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1 Products availableLeading Manufacturer, Supplier & Retailer of Zinc plating, rhodium plating, tin plating, Silver Plating and Chromate Plating.
Zinc plating involves the electrolytic application of zinc by immersing clean steel parts in a zinc salt solution and applying an electric current. We carry four different zinc plating products that are sure to fit your metal plating needs. They include: An Alkaline non-cyanide zinc plating, Bright Acid chloride zinc plating, Zinc-nickel alloy plating Cyanide zinc plating Our zinc plating process is suitable for rack or barrel plating and large volume batches.
Acid Chloride Zinc
A mixed ammonium/potassium chloride bright zinc plating process It produces brilliant, level and ductile deposits even on difficult substrates such as cast iron, heat treated and carbonitrited steel. The water soluble brightener goes into solution much more readily than a solvent based brightener.
A bright chloride zinc plating solution.
It has the same inherent advantages and benefits as but uses a different carrier component. SMF is an expert metal finishing and metal plating company, and is also a member of ASTM International. For more information about ASTM International, click here.
Rhodium is white in color and is a precious metal, meaning non-oxidizing. Rhodium is a member of the Platinum Group of Metals. The Platinum Group of Metals is a group of six metals which include platinum, rhodium, palladium ruthenium, osmium, and iridium. These six metals all share some common physical properties. They have high melting points, are very dense, are very hard, and are very resistant to corrosion.
Rhodium is the hardest of the PGMs. Its hardness is about 800. Compare that to cobalt hardened gold at 200 knoop, 14k ElectricGold at 400 knoop and at 400 knoop. Rhodium is the hardest, most wear resistant metal that we plate at Professional Plating. In addition to its hardness, rhodium is extremely resistant to corrosion. Rhodium is an excellent choice where contact with corrosive gases or other high corrosion environments will be encountered. Remember also that as the operating environment temperature increases, the corrosion rate will also increase. So in high temperature applications, rhodium will provide a longer life cycle, than, for example, gold will. Rhodium will reliably operate beyond 1000F.
Rhodium is an extremely bright white metal. It is much whiter than palladium and platinum. For this reason and because of its extreme hardness, rhodium is very commonly used as an electroplated surface for fine jewelry.
Rhodium plated product is well suited for such applications as sliding electrical contacts that require protection from sliding contact wear or galling. Also, because of its high temperature tolerance to oxidation, rhodium is an extremely good choice for high voltage/high amperage electrical contacts where contact arcing would otherwise cause the formation of highly electrically resistive oxide formations on the contact surface.
Color is gray white in plated condition, had very high luster in fused condition. Soft, but is very ductile. Corrosion resistance is good. (Coated items should meet 24 hour 5% salt spray requirement.) Solder ability is excellent. Tin is not good for low temperature applications (changes structure and loses adhesion when exposed to temperatures below -40 degrees C). If a bright finish is desired to be used in lieu of fused tin, specify Bright Tin plate. Thickness can exceed that of fused tin and in deposit shows excellent corrosion resistance and solder ability.
Type I: Electrodeposited
.0001 .00025: Flash for solderin.0002 .0004: to prevent galling and seizing .0003 min: Where corrosion resistance is important.0002 .0006: To prevent formation of case during nit-riding.
Color is gray white in plated condition, had very high luster in fused condition. Soft, but is very ductile. Corrosion resistance is good. (Coated items should meet 24 hour 5% salt spray requirement.) Solder ability is excellent. Tin is not good for low temperature applications (changes structure and loses adhesion when exposed to temperatures below -40 degrees C). If a bright finish is desired to be used in lieu of fused tin, specify Bright Tin plate. Thickness can exceed that of fused tin and in deposit shows excellent corrosion resistance and solder ability.
Silver platingoffers the highest electrical conductivity of all metals. It is not a precious metal and will oxidize rapidly. Silver plating is best suited for engineering purposes for solderable surfaces, electrical contact characteristics, high electrical and thermal conductivity, thermocompression bonding, wear resistance of load-bearing surfaces, and spectral reflectivity electrical applications, good corrosion resistance, good solderability, and other applications.
Silver Plating Specification:
Specification: Mil-QQ-S-365 Silver Plating, Electrodeposited
Silver Plating - Grades:
Silver Plating - Tarnish-Resistance:
Several options are available as supplementary coating for increasing tarnish resistance. Depending on solderability, or subsequent finishing steps such as painting or powder coating, we will recommend specific tarnish resistant coatings.
1.Materials qualified produce coatings that range in color from clear to iridescent yellow or brown. Inspection difficulties may arise with clear coatings because visual inspection does not reveal the presence of a coating.2. Class 1A For maximum protection from corrosion, for surfaces to be painted or left unpainted.3. Class 1A chemical conversion coatings are intended to provide corrosion prevention when left unpainted and to improve adhesion of paint finish systems to aluminum and aluminum alloys may be used for all surface treatments of tanks, tubing's and component structures where interior paint finishes are not required. Repair of mechanically damaged areas of anodic coatings conforming to MIL-A-8625 will provide effective means of reestablishing corrosion resistance but will not restore abrasion resistance of the anodic coating.
Electroless gold is deposited from a solution purely as the result of the reaction of chemicals in the bath. The electroless plating bath is comprised of several of the same items found in an electrolytic gold plating bath, but it also includes chemicals (reducing agents) to provide electrons for the reaction and other chemicals (chelating agents and stabilizers) to control the reaction so that it can be predictable and controllable as a manufacturing process.
Why Does It Matter Which Process is Used to Plate?Is the Deposit the Same?To plate a part using an electrolytic process, every surface to be plated must be connected electrically so that it can act as the cathode in the plating cell. This becomes difficult for many products but especially for electronic circuits that generally need to have electrically isolated surfaces to be functional. Over the course of the development of the electronics industry it has become common practice to design in connections to tie different surface metal patterns together just for plating and then to remove these connections after plating. The manufacturing inefficiencies of this are obvious but a greater problem is the restriction this places on the final performance and circuit density of the component.
Using electroless gold plating, circuits can be designed and fabricated in their final configuration. This saves the manufacturer several steps but more importantly it allows the circuit design to place primary consideration on optimum circuit performance and minimum circuit size.
The electroless gold deposit is identical to an electrolytic pure gold deposit (i.e., Mil-G-45204 C Type III or ASTM B488 Type 1 hardness code A) in essentially every way; thickness, purity, hardness, grain size, density and color. The primary difference from an electrolytic gold deposit is it's second distinct advantage. improved thickness distribution.
Electrolytic plating creates deposits that have thickness variations resulting primarily from the shape of the electrical field between the cathode surfaces and the anode. These deposits are thicker on corners and edges and surfaces where the distance to the anode is shortest. They are also thinner in the middle of surfaces, inside of holes and on surfaces facing away from the anode.
Electroless plating completely eliminates this source of variation. Electroless gold plated deposits are uniform in thickness around corners, on both sides of a part, even on the inside walls of small holes that may be very deep.
MIL-G-45204 Gold Plating, Electrodeposited
Gold Plating & Gold Electroplating - purity and coating thickness:
Co-deposited impurities can make soldering more difficult, and for this reason high purity gold plating is preferred. Soldering requirements are best achieved when gold electroplating coatings range between 0.00005 and 0.0001 inch (50 and 100 micro inches) thickness.
Gold Plating & Gold Electroplating - Hardness Grades:
1. 90 knoop, maximum2. 91-129 knoop, inclusive3. 130-200 knoop, inclusive4. 201 knoop, minimum
Gold over silver is not recommended for electronics hardware:
Gold Plating - Underplate RecommendationsGold Electroplating - When gold is applied to a copper rich surface such as brass, bronze, or beryllium copper, metal ions from these base metals will diffuse into the gold layer and degrade its hardness and non-oxidizing properties. An antidiffusion underplate such as nickel (electroless or sulfamate) should be applied to prevent this. We recommend electroless nickel under gold where part flexure of deformation is not expected and a bight finish is desirable. Where part flexure or deformation is expected, we recommend sulfamate nickel as the underplate because of its higher ducility.
Nickel can be deposited soft or hard-dull or bright, depending on process used and conditions employed in plating. Thus, hardness can range from 150500 Vickers. Can be similar to stainless steel in color, or can be dull gray or light gray (almost white) color. Corrosion resistance is a function of thickness.
Class 1A: For corrosion protectionGrade A: .0016 Min. thicknessGrade B: .0012 Min. thicknessGrade C: .0010 Min. thicknessGrade D: .0008 Min. thicknessGrade E: .0006 Min. thicknessGrade F: .0004 Min. thicknessGrade G: .0002 Min. thicknessClass 2: For engineering applications
Electro less Nickel plating, Nickel is generally used as a semi-bright white corrosion resistant finish. Electro less nickel plates with unusually uniform dimensional build up on parts so that you dont get thick regions at outside corners and thin regions at inside corners and in cavities. Also, E-Nickel is hard and offers good wear resistance. The corrosion resistance improves with increasing phosphorous content. We offer both mid-phosphorus and high-phosphorus E-Nickel solutions. E-Nickel (Plating is) plates very well to many types of aluminum and therefore serves as an excellent base for precious metals, which generally dont adhere well to aluminum. Mil Spec C26074
ECIL, HYDERABAD, Telangana 