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Compass Technology Company Limited
location Hong Kong, China

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Our Products

  1. Electric Circuit Components & Parts 15 Products available
  2. Chips 7 Products available

  3. Printed Circuit Board

    2 Products available
  4. Others Products 13 Products available

Our Products

Our product range contains a wide range of Tape Ball Grid Array, Two Metal Layer Tape Ball Grid Array(Model-TBGA-02006), Model :- TBGA - 02003 Two Metal Layer Tape Ball Grid Array, Model :- TBGA - 02001 and Model :- TBGA - 02002

Flexible Printed Circuit Boards

Flexible Printed Circuit Boards

We Offer Flexible Printed Circuit Boards.specificationssize : 0.00484 to 0.01349 Width : 0.9 Mm Trace Spacing : 0.1 Mm Gold : 0.2 Um Max Nickel : 2.5 Um Min Thickness : 0.13 Mm No. of Vias : 20
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Flexible Printed Circuit Boards

Flexible Printed Circuit Boards

We are offering Printed Circuit Boards .Specifications:Size : 0.05159 to 0.020Width : 0.9 mmTrace Spacing : 0.23 mm Gold : 0.1 umNickel : 4.0 um maxThickness : 0.5 mmNo. of Vias : 0
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Tape Ball Grid Array

Tape Ball Grid Array

We Offer Tape Ball Grid Array.specificationssize : 0.04 to 0.04 Width : 0.1 Mm Trace Spacing : 0.3 Mm Gold : 0.7 Um Min Nickel : 1.5 Um Min Thickness : 0.18 Mm No. of Vias : 0
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Model :- TBGA - 02003 Two Metal Layer Tape Ball Grid Array

Model :- TBGA - 02003 Two Metal Layer Tape Ball Grid Array

We Offer two Metal Layer Tape Ball Grid Array. Features Dielectric Film Having Each Side with Signal/power Layer and Ground Plane Layer. this Results in Excellent Electrical Properties that Result in More Efficiency in Devices. the Two Metal Layer Tape Ball Grid Array is Specially Recommended for High Performance Tbga Package. applicationsservercomputersmedia Processorsmicroprocessorsroutermedical Equipmentprintersto Enquire About the Desired Product(s), Just Check the Box and Then Click inquiry Now Button Which is Provided Below.
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Two Metal Layer Tape Ball Grid Array(Model-TBGA-02006)

Two Metal Layer Tape Ball Grid Array(Model-TBGA-02006)

The Two Metal Layer Tape Ball Grid Array features dielectric film having each side with signal/power layer and ground plane layer. This results in excellent electrical properties that result in more efficiency in devices. The Two Metal Layer Tape Ball Grid Array is specially recommended for high performance TBGA package.
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Tape Ball Grid Array

Tape Ball Grid Array

We Offer Tape Ball Grid Array.specificationssize : 0.0306 to 0.0306 Width : 0.1 Mm Trace Spacing : 0.7 Mm Gold : 0.4 - 0.7 Um Nickel : 2.5 Um Min Thickness : 0.2 Mm No. of Vias : 0
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Model :- TBGA - 02001

Model :- TBGA - 02001

The Two Metal Layer Tape Ball Grid Array features dielectric film having each side with signal/power layer and ground plane layer. This results in excellent electrical properties that result in more efficiency in devices. The Two Metal Layer Tape Ball Grid Array is specially recommended for high performance TBGA package
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Model :- TBGA - 02002

Model :- TBGA - 02002

The Two Metal Layer Tape Ball Grid Array features dielectric film having each side with signal/power layer and ground plane layer. This results in excellent electrical properties that result in more efficiency in devices. The Two Metal Layer Tape Ball Grid Array is specially recommended for high performance TBGA package.
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Model :- TBGA - 02004

Model :- TBGA - 02004

The Two Metal Layer Tape Ball Grid Array features dielectric film having each side with signal/power layer and ground plane layer. This results in excellent electrical properties that result in more efficiency in devices. The Two Metal Layer Tape Ball Grid Array is specially recommended for high performance TBGA package.
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Model :- TBGA - 02005 Metal Layer Tape Ball Grid Array

Model :- TBGA - 02005 Metal Layer Tape Ball Grid Array

We Offer two Metal Layer Tape Ball Grid Array. Features Dielectric Film Having Each Side with Signal/power Layer and Ground Plane Layer. this Results in Excellent Electrical Properties that Result in More Efficiency in Devices. the Two Metal Layer Tape Ball Grid Array is Specially Recommended for High Performance Tbga Package. applicationsservercomputersmedia Processorsmicroprocessorsroutermedical Equipmentprintersto Enquire About the Desired Product(s), Just Check the Box and Then Click inquiry Now Button Which is Provided Below.
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Model :- TBGA - 01001 Metal Layer Tape Ball Grid Array

Model :- TBGA - 01001 Metal Layer Tape Ball Grid Array

We Offer one Metal Layer Tape Ball Grid Array Has the Die and Wire Attached Using Polymide-based Organic Substrate Having Metalized Trace Routing Using Solder Balls to Connect to the System Board. the Reduction in Wire Length Makes the Tape Ball Grid Array Perfect for High-speed that Require More Dense and Flexible Circuits. the Pattern Can Thus Be Implemented On to the Single Layer of Flexible Substrate. applicationsserverroutercomputersprintersmedia Processorsmicroprocessorsmedical Equipmentto Enquire About the Desired Product(s), Just Check the Box and Then Click inquiry Now Button Which is Provided Below.
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Model :- TBGA - 01002 Metal Layer Tape Ball Grid Array

Model :- TBGA - 01002 Metal Layer Tape Ball Grid Array

We Offer one Metal Layer Tape Ball Grid Array Has the Die and Wire Attached Using Polymide-based Organic Substrate Having Metalized Trace Routing Using Solder Balls to Connect to the System Board. the Reduction in Wire Length Makes the Tape Ball Grid Array Perfect for High-speed that Require More Dense and Flexible Circuits. the Pattern Can Thus Be Implemented On to the Single Layer of Flexible Substrate. applicationsserverroutercomputersprintersmedia Processorsmicroprocessorsmedical Equipmentto Enquire About the Desired Product(s), Just Check the Box and Then Click inquiry Now Button Which is Provided Below.
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Model :- COF - 004 Chip On Flex

Model :- COF - 004 Chip On Flex

Designed to Reduce Packaging Interconnect in Various Applications, the chip On Flex Offered By Us Has High Bending Strength. Cof Circuit Modules with High Flexibility are Suitable for Bending with Full Flexibility in Most Areas Except Those Needing Component Mounting. Reducing Packaging Constraints and Costs for Device Assembly, the Chip On Flex Packaging is also Used in Display Products. Thinner Than Rigid Pcbs, the Chip On Flex is Suitable for Designing and Manufacturing of Lightweight, Faster and Compact Electronic Products.
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Model :- TBGA - 01003

Model :- TBGA - 01003

The One Metal Layer Tape Ball Grid Array has the die and wire attached using polymide-based organic substrate having metalized trace routing using solder balls to connect to the system board. The reduction in wire length makes the Tape Ball Grid Array perfect for high-speed that require more dense and flexible circuits. The pattern can thus be implemented on to the single layer of flexible substrate.
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Chip Scale Package

Chip Scale Package

We Present Chip Scale Package Combining the Advantages of Flip Chip Assembly and Surface Mount Technology. Performance Benefits of Bare Die Chip Assembly and Encapsulated Package are Included in the Chip Scale Package, Which Can Be Standardized, Tested, Mounted On Surface and Reworked. Having a Number of Benefits, the Chip Scale Package Proves to Be An Excellent Alternative to Conventional Systems and Cost-effective as Well.
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