuts Bolts And Fasteners 81 Products available
  2. Cables And Wire Accessories 15 Products available
  3. Wires 9 Products available
  4. Telecommunication Equipment & System 9 Products available
  5. Sockets 5 Products available
  6. Audio Recorders, Mixers & Transmitters 5 Products available
  7. Binding Systems 3 Products available
  8. Electrical Cables & Wires 3 Products available
  9. Electric Circuit Components & Parts 3 Products available
  10. Laces, Interlinings & Other Accessories 3 Products available
  11. Others Products / Services 193 Products / Services available

Telecommunication Equipment & System

We offer the best product range of CXP Interconnect System, Remote Communication Modules, zSFP+ Interconnect System, iPass+ HD Interconnect System and HandyLink I/O Interconnect System.

CXP Interconnect System

CXP Interconnect System
  • Lanes 10x, 12x
  • Category: iPass™ Interconnect System
  • Current 0.5A
  • Data Rate: 100 Gbps
Molexs CXP interconnect system enables pluggable copper or optical options to increase the flexibility of system-level hardware for end users. The dual paddle-card system was adopted as the InfiniBand* CXP, 12x QDR and IEEE 802.3ba as the 100G Ethernet standard, providing 10 lanes of 10 Gbps data rates. By leveraging high-speed wafer technology and compliant-pin tails, Molex has developed two integrated-connector offerings. The enhanced- footprint version is a high-density, 10-chanel connector, conforming to IEEE 802.3ba requirements for the 10-channel 100 Gigabit Ethernet interface. The standard version is a high-density, 12-channel connector capable of achieving Quad Data Rates (QDR) of 10 Gbps. The one-piece press-fit connector and cage assembly provides one-step placement to the board and is offered in both single and stacked dual-port configurations. Copper cables are designed to accommodate single, ganged or stacked connector configurations in extremely high-density requirements. Low profile CXP optical 4.50mm round cable assemblies offer improved fiber management over traditional flat cables for connecting CXP transceivers.
View Complete Details
Ask Latest Price & Details
Remote Communication Modules

Remote Communication Modules
  • appliacation , Industrial Automation
SST PB3 Remote Modules for PROFIBUS are linking devices with on-board PROFIBUS and Ethernet communication ports providing a fast, easy solution for adding PROFIBUS Master and Slave connectivity to Rockwell Logix controllers (ControlLogix, CompactLogix, SoftLogix etc.) in factory-automation, process-control and complex machine applications. Molex offers both in-chassis and on-machine mount PROFIBUS remote modules to meet a range of customer design requirements. The unique harsh-duty, IP67-rated module offers extra functionality over the in-chassis modules; allowing for on-machine or in-field mounting and reducing expensive PROFIBUS cabling costs. The SST Remote Scanner for DeviceNet* controls and monitors IO devices connected to a DeviceNet network without the need of a local PC. DIN rail mountable, multiple SST Remote DeviceNet Scanners can be connected to one Ethernet switch, which is then connected back to a PC residing on an Ethernet network. The PC allows users to remotely access IO and diagnostic information from the SST Remote DeviceNet Scanner and the DeviceNet network. SST Remote Module hardware and software are 100% designed, developed and produced in Molex facilities.
View Complete Details
Ask Latest Price & Details
zSFP+ Interconnect System

ZSFP+ Interconnect System
  • Category I/O Connectors
  • Industry Standards Ethernet, Fibre Channel
  • Data Rate: 56 Gbps
  • features Provides superior signal integrity (SI) performance and EMI protection, Supports current 10 G
zSFP+ SMT 20-circuit connectors and cage assemblies provide excellent signal integrity and EMI protection. zSFP+ SMT connectors support current 10 Gbps Ethernet and 16 Gbps Fibre Channel applications, with the ability to support up to 25 Gbps serial lanes. The preferential coupling design uses a narrow-edge, coupled blanked- and formed-contact geometry and insert molding to optimize electrical performance. The zSFP+ SMT connector shares the same PCB footprint, mating interface and EMI cage dimensions as the SFP+ SMT form factor, making it backward compatible. Single-port and 1x ganged cages are available to support multiple design options. Single-port cages feature press-fit, solder-post and PCI (1) versions, providing a flexible solution for use with various board thicknesses and assembly processes at a comparable cost to SFP+ cages. EMI ganged cages utilizing new Gen II EMI belly gaskets provide superior EMI shielding compared to SFP+ cages. The press-fit tails accommodate belly-to-belly applications for both single and ganged cages to ensure the best use of PCB space. Cages will offer optional rear- and side-mounted lightpipe cover assemblies to allow for flexibility of PCB signal routing for LEDs. LC duplex cable assemblies, with optical mode three and four (OM3, OM4) fiber, are used with zSFP+ optical modules. LC duplex assemblies offer a high-performance interconnect solution with customization options for cable length and strain-relief boots including straight, 45 and 90. LC loopback assemblies provide a stable and convenient means for testing SFP and SFF devices in many applications. Temp-Flex 28 Gbps cable assemblies deliver next-generation data rates while delivering significant insertion loss improvements and enhanced cost efficiencies.
View Complete Details
Ask Latest Price & Details
iPass+ HD Interconnect System

IPass+ HD Interconnect System
  • Category I/O Connectors
  • Lanes 4, 8, 16
  • Current: 1.0A
  • Data Rate: 12 Gbps
  • features Enables storage companies to deploy larger systems. Allows customers to scale up with added stor
Molexs iPass+ HD system, referenced as mini-SAS HD in the SAS 2.1 standard, meets SAS-3 next-generation speed and density requirements. The low-profile system provides 4x and 8x cable-plug options, and the external IO connectors includes eight sideband signals per 4x port. These additional signals enable active copper and optical cables, as well as active pluggable modules for extended-length applications in data centers. iPass+ HD connectors mate to all current mini-SAS HD cable assemblies, and the Active Optical Cables (AOCs) reach up to 100m with low-power consumption while reducing cable-management challenges. Additionally, these connectors and cables are the chosen interface for the PCI Express (PCIe) External Cable Work Groups Generation 3 Cable specification.
View Complete Details
Ask Latest Price & Details
HandyLink I/O Interconnect System

HandyLink I/O Interconnect System
  • Category I/O Connectors
  • Current 1.0A
  • Features Supports USB transmission speeds 500 ns rise time and 2 pF capacitance, Reduces real estate and minim
The HandyLink interconnect product family from Molex includes a right-angle SMT receptacle, wire and PCB version plugs, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies. An innovative compression-style contact design provides long-term performance and reliability that supports mating cycles up to 15, 000. The compact size and continuous current-carrying capability of 1.5 to 3.0A depending on circuit configuration, provides an optimal solution for the mobile device industry. The patented integrated-latch design provides optimal Electrostatic Discharge (ESD) protection and mechanical integrity.
View Complete Details
Ask Latest Price & Details
LFH Interconnect System

LFH Interconnect System
  • Category I/O Connectors
  • Pitch 1.27mm, 1.90mm
  • Data Rate: 5 Gbps
  • Features More terminals in a smaller package, Flexibility in many different applications
Designed with the patented Helix contact for high-pin count Molexs LFH interconnect system is ideal for signal applications where reliability and performance are a necessity. The Helix plug pin interfaces with a split-beam receptacle contact providing a low insertion force with 2-point contact reliability. The LFH connectors are available in Matrix 50 and Matrix 75 configurations. The Matrix 50 layout is based on four contact rows on a 1.27 x 1.27mm spacing grid, with circuits ranging from 60 to 200. The Matrix 75 is based on five contact rows on a 1.90 x 1.90mm spacing grid, with circuits ranging from 96 to 130. Both systems feature IO shielding and support vertical and right-angle board mounting. Additional LFH features include optional hardware for docking applications, various 26 to 36 AWG wire types and compatibility with high-speed applications.
View Complete Details
Ask Latest Price & Details
HSAutoLink Interconnect Systems

HSAutoLink Interconnect Systems
  • Category Transportation
  • Pitch 0.80mm (HSAutoLink™) 1.27 (HSAutoLink™ II)
  • Current 1.5A contact Molex for higher rating options
  • Features Rugged connectors meet USCAR requirements, Superior signal performance and reduced Electro M
The Connected Vehicle industry has seen the rapid proliferation of in-vehicle cameras, digital high-resolution displays and 24-bit color imagery. This has led to a sharp increase in bandwidth requirements for automotive and commercial vehicles. The next-generation HSAutoLink Interconnect System addresses these ever-increasing requirements by providing a robust, sealed and cost-competitive system with data rates up to 5 Gbps. Supporting multiple high-speed communication protocols such as LVDS, USB 2.0, USB 3.0 and DisplayPort, the HSAutoLink Interconnect System has the bandwidth to support advanced infotainment, telematics and camera devices across the automotive and commercial vehicle industries.
View Complete Details
Ask Latest Price & Details
HSAutoLink Interconnect Systems

HSAutoLink Interconnect Systems
  • Category Transportation,
  • Current 1.5A contact Molex for higher rating options
  • features Rugged connectors meet USCAR requirements, Superior signal performance and reduced Electro M
The Connected Vehicle industry has seen the rapid proliferation of in-vehicle cameras, digital high-resolution displays and 24-bit color imagery. This has led to a sharp increase in bandwidth requirements for automotive and commercial vehicles. The next-generation HSAutoLink Interconnect System addresses these ever-increasing requirements by providing a robust, sealed and cost-competitive system with data rates up to 5 Gbps. Supporting multiple high-speed communication protocols such as LVDS, USB 2.0, USB 3.0 and DisplayPort, the HSAutoLink Interconnect System has the bandwidth to support advanced infotainment, telematics and camera devices across the automotive and commercial vehicle industries.
View Complete Details
Ask Latest Price & Details
Standard signal interconnect system

Standard Signal Interconnect System
  • Category Power Connectors
  • circuits 1, 2, 3, 4, 5, 6, 9, 12
  • Features Male and female terminals may be used in either plug or receptacle housings, Free-hanging or panel mo
A power or signal interconnect system rated up to 5.0A per circuit with standard brass terminals. Tough Nylon housings and robust terminal design create a durable, long lasting product. The Standard .062" products are reliable, economical and offer high value in features and price. These products are an excellent choice for power or signal interconnect applications. Fast assembly reduces applied costs. Round terminals may be oriented in any direction for fast assembly. Circuit identifiers and polarized housing design ensure accurate assembly. Dual terminal lock lances provide optimum contact stability. Wide range of crimp tooling to support any manufacturing need. With a variety of housing circuit sizes ranging from single circuit to 36 circuits, allowing customers to select the product size that best fits the application. Standard .062" products have a wide range of product options including free hanging or panel mount housings and 18-30 AWG terminals in brass and phosphor bronze base materials and tin or gold plating offer flexibility in design.
View Complete Details
Ask Latest Price & Details
Tell Us What are you looking for? Will call you back

Contact Us

View Contact No.