Feature : Capable of high thermal conductivity,Bleed resistant, non-drying, non-melt and non-curing in nature.
Application : used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers.
Based in Uttar Pradesh, India, we are active as Manufacturer, Supplier and Exporter of Heat Sink Compound all over the globe. Our Heat Sink Compound is non-curing, water resistant paste heavily filled with heat conductive metallic oxides in a Silicone base. It is comprehensively more...
For Buyer 
For Seller 
Help 
