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Coimbatore, Tamil Nadu, India
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Printed Circuit Board #5482706

Double Sided PCB

Double-sided printed circuit boards have wiring patterns on both sides of the insulating material, i.e. the circuit pattern is available both on the components side and the solder side. Obviously, the component density and the conductor lines are higher than the single-sided boards. Double-sided PTH board has circuitry on both sides of an insulating substrate, which is connected by metallizing the wall of a hole in the substrate that intersects the circuitry on both sides. This technology, which is the basis for most printed circuits produced, is becoming popular in cases where the circuit complexity and density is high.
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Multilayer PCB

A multilayer PCB board is used in situations where the density of connections needed is too high to be handled by two layers or where there are other reasons such as accurate control of line impedances or for earth screening. A multilayer PCB contains two reference planes and a signal via. The signal via allows a signal to flow through all the planes. A stitching via is connected to one of the planes next to the signal via and serves to reduce the area through which the signal passes through. This is very important as it may assist in reducing noise and cross talk.
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Metal Core PCB

As Metal Core PCB means the base material for PCB is metal, but not normal FR4CEM1-3, etc, and currently what the metal used are Aluminum, Copper alloy. MCPCBs are used instead of traditional FR4 or CEM3 PCBs because of the ability to efficiently dissipate heat away from the components. This is achieved by using a Thermally Conductive Dielectric Layer. The main difference between a FR4 board and MCPCB is the thermally conductive dielectric material in the MCPCB. This acts as a thermal bridge between the IC components and metal backing plate. Heat is conducted from the package through the metal core to an additional heat sink. On the FR4 board the heat remains stagnant if not transferred by a topical heatsink. According to Avagos white paper a MCPCB with a 1W LED remained near an ambient of 25C, while the same 1W LED on a FR4 board reached 12C over ambient.
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Manufacturer of Printed Circuit Board from Coimbatore, Tamil Nadu by Electro Track
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Printed Circuit Board

Our product range contains a wide range of Double sided PCB, Multilayer PCB and Metal Core PCB

Double Sided PCB

Double-sided printed circuit boards have wiring patterns on both sides of the insulating material, i.e. the circuit pattern is available both on the components side and the solder side. Obviously, the component density and the conductor lines are higher than the single-sided boards. Double-sided PTH board has circuitry on both sides of an insulating substrate, which is connected by metallizing the wall of a hole in the substrate that intersects the circuitry on both sides. This technology, which is the basis for most printed circuits produced, is becoming popular in cases where the circuit complexity and density is high.
View Complete Details

Multilayer PCB

A multilayer PCB board is used in situations where the density of connections needed is too high to be handled by two layers or where there are other reasons such as accurate control of line impedances or for earth screening. A multilayer PCB contains two reference planes and a signal via. The signal via allows a signal to flow through all the planes. A stitching via is connected to one of the planes next to the signal via and serves to reduce the area through which the signal passes through. This is very important as it may assist in reducing noise and cross talk.
View Complete Details

Metal Core PCB

As Metal Core PCB means the base material for PCB is metal, but not normal FR4CEM1-3, etc, and currently what the metal used are Aluminum, Copper alloy. MCPCBs are used instead of traditional FR4 or CEM3 PCBs because of the ability to efficiently dissipate heat away from the components. This is achieved by using a Thermally Conductive Dielectric Layer. The main difference between a FR4 board and MCPCB is the thermally conductive dielectric material in the MCPCB. This acts as a thermal bridge between the IC components and metal backing plate. Heat is conducted from the package through the metal core to an additional heat sink. On the FR4 board the heat remains stagnant if not transferred by a topical heatsink. According to Avagos white paper a MCPCB with a 1W LED remained near an ambient of 25C, while the same 1W LED on a FR4 board reached 12C over ambient.
View Complete Details
Tell Us What are you looking for? Will call you back

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