Welcome to Expert Laptop Service Center
Manufacturer / Exporter / Supplier / Retailer Of digital charger, Laptop Touchpad, bga reballing machine, CPU Tester, Oscilloscope CRO Machine, Laptop Battery Tester, debug card
Welcome to Expert Laptop Service Center
Manufacturer / Exporter / Supplier / Retailer Of digital charger, Laptop Touchpad, bga reballing machine, CPU Tester, Oscilloscope CRO Machine, Laptop Battery Tester, debug card
Since the mainstream of the new ICs chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package’s soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.
Since the mainstream of the new ICs chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package’s soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.
Since the mainstream of the new ICs chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package’s soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.
Since the mainstream of the new IC’s chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package’s soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.
Advance BGA Machine suppliers Company in Delhi India. Since the mainstream of the new IC's chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, Bga reballing machine.BGA package's soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced.BGA MACHINE suppliers Company in Delhi India. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.
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