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Compass Technology Company Limited
location Hong Kong, China

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Our Products

  1. Electric Circuit Components & Parts 15 Products available
  2. Chips 7 Products available

  3. Printed Circuit Board

    2 Products available
  4. Others Products 13 Products available

Chips

We offer a complete product range of Chip-On-Flex, Model :- COF - 001 Chip on Flex, Chip on Flex, Model :- COF - 002 Chip on Flex and Model :- COF - 003 Chip on Flex

Chip-On-Flex

Chip-On-Flex

We Offer Chip-on-flex.specificationssize : 0.03182 to 0.019 Width : 0.2 Mm Trace Spacing : 0.2 Mm Gold : 0.4 Um Min Nickel : 0.8 Um Min Thickness : 0.2 Mm No. of Vias : 8
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Chip-On-Flex

Chip-On-Flex

We Offer Chip On Flex.specificationssize : 0.0198 to 0.0285 Width : 0.3 Mm Trace Spacing : 0.4 Mm Gold : 0.4 Um Min Nickel : 0.8 Um Min Thickness : 0.2 Mm No. of Vias : 0
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Model :- COF - 001 Chip On Flex

Model :- COF - 001 Chip On Flex

Designed to Reduce Packaging Interconnect in Various Applications, the chip On Flex Offered By Us Has High Bending Strength. Cof Circuit Modules with High Flexibility are Suitable for Bending with Full Flexibility in Most Areas Except Those Needing Component Mounting. Reducing Packaging Constraints and Costs for Device Assembly, the Chip On Flex Packaging is also Used in Display Products. Thinner Than Rigid Pcbs, the Chip On Flex is Suitable for Designing and Manufacturing of Lightweight, Faster and Compact Electronic Products.
Ask Latest Price & Details
Chip On Flex

Chip On Flex

Designed to Reduce Packaging Interconnect in Various Applications, the Chip On Flex Provided By Us Has High Bending Strength. Cof Circuit Modules with High Flexibility are Suitable for Bending with Full Flexibility in Most Areas Except Those Needing Component Mounting. Reducing Packaging Constraints and Costs for Device Assembly, the Chip On Flex Packaging is also Used in Display Products. Thinner Than Rigid Pcbs, the Chip On Flex is Suitable for Designing and Manufacturing of Lightweight, Faster and Compact Electronic Products.
Ask Latest Price & Details
Chip On Flex

Chip On Flex

Designed to Reduce Packaging Interconnect in Various Applications, the Chip On Flex Provided By Us Has High Bending Strength. Cof Circuit Modules with High Flexibility are Suitable for Bending with Full Flexibility in Most Areas Except Those Needing Component Mounting. Reducing Packaging Constraints and Costs for Device Assembly, the Chip On Flex Packaging is also Used in Display Products. Thinner Than Rigid Pcbs, the Chip On Flex is Suitable for Designing and Manufacturing of Lightweight, Faster and Compact Electronic Products.
Ask Latest Price & Details
Model :- COF - 002 Chip On Flex

Model :- COF - 002 Chip On Flex

Designed to Reduce Packaging Interconnect in Various Applications, the chip On Flex Offered By Us Has High Bending Strength. Cof Circuit Modules with High Flexibility are Suitable for Bending with Full Flexibility in Most Areas Except Those Needing Component Mounting. Reducing Packaging Constraints and Costs for Device Assembly, the Chip On Flex Packaging is also Used in Display Products. Thinner Than Rigid Pcbs, the Chip On Flex is Suitable for Designing and Manufacturing of Lightweight, Faster and Compact Electronic Products.
Ask Latest Price & Details
Model :- COF - 003 Chip On Flex

Model :- COF - 003 Chip On Flex

Designed to Reduce Packaging Interconnect in Various Applications, the chip On Flex Offered By Us Has High Bending Strength. Cof Circuit Modules with High Flexibility are Suitable for Bending with Full Flexibility in Most Areas Except Those Needing Component Mounting. Reducing Packaging Constraints and Costs for Device Assembly, the Chip On Flex Packaging is also Used in Display Products. Thinner Than Rigid Pcbs, the Chip On Flex is Suitable for Designing and Manufacturing of Lightweight, Faster and Compact Electronic Products.
Ask Latest Price & Details
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