Kohesi Bond

Bhandup West, Mumbai, Maharashtra

Kohesi Bond KB 1427 HT is a marvelous single component epoxy system for bonding, coating, sealing and casting applications. Although it requires a minimum temperature of 150C for curing, it can achieve faster cures at elevated temperatures. KB 1427 HT offers an extremely wide serviceable temperature range of -60C to +340C, with a roaring glass transition temperature (Tg) of 220C 230C. This products exquisite flow properties and unlikely low exotherm makes it ideal for use in casting well beyond 12 inch thicknesses. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides first-rate mechanical strength properties and dimensional stability. In addition to superior electrical insulation, KB 1427 HT also offers astounding chemical resistance to a variety of fuels, oils and water even at higher temperatures. It has a tan color. It is highly recommended to post cure the epoxy at 180C for 2 12 hours in order to achieve optimum properties. Owing to its magnificent performance and ease of use, KB 1427 HT is ideal for use in aerospace, oil and chemical processing, electronics and various OEM applications.PRODUCT HIGHLIGHTSServiceable up to 340CAdmirable chemical resistanceExcellent flow propertiesLow exotherm upon curingSuperior electrical insulationUnlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Coating, Sealing, Casting Packing : Cans, Pails, Syringes Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi Bond KB 1427 HT-3 is an exclusive one component epoxy system that can cure completely in 2 - 3 minutes at 150C. Although it requires a minimum temperature of 120C for curing, it cures equally fast (3 - 5 minutes) at that temperature. KB 1427 HT-3 offers an extremely wide serviceable temperature range of -50C to +200C, with an impressive glass transition temperature (Tg) of 120C. This product's unlikely low exotherm makes it ideal for use in potting up to 14 inch thicknesses. Being a one component system, it requires no mixing and provides ease of application. This epoxy system will not set-up unless heated above 100C. KB 1427 HT-3 also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides outstanding mechanical strength properties and dimensional stability. In addition to superior electrical insulation, KB 1427 HT-3 also offers first-rate chemical resistance. It has a yellow - brown color. This product is available in a paste version as well as in a toughened version for enhanced resistance to mechanical shock and thermal cycling. Owing to its splendid performance and ease of use, KB 1427 HT-3 is ideal for use in aerospace, electronics, chemical processing and various OEM applications. PRODUCT HIGHLIGHTSSuperb electrical insulationSnap curingImpressive chemical resistanceCastable up to 14 inch thicknessesGlass transition temperature (Tg) of 120CUnlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing, Potting, Encapsulation Industrial Certification : RoHS Compliant

Kohesi Bond KB 1613 HT is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 1613 HT offers an extensive serviceable temperature range of -50C to +200C. This product can be easily stored at room temperature or in a refrigerator. Being a one component system, it provides ease of application and also adheres well to a broad variety of substrates including metals, ceramics, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. KB 1613 HT is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. In addition to superior electrical insulation, KB 1613 HT also offers phe-nomenal chemical resistance to a variety of acids, bases, fuels, oils and water. This epoxy is available in a non-drip, non-sag viscosity which can even be applied on vertical surfaces without dripping. It has a tan brown color. With a unique combination of remarkable performance, ease of use and excellent mechanical strength properties, KB 1613 HT is universally used in electronics, electrical, aerospace and various other industries. PRODUCT HIGHLIGHTSSuperior shear strength propertiesWide serviceable temperature rangeExtremely fast cureOutstanding dimensional stabilitySuperb electrical insulatorUnlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing, Coating Industrial Certification : RoHS Compliant

Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working life at room temperature. Unlike other one component epoxies, this product can be cured at temperatures as low as 80C. Although superlative properties are obtained with higher temperature cures, good mechanical strength properties and dimensional stability are furnished by 80C cures as well. KB 1613 R80 offers an extensive serviceable temperature range of -70C to +180C. This products exquisite flow properties and lower exotherm makes it ideal for use in potting and encapsulation applications for 12 thicknesses and beyond. KB 1613 R80 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and thermal conductivity, KB 1613 R80 also offers astounding chemical resistance to a variety of fuels, oils and water. It has a tan yellow color. With a unique combination of remarkable performance, ease of use and speedy cures at convenient temperatures, KB 1613 R80 is widely used in electronics, aerospace, major OEM and similar applications. PRODUCT HIGHLIGHTSThermally conductiveLower exotherm while curingExpeditious cures at 80C or higherSuperior dimensional stabilityExceptional electrical insulation propertiesUnlimited working life at room temperature TYPICAL APPLICATIONS : Potting, Encapsulation, Sealing, Coating, Bonding Industrial Certification : RoHS Compliant

Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 1613 RLV offers an extensive serviceable temperature range of -50C to +180C. This product's exquisite flow properties makes it ideal for use in underfill, potting and encapsulation applications. Being a one component system, it provides ease of application and also adheres well to an encyclopedic variety of substrates including metals, ceramics, most plastics and glass. It provides sterling mechanical strength properties and dimensional stability. KB 1613 RLV offers phenomenal thermal conductivity of 1 - 1.2 WmK. In addition to superior electrical insulation, KB 1613 RLV also offers astounding chemical resistance to a variety of fuels, oils and water. It has a light yellow color, but it can be color matched to your specifications upon request. With a unique combination of remarkable performance, ease of use and excellent mechanical strength properties, KB 1613 RLV is widely used in electronics and microelectronics packaging and assembly applications. PRODUCT HIGHLIGHTSThermally conductiveCastable up to 1 inch thicknessesRapid cures at elevated temperaturesSuperior dimensional stabilityExceptional electrical isolatorUnlimited working life at room temperature TYPICAL APPLICATIONS : Underfill, Potting, Encapsulation, Sealing, Coating Industrial Certification : RoHS Compliant

Kohesi bond tuf 1613 ht-gt is a single component, toughened epoxy system that requires no mixing and cures rapidly at elevated temperatures. Although it requires a minimum temperature of 120c for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. Tuf 1613 ht-gt offers an extensive serviceable temperature range of -70c to +200c. Being a one component system, it provides ease of application and also adheres well to a broad variety of substrates including metals, ceramics, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. This product has the ability to withstand arduous thermal cycling and shock. Tuf 1613 ht-gt is a 100% solids and a reactive system i.e. It does not contain any solvents or diluents. It offers minimum shrinkage upon cure and can be cast up to 18 inch thicknesses. In addition to superior electrical insulation, tuf 1613 ht-gt also offers phenomenal thermal conductivity (1.8 - 2 wmk). It has a tan- yellow color. With a unique combination of remarkable performance, this multi-functional epoxy system is universally used as a glob top or die attach and also as an adhesive in various electronics and electrical applications. product highlightslow ionic contentoutstanding thermal conductivityresists thermal shock and cyclingfast curingexcellent dimensional stabilityunlimited working life at room temperature typical applications : glob top, coating, sealing, potting, encapsulation industrial certification : rohs compliant

Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 - 70 minutes at 120C and even faster at higher temperatures. TUF 1820 AOHT offers a sweeping serviceable temperature range of 4K (-269.15C) to +200C. This product can withstand severe thermal cycling and shocks even at cryogenic temperatures. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides phenomenal bonding and physical strength properties, as well as dimensional stability. It offers a startling tensile lap shear strength of over 3, 800 psi. TUF 1820 AOHT is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. In addition to superior electrical insulation, TUF 1820 AOHT also offers very good thermal conductivity. It has a gray color. It also extends first-rate chemical resistance to a variety of solvents, fuels and water. Owing to its high-caliber performance and ease of use, TUF 1820 AOHT is widely used in various other electronics, optoelectronic, aerospace and specialty OEM applications. PRODUCT HIGHLIGHTSExcellent thermal conductivityCryogenically serviceableStellar mechanical strength propertiesOutstanding dimensional stabilityResistance to extreme thermal cyclingUnlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing Industrial Certification : RoHS Compliant

Kohesi Bond TUF 1820 HTS is a toughened, single component, silver conductive epoxy system that requires no mixing and offers an unlimited working life at room temperature. Firstly, this product offers phenomenal electrical as well as thermal conductivity. It cures in merely 60 80 minutes at 120C and even faster at higher temperatures. TUF 1820 HTS offers an extremely wide serviceable temperature range of 4K (-269.15C) to +200C. This product can withstand severe thermal cycling and shocks even at cryogenic temperatures. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties as well as outstanding dimensional stability. TUF 1820 HTS is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. It has a silver gray color. It also extends first-rate chemical resistance to a variety of acids, bases, fuels and water. Owing to its dazzling performance, capability of passing NASA low outgassing test and ease of use, TUF 1820 HTS is widely used in demanding electronics, optoelectronic, aerospace, specialty OEM and various vacuum based applications. PRODUCT HIGHLIGHTSSilver filledelectrically conductiveCryogenically serviceableSuperb mechanical strength propertiesFirst-rate peel strengthCapable of passing NASA low outgassingUnlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi bond kb 1040-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating and encapsulating applications. It has a favorable 10:1 (part a: part b) mix ratio by weight. The highlight of this products is its superior optical clarity and its capability of passing nasa low outgassing test. In addition, this product offers very good flow properties, allowing it to be applied in extremely thin layers. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70c - 90c for 3 - 5 hours. Kb 1040-2 can be serviced cryogenically. It offers an extensive serviceable temperature range of 4k (-269.15c) to +150c. It is a phenomenal adhesive that offers outstanding physical strength properties. Kb 1040-2 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and dimensional stability, it also offers astounding chemical resistance to a variety of acids, bases, solvents, fuels, oils and water. This unique product's vacuum compatibility, light transmission capability and strength makes it ideal for use in aerospace, electronics, optical, fiber-optic and various oem applications. Product highlightsoutstanding optical claritycryogenically serviceablesuperior resistance to a variety of chemicalstremendous mechanical strength propertiesexceptional electrical insulatorcapable of passing nasa low outgassing typical applications : bonding, sealing, coating, encapsulation, potting industrial certification : rohs compliant and nasa (low outgassing astm e-595)

Kohesi bond kb 10473 fl is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (part a: part b) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70c - 90c for 3 - 5 hours. Kb 10473 fl is optically clear and offers top notch light transmissions properties. It has a refractive index of 1.51. It offers an extensive serviceable temperature range of 4k (-269.15c) to +120c. This phenomenal adhesive fosters outstanding resistance to mechanical and thermal shocks, even at cryogenic temperatures. It offers minimal shrinkage upon cure. Kb 10473 fl adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers lower exotherm, making it ideal for stress free bonding. Part a and part b are clear in color. Kb 10473 fl is widely used in optical, optoelectronic, fiber-optic, electronics and related industries especially where optical clarity, cryogenic serviceability and high flexibility are desired. Product highlightssuperior optical clarityexcellent flow propertiesphenomenal flexibilityvery low exothermideal for castingexceptional electrical insulation propertiesresists mechanical and thermal shocks typical applications : bonding, sealing, coating, potting, encapsulation industrial certification : rohs compliant

Kohesi bond kb 10473 flao is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (part a: part b) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70c - 90c for 3 - 5 hours. Kb 10473 flao is thermally conductive and offers top notch conductivity of 1.4 - 1.5 wmk. It is cryogenically serviceable and offers an extensive serviceable temperature range of 4k (-269.15c) to +120c. This phenomenal adhesive fosters outstanding resistance to mechanical and thermal shocks. It offers minimal shrinkage upon cure. Kb 10473 flao adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers lower exotherm, making it ideal for stress free bonding. Part a and part b are off-white in color. Kb 10473 flao is widely used in optical, optoelectronic, fiber-optic, electronics and related industries especially where excellent thermal conductivity, cryogenic serviceability and high flexibility are desired. Product highlightssuperior thermal conductivityexcellent flow propertiesphenomenal flexibilityvery low exothermideal for castingexceptional electrical insulation propertiescapable of passing nasa low outgassing typical applications : bonding, sealing, coating, potting, encapsulation industrial certification : rohs compliant and nasa (low outgassing astm e-595)

Kohesi bond kb 1048 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:0.33 (part a: part b) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70c - 90c for 3 - 5 hours. Kb 1040 is optically clear and offers top notch light transmissions properties. It has a smooth glossy appearance upon cure. It offers an extensive serviceable temperature range of -50c to +120c. This phenomenal adhesive fosters outstanding mechanical strength properties, especially under tensile and compression. It offers minimal shrinkage upon cure and cures rigid. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of fuels, oils, acids, bases and boiling water. Part a is clear in color and part b light yellow - clear in color. Kb 1048 is widely used in optical, aerospace, electronics, pipes, tanks, fittings and related oem industries. Product highlightssuperior optical clarityexcellent chemical resistancesuperior mechanical strength propertiesgood flow propertiesexceptional electrical insulation propertiesvery good dimensional stability typical applications : bonding, sealing, coating, potting, encapsulation industrial certification : rohs compliant

Kohesi Bond KB 1085-1 is a two component, graphite filled epoxy system suitable for bonding, sealing and coating. It has a favorable 100:15 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and a outstanding dimensional stability. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C - 90C for 3 - 5 hours. KB 1085-1 offers a volume resistivity of 50 - 100 ohm-cm. This makes it ideal for static dissipation, grounding and EMIRFI shielding applications. Being graphite filled, this product is non-magnetic in nature and offers slight lubricity. It offers an extensive serviceable temperature range of -50C to +120C. It is a phenomenal adhesive that offers superb physical strength properties and adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical, it also offers astounding chemical resistance to a variety of acids, bases, oils and water. Part A and Part B are black in color. Owing to its versatile performance, KB 1085-1 is widely used in electronics, aerospace, semiconductor, microwave and many OEM applications where a non-metallic conductive epoxy is required. PRODUCT HIGHLIGHTSGraphite filledelectrically conductiveNon-magneticOffers good lubricityIdeal for static dissipation and groundingFirst-rate dimensional stabilityVery good shielding against EMIRFI TYPICAL APPLICATIONS : Bonding, Sealing, Coating Industrial Certification : RoHS Compliant

Kohesi Bond KB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:30 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C - 90C for 3 - 5 hours. KB 1151 S-1 is uniquely formulated for protection against harsh chemicals, especially fuels and solvents. Additionally, it contains no solvents or diluents, making it a 100% reactive system. It offers an extensive serviceable temperature range of -50C to +150C. This superior adhesive fosters outstanding physical strength properties. It offers very low shrinkage upon cure and excellent flow properties. In addition, it has superior electrical insulation properties. Part A is clear, whereas Part B is amber clear in clear. This product can be formulated in a non-drip viscosity as well. KB 1151 S-1 is widely used in electronic, aerospace, chemical processing and specialty OEM applications where resistance to solvents and fuels is critical. PRODUCT HIGHLIGHTSSuperior chemical resistanceVery good flow propertiesProtects against fuels and solventsOutstanding mechanical strength propertiesExcellent electrical insulation propertiesContains no solvent; 100% reactive TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Potting, Encapsulation Industrial Certification : RoHS Compliant

Kohesi Bond KB 1372 LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating and encapsulation. It has a favorable 100:25 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It offers a long working life at room temperature of over 12 - 24 hours and cures quickly at elevated temperatures. It can be cured easily by adding heat at 60C - 70C for 8 - 10 hours or 80C - 100C for 60 - 90 minutes or 125C for 30 - 60 minutes. In order to optimize its performance properties, it is highly recommended to post cure at 100C - 150C for 3 - 4 hours. KB 1372 LP is specially formulated for resistance to harsh chemicals. It can hold up to many aggressive chemicals, including water, fuels, oils, solvents, acids and bases. Additionally it is optically clear and cures rigid. This superior adhesive fosters outstanding physical strength and electrical insulation properties. It offers very low shrinkage upon cure and excellent flow properties. KB 1372 LP is widely used in optical, optoelectronic, electronics, fiber-optic and aerospace industries, where optical clarity, low exotherm and chemical and high temperature resistance are key requirements. PRODUCT HIGHLIGHTSSuperior optical clarityVery good flow propertiesWithstands very high temperaturesOutstanding mechanical strength propertiesExcellent electrical insulation propertiesPhenomenal resistance to various chemicals TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Encapsulation Industrial Certification : RoHS Compliant

Kohesi Bond KB 1372-AO is a two component, heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkabley high glass transition temperature (Tg) of > 172C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures. It takes 4 - 6 hours to cure at 70C, 20 - 40 minutes at 100C and 10 minutes at 125C. Kb 1372-AO is an aluminum oxide filled system, offering first-rate thermal conductivity. It offers very long working life at room temperature, allowing to bond large parts. It has an extensive serviceable temperature range of -50C to +230C. This phenomenal adhesive fosters outstanding mechanical strength properties, along with dimensional stability. KB 1372-AO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of acids, bases, solvents and other chemicals. Part A and Part B are off-white in color. KB 1372-AO is widely used in applications requiring excellent chemical resistance at elevated temperatures, long open time and very high thermal conductivity. PRODUCT HIGHLIGHTSExceptionally high TgVery good flow propertiesSuperior chemical resistanceLong working life at room temperatureExceptional electrical insulation propertiesPhenomenal thermal conductivity TYPICAL APPLICATIONS : Bonding, Sealing, Coating Industrial Certification : RoHS Compliant

Kohesi Bond KB 1372-LO is a two component, room heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkabley high glass transition temperature (Tg) of > 172C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures. It takes 4 - 6 hours to cure at 70C, 20 - 40 minutes at 100C and 10 minutes at 125C. KB 1372-LO is capable of passing NASA standards for low outgassing (ASTM E-595). It offers very long working life at room temperature, allowing to bond large parts. It has an extensive serviceable temperature range of -50C to +230C. This phenomenal adhesive fosters outstanding mechanical strength properties, along with dimensional stability. KB 1372-LO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of acids, bases, solvents and other chemicals. Part A is clear in color and Part B is dark brown in color. KB 1372-LO is widely used in applications requiring excellent chemical resistance at elevated temperatures, long open time and outgassing properties. PRODUCT HIGHLIGHTSExceptionally high TgVery good flow propertiesSuperior chemical resistanceLong working life at room temperatureExceptional electrical insulation propertiesCapable of passing NASA low outgassing TYPICAL APPLICATIONS : Bonding, Sealing, Coating Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi Bond KB 1452 HT-2 is a two component, room temperature curing, medical grade epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C - 90C for 3 - 5 hours. KB 1452 HT-2 is capable of passing USP Class VI medical testing. It can withstand multiple cycles of medical sterilizations, such as autoclaving, ethylene oxide (EtO), radiation and chemical. It offers an extensive serviceable temperature range of -50C to +230C. This phenomenal adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure and is castable up to 3 inches depth. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of fuels, oils and water. It is amber clear in color. KB 1452 HT-2 is widely used in the medical industry for making catheters, surgical instruments and endoscopes, among others. PRODUCT HIGHLIGHTSHigh glass transition temperatureResists multiple sterilization cyclesCastable up to 3 inches; ideal for pottingSuperior chemical resistanceExceptional electrical insulation propertiesCapable of passing USP Class VI testing TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Potting, Encapsulation Industrial Certification : RoHS Compliant and USP Class VI Biocompatibility Test

Kohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 100:40 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C - 90C for 3 - 5 hours. However, speedy cures are achievable with a straight heat cure as well at elevated temperatures. KB 1452 HT-2AO offers an extensive serviceable temperature range of -70C to +200C. It is a phenomenal adhesive that offers outstanding physical strength properties and dimensional stability. KB 1452 HT-2AO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of organic and inorganic acids, solvents, alkalis, aromatic hydrocarbons, oils and water. Part A has a gray color and Part B has an off-white color. Owing to its high thermal conductivity and very low CTE, KB 1452 HT-2AO is widely used in medical, electronics, aerospace, optical, semiconductor and various OEM applications requiring effective heat transfer capabilities. PRODUCT HIGHLIGHTSVery high thermal conductivityLow coefficient of thermal expansionCastable up to 3 inches depthOutstanding chemical resistanceExceptional electrical insulation propertiesVery good flowability TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Encapsulation, Potting Industrial Certification : RoHS Compliant

Kohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns. The efficiency of heat transfer improves exceedingly with lower thermal resistance. This can be explained easily with the following formula: R = lK [''R''] is the thermal resistance; "l" is the adhesive layer thickness; "K" is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive adhesives (alumina filled) that are applicable in more than 50 micron thicknesses, offer a thermal resistance of 35 - 40 x 10-6 m2KW. Since KB 1458 TC can be applied in 10 micron thick sections, it offers a notably low thermal resistance of 5 - 6 x 10-6 m2KW. KB 1458 TC has a wide serviceable temperature range of -70C to +150C. It adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties and very low shrinkage upon cure. In addition, it offers excellent dimensional stability and a very low coefficient of thermal expansion (CTE). Part A and Part B are gray in color. Owing to its sensational thermal management properties KB 1458 TC is widely used in electronics, optical and specialty OEM industries. PRODUCT HIGHLIGHTSUnrivaled heat transfer efficiencyLow coefficient of thermal expansion (CTE)Superb mechanical strength propertiesMicrons thin bond lines achievablePhenomenal electrical insulation propertiesUnlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing Industrial Certification : RoHS Compliant

Kohesi Bond KB 1600 FR-V is a two component epoxy system that offers a convenient to use mix ratio of 1:1 by weight. This flame retardant epoxy is capable of passing the vertical burn test specifications as per Amendment 25-116 and Part 25 Appendix F of the FAR standards. Additionally, it contains a non-halogenated filler, making it easy to handle and environmentally friendly. The optimum cure schedule for KB 1600 FR-V would be an overnight room temperature set-up followed by an addition of heat at 90C for 3 - 5 hours. KB 1600 FR-V offers an extensive serviceable temperature range of -51C to +121C. This product's flow properties and long working time makes it ideal for use in potting and encapsulation applications. In addition to ease of application, KB 1600 FR-V adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. KB 1600 FR-V offers phenomenal electrical insulation. It also offers astounding chemical resistance to a variety of fuels, oils, common solvents and water. Part A has a black color and Part B has a white color. This system's color coding aids in proper mixing. Its capability of meeting the FAR standards makes it ideal for use in aviation and avionic related applications, such as door and floor assemblies, interior panels and electronic potting and sealing. PRODUCT HIGHLIGHTSCan pass FAR standard CFR 25.853 (a)Capable of passing vertical burn testNon-halogen fillerLow shrinkage upon cureConvenient mix ratio of 1:1 by weightExcellent electrical insulation properties TYPICAL APPLICATIONS : Bonding, Coating, Potting, Encapsulation, Casting Industrial Certification : RoHS Compliant and FAR 25.853 (Federal Aviation Regulation)

Kohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Primarily, it offers stellar thermal conductivity, making it ideal for heat transfer applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C - 90C for 3 - 5 hours. KB 1631 ANHT being a filled system, offers first-rate dimensional stability and exceptionally low coefficient of thermal expansion. It offers an extensive serviceable temperature range of -50C to +200C. It is a phenomenal adhesive offering preeminent physical strength properties. KB 1631 ANHT adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, and thermal conductivity, it also offers astounding chemical resistance to a variety of acids, bases, fuels, oils and water. Part A has a light gray color and Part B has a gray color. Owing to its remarkable performance and heat transfer capabilities KB 1631 ANHT is widely used in electronics, aerospace, quality OEM and other similar industries. PRODUCT HIGHLIGHTSSuperior thermal conductivityEasy 1:1 mix ratio by weight or volumeResistant to temperatures as high as 200CSuperior dimensional stabilityExceptional electrical insulation propertiesLow coefficient of thermal expansion TYPICAL APPLICATIONS : Bonding, Sealing, Coating Industrial Certification : RoHS Compliant

Kohesi bond kb 1631 aolv-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70c - 90c for 3 - 5 hours. Kb 1631 aolv-1 offers an extensive serviceable temperature range of -50c to +120c. Also, it is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (cte). Kb 1631 aolv-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and thermal conductivity, kb 1631aolv-1 also offers astounding chemical resistance to a variety of fuels, oils and water. Part a has a gray color and part b has an off-white color. Owing to its remarkable performance and ease of use kb 1631 aolv-1 is widely used in electronics, optoelectronic, major oem and similar applications. Product highlightssuperior thermal conductivitylow coefficient of thermal expansion (cte)excellent flow propertiessuperior dimensional stabilityexceptional electrical insulation propertieseasy mix ratio of 1:1 by weight or volume typical applications : potting, encapsulation, sealing, coating, bonding industrial certification : rohs compliant

Kohesi bond kb 1631 fr-2 is a two component, room temperature curing epoxy system. This flame retardant epoxy generates low smoke and contains a non-halogenated filler. Although kb 1631 fr-2 cures hard at room temperature, the optimum cure schedule would be an overnight room temperature set-up followed by an addition of heat at 90c for 2 - 3 hours. Kb 1631 fr-2 offers an extensive serviceable temperature range of -51c to +90c, as per ul 94v-0 specification. This product's exquisite flow properties makes it ideal for use in potting and encapsulation applications. In addition to ease of application, kb 1631 fr-2 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. It provides superior mechanical strength properties and dimensional stability. Kb 1631 fr-2 offers phenomenal electrical insulation. It also offers astounding chemical resistance to a variety of fuels, oils, lubricants and water. Part a has a black color and part b has an off white color. Also, it has a very convenient 1:1 mix ratio by weight. With a unique combination of remarkable performance, ease of use and excellent flame retardant properties, kb 1631 fr-2 is widely used in electronics , microelectronics, aerospace and various oem applications. Product highlightscan pass ul94v-0 flame retardant testextremely low smoke generationnon-halogen fillerroom temperature cureconvenient mix ratio of 1:1 by weightexcellent resistance to fuels and water typical applications : potting, encapsulation, casting industrial certification : rohs compliant and ul94v - 0

Kohesi bond kb 1631 htc-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (part a: part b) mix ratio by weight. Most importantly, it offers stellar thermal conductivity and is capable of passing nasa low outgassing test. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70c - 90c for 3 - 5 hours. Kb 1631 htc-1 can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4k (-269.15c) to +200c. It is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (cte). Kb 1631 htc-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, dimensional stability and thermal conductivity, kb 1631 htc-1 also offers astounding chemical resistance to a variety of acids, bases, fuels, oils and water. Part a and part b have an off-white color. Owing to its remarkable performance and vacuum compatibility kb 1631 htc-1 is widely used in electronics, semiconductor, cryogenic and major oem applications. Product highlightssuperior thermal conductivitylow coefficient of thermal expansion (cte)thixotropic pastesuperior dimensional stabilityexceptional electrical insulation propertiescapable of passing nasa low outgassing typical applications : bonding, sealing industrial certification : rohs compliant and nasa (low outgassing astm e-595)

Kohesi bond kb 1686 m is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (part a: part b) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and dimensional stability. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70c - 90c for 3 - 5 hours. Kb 1686 m offers a volume resistivity of 5 - 10 ohm-cm. It is ideal for use in static dissipation and emirfi shielding applications. It offers an extensive serviceable temperature range of -50c to +120c. It is an outstanding adhesive that offers superb physical strength properties, allowing it to adhere well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.3 - 1.4 wmk), it also offers astounding chemical resistance to various cleaning agents, oils and water. Part a and part b are gray in color. It has a thixotropic paste like consistency and a very low coefficient of thermal expansion (cte). Owing to its versatile performance, kb 1686 m is widely used in electronics, aerospace, electrical, semiconductor, microwave and many oem applications. Product highlightseasy mix ratio of 1:1 by weight or volumeoutstanding dimensional stabilitysuperior thermal conductivityhigh lap shear strength (> 2100 psi)nickel filledelectrically conductive100% solids system typical applications : bonding, sealing, coating industrial certification : rohs compliant

Kohesi bond kb 1689 is a two component, toughened, silver coated nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (part a: part b) mix ratio by weight. Firstly, it offers very good electrical conductivity and very low shrinkage upon cure. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70c - 90c for 3 - 5 hours. Kb 1689 can withstand severe thermal cycling and shocks even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4k (-269.15c) to +135c. It is an outstanding adhesive that offers superb bond strength, peel strength and toughness, allowing it to bond dissimilar substrates with different coefficients of thermal expansion. Kb 1689 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.8 - 2.3 wmk), it also offers astounding chemical resistance to a variety of fuels, oils and water. Part a and part b have a gray color. Owing to its versatile performance, kb 1689 is widely used in electronics, aerospace, electrical, semiconductor, microwave and various oem applications. Product highlightseasy mix ratio of 1:1 by weightoutstanding toughnesssuperior thermal conductivitycost effectivevery low volume resistivity (< 0.005 ohm-cm)cryogenically serviceable typical applications : bonding, sealing industrial certification : rohs compliant

Kohesi bond tuf 1452 ht-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (part a: part b) mix ratio by weight or 100:50 (part a: part b) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70c - 90c for 3 - 5 hours. Tuf 1452 ht-2 is a toughened system, offering low exotherm and a long working life. It can withstand multiple cycles of thermal and mechanical shocks. It offers an extensive serviceable temperature range of -60c to +220c. This phenomenal adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure and is suitable for medium sized castings. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of acids, bases, solvents, fuels, oils and water. Part a has a tan-brown color and part b has an amber color. Tuf 1452 ht-2 is widely used in the electronics, aerospace and various oem applications. Product highlightshigh glass transition temperatureresists thermal and mechanical shocksvery good flow propertiessuperior chemical resistanceexceptional electrical insulation propertiesphenomenal toughness typical applications : bonding, sealing, coating, potting, encapsulation industrial certification : rohs compliant