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Vadodara, Gujarat, India
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Other Products / Services #32383

Diamond Sawing System

Low weight loss compared to other flash lamp based machines.
Maintenance Free: No need of alignment.
Smooth cutting surface.
Breakage rate almost 'NIL'
Ergonomic Design with Aluminium extruded structure
User Friendly software
View Complete Details

Diamond Blocking System

Automatic Direction Change
Unique Push-Fit System
Longer Scaif Life
Perfect Weight Control Device

Blocking & Polishing for any diamond bigger than 5 cent in size.

Full travel in diamond scaif surface as per its size viz. 24, 26, 28 or 30 mm ensuring longer scaif life.
Weight Control Device - for best & effective cutting : Optional - Manual / Automatic.
Automatic Chal change feature.
Push - Fit system : special time saving in changing of die.
Special feature of diamond protection which shows "Error" on keyboard automatically incase of fault in machine or during operation.
Automatic battery back up in case of power failure.
Different program according to different roughs - 2 pt., 3 pt., 4 pt., etc.
Keyboard in both the languages - English & Gujarati
Option : Special facility to interface with computer.
View Complete Details

Jewellery Hallmarking System

PERMANENT
Laser marking is permanent and indelible marking process, which stands against wiping, scuffing, impacts, wear and tear, can only be removed by grinding or surface removal. Thus laser - marking sustains authenticity of your brand against sort of tempering
NON-CONTACT TYPE
Laser marking is not-contact type process. It does not produce any deformation in product unlike in punching, stmping, pneumatic pin, vibratory pencil etc. This gives accurate and aesthetic marking independent of Hardness of material.
FLEXIBILITY
Laser marking is highly flexible process compared to any other marking process. It can mark any images and fonts without changing any punch, die, stencil etc. unlike other conventional process.
AESTHETIC/ACCURACY
Since laser can produce very fine beam with accuracy in micorn, many accurate and micro details with precision can be marked with laser marking. Laser can produce aesthetic images which otherwise difficult create with other marking process.
NO PRE/POST PROCESSING
Since Laser marking is non-contact type, no pre or post processing is required, which in turn significantly increase marking productivity.
LOW OPERATING COST
Laser marking helps significantly in cutting operating cost by reducing labor cost, tool cost, consumable cost, set up time, rejection improved cycle time.
AUTOMATION
One of the prime advantage of laser marking is that it can be automize and can be integrated with any online process. With support of software, even variable serial nos., batch nos., date of bar code can be marked.
View Complete Details

Laser Cutting System

BALL RAIL SYSTEM
Smooth & friction guided motion, high precision & high speed ball, long life & better load carrying capacity.
BALL SCREW MECHANISM
Precision movement imparted through ball screw mechanism. Supreme quality of ball screw to provide high accuracy and repeatability at high speed with low noise runner block.
USER FRIENDLY SOFTWARE
User-friendly software for laser power and pulse frequency, pulse duration along with position control.
NESTING
Nesting software to nest different types of jobs in single sheet and optimal use of raw material. Accommodation of different types of jobs from scrap material & common edge cutting. Complete material management through user-friendly software.

HEIGHT SENSING UNIT

Adjusting preset height automatically. It helps to cut little sloppy (non-flat or non-linear) surface of sheet. Non-contact & contact types of versions are available.
STRUCTURAL DESIGN
Structural design is such that it can withstand heavy loads. Vibration pads are used for sustaining the structural damping.
REMOTE CONTROL
Flexible machine controls from remote place with emergency stop facility, easy to understand or self-explanatory audio & video display machine.
SHEET LOADING & CLAMPING
Pneumatically actuated loader with ball on the top of it for easy sliding of the sheet. Pneumatically controlled firm clamping on the sheet. It can adjust the position of the clamp on the table. Safe loading and clamping for operator who is loading and un-loading the sheet.
DETACHABLE OPTICS
Replacements of mirror without any change in linked alignments.
THERMAL OPTICS STABILITY
Parallel water-cooling system with temperature control. It eliminates the thermal expansion of optics and increases peak power life.
OPTICS BELLOWS
Metallic bellows for protection of optics form contamination.
CONTROL & DISPLAY
SIEMENS or PC based SLT Ltd. controls available.

Drive Feed Method Ball Screw Rack&Pinion with Rall Guides Linear Drive
Working Area/Sheet size 3000mm x 1500mm 4000mm x 2000 mm 3000mm * 1500 mm
Z Axis Travel (max) 200/150mm 200/150mm 200/150mm
workpiece
Weight (Max.)
450kgs 1500kgs 450kgs
Control Method X-,Y-, and Z- axis controlled X-,Y-, and Z- axis controlled X-,Y-, and Z- axis controlled
  (Three axis simultaneously controlled) (Three axis simultaneously controlled) (Three axis simultaneously controlled)
Travel Method X-Y : Optical travel X-Y : Optical travel Stationary table ,X,Y and Z- axis Movement for Cutting head
Positioning Speed(Max)      
X-axis 40m/min 40m/min 150 m/min
Y-axis 40m/min 40m/min 150 m/min
Z-axis 15m/min 15m/min 15m/min
Positioning Accuracy +/- 0.1mm +/- 0.1mm +/- 0.1mm
Feed Rate 10m/min 10m/min -----
  10m/min 10m/min -----
Least Command Increment 0.001mm 0.001mm -----
Repeatability 0.03mm 0.03mm 0.03mm
Acceleration --- --- 2G for X&Y
CNC Controller siemens sinumeric810D siemens sinumeric840D siemens sinumeric840D
CNC Control Method Fully closed loop method Fully closed loop method Fully closed loop method
Control Function X-,Y- and Z- axis Controlled X-,Y- and Z- axis Controlled X-,Y- and Z- axis Controlled
  (simultaneously controlled) (simultaneously controlled) Laser Power Control
  Laser oscillator control Laser oscillator control  
Assist Gas Selector Automatic selection Automatic selection Automatic selection
Electrical Requirement AC, 3-Phases, 415 V, Complete system AC, 3-Phases, 415 V, Complete system 400v, 3 phase ,60Hz
Total Weight 6500kgs 14500 kgs 11000 kgs
Input Methods Manual data input with numeric keys Manual data input with numeric keys manual (MDI),Edit, RS-232 DNC, or 3 1/2* PC Compatible disk
  3.5" FD (built - in - type) 3.5" FD (built - in - type) CD/DVD disk,USB,Ethernet PCMCIA
Operating Modes Edit/Memory / MDI / Auto / Manual / teach Edit/Memory / MDI / Auto / Manual / teach Automatic and Manual
Display 10.4 " COLOUR TFT DISPLAY 10.4 " COLOUR TFT DISPLAY 10.4 " COLOUR TFT DISPLAY
I/O Interface PROFIBUS PROFIBUS -----
DIaplayfunctions Program directory Program directory Program Contents
  Subroutine directory Subroutine directory Position Information
  Position & Feed information Position & Feed information Program Check
  User cycle directory User cycle directory Setting
  Alarm messages Alarm messages Parameters
  Tool diameter compensation Tool diameter compensation Beam Diameter
  (Offset) (Offset) Compensation
  Program Simulation Program Simulation Assist Gas Status
  Diagnosis (CNC self diagnostics) Diagnosis (CNC self diagnostics) Self Diagnostics
Optional Setting Setting Maintenance Reminders
Working Area      
X- stroke 1250/2500/300mm 1250/2500/300mm 1250/2500/300mm
Y- stroke 1250/1200/1500mm 1250/1200/1500mm 1250/1200/1500mm

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Solar Cell Scribing Machine

  • Laser Lamp Pumped Nd:YAG Laser
  • Wavelength 1.064µm
  • Transverse Mode TEMoo
  • Beam Diameter 1.0 mm, nominal , M2 < 2.5
A photovoltaic cell (commonly called a solar cell) is a nonmechanical device usually made from silicon alloys. It converts sunlight into electricity. The PV cell was discovered in 1954 by Bell Telephone researchers. Late 1950s, PV cells were used to power U.S. space satellites.
Individual cells can vary in size from about 1 cm (1/2 inch) to about 10 cm (4 inches). Most photovoltaic cells are about ten percent efficient in covering sunlight to electricity with further research being conducted to raise this efficiency to fifteen-twenty percent.
Photovoltaic conversion is useful for several reasons. Conversion from sunlight to electricity is direct, so that bulky mechanical generator systems are unnecessary. The modular characteristic of photovoltaic energy allows arrays to be installed quickly and in any size required or allowed.
Presently BCSC (Buried Contact Solar Cells) and Polycrystalline CdTe-baser Photovoltaic are the latest technology in the solar cells and having efficiency is around 15-20 % approx. and we can get stable power output and long life.
HOW DOES A SOLAR CELL WORK?
Sunlight is composed of photons, or particles of solar energy. These photons contain various amounts of energy corresponding to the different wavelengths of the solar spectrum. When photons strike a photovoltaic cell, they may be reflected, pass right through, or be absorbed. Only the absorbed photons provide energy to generate electricity. When enough sunlight (energy) is absorbed by the material (semiconductor), electrons are dislodged from the material's atoms. Special treatment of the material surface during manufacturing makes the front surface of the cell more receptive to free electrons, so the electrons naturally migrate to the surface. When the electrons leave their position, holes are formed. When many electrons, each carrying a negative charge, travel toward the front surface of the cell, the resulting imbalance of charge between the cell's front and back surface creates a voltage potential like the negative and positive terminals of a battery. When the two surfaces are connected through an external load, electricity flows.
WHAT IS SCRIBING AND WHY SCRIBING IS NECESSARY?
Scribing means, cutting of a grid pattern of grooves in a semiconductor material generally for the purpose of marking interconnections or to cut the solar cells into two parts.
Laser scribing is done for the fabrication of monolithic cell interconnections. Scribing, either with a mechanical stylus or a laser is used for fabricating series interconnections allowing a large, thin-film photovoltaic panels to be made with, for example, 100 cells monolithically interconnected. The series interconnection allows the same electrical power to be produces from the panel with a voltage 100 times that of an individual cell and the current equal to that of one cell. For CdTe thin films, the individual cell voltage is about 0.8V

LASER HEAD
Laser Lamp Pumped Nd:YAG Laser
Wavelength 1.064µm
Transverse Mode TEMoo
Beam Diameter 1.0 mm, nominal , M2 < 2.5
   
Q-SWITCHED PERFORMANCE AT 3 KHZ
Average Power 75 Watts
Pulse Width, nominal 110 ns
Peak Pulse Power 75 kW
Pulse Stability ( peak- peak ) 5%
   
CONTROLLER & CNC SYSTEM
Controller PC based
Axis Travel (X & Y) 200 mm x 200 mm ( 250mm X 250mm optional )
Resolution 1 Micron
Accuracy 2 Micron / 25 mm
Repeatability 2 microns / 25 mm Bi-directional
Straightness & Flatness 2 Micron / 25 mm
Of Travel  
Drive Servo Control Drives
Z Axis Manual
   
VISION SYSTEM
CCTV Camera In-built
 
MECHANICAL
Dimensions (L) 2000 mm x (W) 807 mm x (H) 1700 mm
   
ELECTRICAL
Power 380 ± 10% VAC, 3 Phase, 50/60 Hz.

FEATURES CONVENTIONAL SYSTEM LASER SYSTEM ADVANTAGES OF LASER
TOOL DIAMOND CUTTER LASER CUTTER NON CONTACT TYPE TOOLING. MOST SUITABLE FOR THE BRITTLE MATERIALS WHICH IS USED IN SOLAR CELL.
POSITIONING SPEED   60 MM / SEC MORE POSITIONING SPEED.
CUTTING SPEED 8.00 MM /SEC 30 MM / SEC FASTER SCRIBING LEADS TO COMPARATIVELY HIGH PRODUCTIVITY.
KERF WIDTH OF THE TOOL 45 MICRONS 1 8 MICRONS LESS WASTAGE : BECAUSE A CELL COSTS AROUND $ 4.1: MORE MATERIAL SAVING, MORE ECONOMICAL.
TOOLING COST ONE DIAMOND CUTTER APPROX. CAN CUT 15,000 CELL LASER : NO REPLACEMENT OF TOOL CUTTER COST CAN BE SAVED.
DEPTH OF CUT   0.6 MM PRECISE DEPTH OF CUT CAN BE ACHIEVED.
ACCURACY   1 MICRON PRECISE ACCURACY MORE ACCURACY CAN BE ACHIEVED.
COST     VERY COST EFFECTIVE
View Complete Details

Blocking Bruiting Sawing System

All-I-In-One: Laser Diamond Blocking-Bruiting-Sawing
Higher Total Yield Compared To Conventional Methods
Almost 85% Diamond Processed In Single Setting

One Time Fixing For The Whole Process

All-in-one: laser blocking (faceting)- bruiting- table sawing
No need to stick the diamond at every stage. Single die can be used throughout the process.
Almost 85% diamond process in one machine
Recovery of extra pieces
Total yield is more compared to traditional methods.
Ergonomic design
Smooth cutting surface
User friendly software

LASER SOURCE Nd : YAG Lamp Pumped Nd : YAG Diode Pumped
WAVELENGTH 1064 nm 1064 nm
BEAM MODE TEM00 , M2 < 1.2 TEM00 , M2 < 1.2
LASER POWER 4 - 16 Watts 15 Watts
LASER CLASS IV IV
CNC MOVEMENT` 170 mm X 170 mm X 50 mm 170 mm X 170 mm X 50 mm
RESOLUTION
REPEATABILITY < 3 µ < 3 µ
DRIVE SERVO SERVO
ACCESSORIES
CHILLER  
    WATER 90 lit. DI water  
    FLOW 18 lit/min.  
    TEMPERATURE 27°C 27°C
STABILIZER/UPS 3 Ø Servo Control 1.5 KVA
ELECTRICITY 3-Ø 1-Ø, 220 V, 5/<8 Ampere, AC Supply
PULSE FREQUENCY (RF) Automatic Automatic
ROOM TEMPERATURE 25°C 25°C
SPACE REQUIRED 1300 mm X 1125 mm X 1400 mm 1300 mm X 1125 mm X 1400 mm
WEIGHT 300 kg 300 kg
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Diamond Planning System

Accurate Laser Scanning for Measuring Groove and Cavity
Precise Planning for Achieving the Best Yield

Uniform Marking of ID-Number, Text & Logo

An indiginized system for laser scanning and marking a very much essential tool in diamond processing to get maximum yield from rough diamonds.
Advanced Vision System provides accurate scanning of the diamond.
3D Algorithms to check numerous options for planning the diamond.
Maps holes & grooves using precise laser scanning.
Latest Fiber Laser Technology for marking which has longer laser source life.
Biggest remainder piece by weight on single click.
Facility of customized creation as per desired weight.
Unique ID - Number marking for each marking lines, which eliminates human errors while sawing & bruting.
Text & Logo inscription enables the user for brand identity.
Marking options, Light, Medium and Dark, provide flexibility to the user for marking darkness.
According to the type of rough diamond, flexible laser marking provides no damage risk to the diamond.
Qualitative marking lines are uniform black and aligned. So, it is easily visible while sawing & bruting.
Bruting marking with safe side, which leads to safe, accurate & faster bruting.
It can be integrated with selected bruting system so that bruting data can be transferred easilyand minimizes errors.
Multilingual software - in Gujarati & English.
New feature of impurity plane.
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Jewellery Welding System

  • Beam Source Nd : YAG
  • Pump Source Flash Lamp
  • Wavelength 1064 nm
  • Max. Pulse power 70 Joules 
  • Max. Medium output 60 W
  • Max. Pulse output 15 KW
  • Pulse Length 0.5 to 20 ms
  • Pulse Frequency Single Pulse upto 20 Hz
  • Pulse Fill Mode 10 - 100 %
  • PWM 1 - 100 %
  • Focal Length Standard 120 mm (Others on request)
  • Spot Diameter* 200 µm to 2 mm (motor adjustable)
  • Flash Lamp Voltage 160 to 500 Volts
  • Cooling Integrated air / water heat exchangers
  • Inert gas connections Dual, along the beam axis and switched on via flexible inlet.
COMPREHENSIVE.From SLT Ltd., you get state of art technological laser systems designed by our own engineers and CAD draughtsman and specially tailored to your needs. This is why from SLT Ltd. you get comprehensive laser competency from A to Z.
USER FRIENDLY.The SLT Ltd. LWI Chambertype unifies intuitive operation, excellent design and ergonomics in fascinating way. Convince yourself.
CUSTOM MADE.The innovative SLT Ltd. LWI Chambertype offers flexible solutions in individual applications. Customer specific modifications are made easily, at any time, from spot diameter and focus length to pulse modulation and handling systems.
ECONOMICAL.The SLT Ltd. Chambertype stands for the highest performance and functionality at an unbeatable and really exceptional cost-performance ratio. Because quality must be affordable.
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Siemens Controller

State of the art controller from Siemens integrated with FutureX brings you the entirely new experience in the machine operation and convenience.

View Complete Details
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List of Other Products by Ajay Construction from Vadodara, Gujarat.
Post Buy Requirement
AC
Add Review

Our Products

  1. Laser Instruments 4 Products available
  2. Cutting Machine

    2 Products available
  3. Cutting Machines & Equipment

    2 Products available
  4. Crusher, Shredder & Presses

    1 Products available
  5. Diamond Processing Machine

    1 Products available
  6. Logic Controllers

    1 Products available
  7. Jewellery Making Machine

    1 Products available
  8. Welding Machinery

    1 Products available
  9. Solar And Renewable Energy Products

    1 Products available
  10. Others Products 1 Products available

Other Products / Services

Leading Manufacturer, Supplier & Retailer of Diamond Blocking System.

Diamond Sawing System

Low weight loss compared to other flash lamp based machines.
Maintenance Free: No need of alignment.
Smooth cutting surface.
Breakage rate almost 'NIL'
Ergonomic Design with Aluminium extruded structure
User Friendly software
View Complete Details

Diamond Blocking System

Automatic Direction Change
Unique Push-Fit System
Longer Scaif Life
Perfect Weight Control Device

Blocking & Polishing for any diamond bigger than 5 cent in size.

Full travel in diamond scaif surface as per its size viz. 24, 26, 28 or 30 mm ensuring longer scaif life.
Weight Control Device - for best & effective cutting : Optional - Manual / Automatic.
Automatic Chal change feature.
Push - Fit system : special time saving in changing of die.
Special feature of diamond protection which shows "Error" on keyboard automatically incase of fault in machine or during operation.
Automatic battery back up in case of power failure.
Different program according to different roughs - 2 pt., 3 pt., 4 pt., etc.
Keyboard in both the languages - English & Gujarati
Option : Special facility to interface with computer.
View Complete Details

Jewellery Hallmarking System

PERMANENT
Laser marking is permanent and indelible marking process, which stands against wiping, scuffing, impacts, wear and tear, can only be removed by grinding or surface removal. Thus laser - marking sustains authenticity of your brand against sort of tempering
NON-CONTACT TYPE
Laser marking is not-contact type process. It does not produce any deformation in product unlike in punching, stmping, pneumatic pin, vibratory pencil etc. This gives accurate and aesthetic marking independent of Hardness of material.
FLEXIBILITY
Laser marking is highly flexible process compared to any other marking process. It can mark any images and fonts without changing any punch, die, stencil etc. unlike other conventional process.
AESTHETIC/ACCURACY
Since laser can produce very fine beam with accuracy in micorn, many accurate and micro details with precision can be marked with laser marking. Laser can produce aesthetic images which otherwise difficult create with other marking process.
NO PRE/POST PROCESSING
Since Laser marking is non-contact type, no pre or post processing is required, which in turn significantly increase marking productivity.
LOW OPERATING COST
Laser marking helps significantly in cutting operating cost by reducing labor cost, tool cost, consumable cost, set up time, rejection improved cycle time.
AUTOMATION
One of the prime advantage of laser marking is that it can be automize and can be integrated with any online process. With support of software, even variable serial nos., batch nos., date of bar code can be marked.
View Complete Details

Laser Cutting System

BALL RAIL SYSTEM
Smooth & friction guided motion, high precision & high speed ball, long life & better load carrying capacity.
BALL SCREW MECHANISM
Precision movement imparted through ball screw mechanism. Supreme quality of ball screw to provide high accuracy and repeatability at high speed with low noise runner block.
USER FRIENDLY SOFTWARE
User-friendly software for laser power and pulse frequency, pulse duration along with position control.
NESTING
Nesting software to nest different types of jobs in single sheet and optimal use of raw material. Accommodation of different types of jobs from scrap material & common edge cutting. Complete material management through user-friendly software.

HEIGHT SENSING UNIT

Adjusting preset height automatically. It helps to cut little sloppy (non-flat or non-linear) surface of sheet. Non-contact & contact types of versions are available.
STRUCTURAL DESIGN
Structural design is such that it can withstand heavy loads. Vibration pads are used for sustaining the structural damping.
REMOTE CONTROL
Flexible machine controls from remote place with emergency stop facility, easy to understand or self-explanatory audio & video display machine.
SHEET LOADING & CLAMPING
Pneumatically actuated loader with ball on the top of it for easy sliding of the sheet. Pneumatically controlled firm clamping on the sheet. It can adjust the position of the clamp on the table. Safe loading and clamping for operator who is loading and un-loading the sheet.
DETACHABLE OPTICS
Replacements of mirror without any change in linked alignments.
THERMAL OPTICS STABILITY
Parallel water-cooling system with temperature control. It eliminates the thermal expansion of optics and increases peak power life.
OPTICS BELLOWS
Metallic bellows for protection of optics form contamination.
CONTROL & DISPLAY
SIEMENS or PC based SLT Ltd. controls available.

Drive Feed Method Ball Screw Rack&Pinion with Rall Guides Linear Drive
Working Area/Sheet size 3000mm x 1500mm 4000mm x 2000 mm 3000mm * 1500 mm
Z Axis Travel (max) 200/150mm 200/150mm 200/150mm
workpiece
Weight (Max.)
450kgs 1500kgs 450kgs
Control Method X-,Y-, and Z- axis controlled X-,Y-, and Z- axis controlled X-,Y-, and Z- axis controlled
  (Three axis simultaneously controlled) (Three axis simultaneously controlled) (Three axis simultaneously controlled)
Travel Method X-Y : Optical travel X-Y : Optical travel Stationary table ,X,Y and Z- axis Movement for Cutting head
Positioning Speed(Max)      
X-axis 40m/min 40m/min 150 m/min
Y-axis 40m/min 40m/min 150 m/min
Z-axis 15m/min 15m/min 15m/min
Positioning Accuracy +/- 0.1mm +/- 0.1mm +/- 0.1mm
Feed Rate 10m/min 10m/min -----
  10m/min 10m/min -----
Least Command Increment 0.001mm 0.001mm -----
Repeatability 0.03mm 0.03mm 0.03mm
Acceleration --- --- 2G for X&Y
CNC Controller siemens sinumeric810D siemens sinumeric840D siemens sinumeric840D
CNC Control Method Fully closed loop method Fully closed loop method Fully closed loop method
Control Function X-,Y- and Z- axis Controlled X-,Y- and Z- axis Controlled X-,Y- and Z- axis Controlled
  (simultaneously controlled) (simultaneously controlled) Laser Power Control
  Laser oscillator control Laser oscillator control  
Assist Gas Selector Automatic selection Automatic selection Automatic selection
Electrical Requirement AC, 3-Phases, 415 V, Complete system AC, 3-Phases, 415 V, Complete system 400v, 3 phase ,60Hz
Total Weight 6500kgs 14500 kgs 11000 kgs
Input Methods Manual data input with numeric keys Manual data input with numeric keys manual (MDI),Edit, RS-232 DNC, or 3 1/2* PC Compatible disk
  3.5" FD (built - in - type) 3.5" FD (built - in - type) CD/DVD disk,USB,Ethernet PCMCIA
Operating Modes Edit/Memory / MDI / Auto / Manual / teach Edit/Memory / MDI / Auto / Manual / teach Automatic and Manual
Display 10.4 " COLOUR TFT DISPLAY 10.4 " COLOUR TFT DISPLAY 10.4 " COLOUR TFT DISPLAY
I/O Interface PROFIBUS PROFIBUS -----
DIaplayfunctions Program directory Program directory Program Contents
  Subroutine directory Subroutine directory Position Information
  Position & Feed information Position & Feed information Program Check
  User cycle directory User cycle directory Setting
  Alarm messages Alarm messages Parameters
  Tool diameter compensation Tool diameter compensation Beam Diameter
  (Offset) (Offset) Compensation
  Program Simulation Program Simulation Assist Gas Status
  Diagnosis (CNC self diagnostics) Diagnosis (CNC self diagnostics) Self Diagnostics
Optional Setting Setting Maintenance Reminders
Working Area      
X- stroke 1250/2500/300mm 1250/2500/300mm 1250/2500/300mm
Y- stroke 1250/1200/1500mm 1250/1200/1500mm 1250/1200/1500mm

View Complete Details

Solar Cell Scribing Machine

  • Laser Lamp Pumped Nd:YAG Laser
  • Wavelength 1.064µm
  • Transverse Mode TEMoo
  • Beam Diameter 1.0 mm, nominal , M2 < 2.5
A photovoltaic cell (commonly called a solar cell) is a nonmechanical device usually made from silicon alloys. It converts sunlight into electricity. The PV cell was discovered in 1954 by Bell Telephone researchers. Late 1950s, PV cells were used to power U.S. space satellites.
Individual cells can vary in size from about 1 cm (1/2 inch) to about 10 cm (4 inches). Most photovoltaic cells are about ten percent efficient in covering sunlight to electricity with further research being conducted to raise this efficiency to fifteen-twenty percent.
Photovoltaic conversion is useful for several reasons. Conversion from sunlight to electricity is direct, so that bulky mechanical generator systems are unnecessary. The modular characteristic of photovoltaic energy allows arrays to be installed quickly and in any size required or allowed.
Presently BCSC (Buried Contact Solar Cells) and Polycrystalline CdTe-baser Photovoltaic are the latest technology in the solar cells and having efficiency is around 15-20 % approx. and we can get stable power output and long life.
HOW DOES A SOLAR CELL WORK?
Sunlight is composed of photons, or particles of solar energy. These photons contain various amounts of energy corresponding to the different wavelengths of the solar spectrum. When photons strike a photovoltaic cell, they may be reflected, pass right through, or be absorbed. Only the absorbed photons provide energy to generate electricity. When enough sunlight (energy) is absorbed by the material (semiconductor), electrons are dislodged from the material's atoms. Special treatment of the material surface during manufacturing makes the front surface of the cell more receptive to free electrons, so the electrons naturally migrate to the surface. When the electrons leave their position, holes are formed. When many electrons, each carrying a negative charge, travel toward the front surface of the cell, the resulting imbalance of charge between the cell's front and back surface creates a voltage potential like the negative and positive terminals of a battery. When the two surfaces are connected through an external load, electricity flows.
WHAT IS SCRIBING AND WHY SCRIBING IS NECESSARY?
Scribing means, cutting of a grid pattern of grooves in a semiconductor material generally for the purpose of marking interconnections or to cut the solar cells into two parts.
Laser scribing is done for the fabrication of monolithic cell interconnections. Scribing, either with a mechanical stylus or a laser is used for fabricating series interconnections allowing a large, thin-film photovoltaic panels to be made with, for example, 100 cells monolithically interconnected. The series interconnection allows the same electrical power to be produces from the panel with a voltage 100 times that of an individual cell and the current equal to that of one cell. For CdTe thin films, the individual cell voltage is about 0.8V

LASER HEAD
Laser Lamp Pumped Nd:YAG Laser
Wavelength 1.064µm
Transverse Mode TEMoo
Beam Diameter 1.0 mm, nominal , M2 < 2.5
   
Q-SWITCHED PERFORMANCE AT 3 KHZ
Average Power 75 Watts
Pulse Width, nominal 110 ns
Peak Pulse Power 75 kW
Pulse Stability ( peak- peak ) 5%
   
CONTROLLER & CNC SYSTEM
Controller PC based
Axis Travel (X & Y) 200 mm x 200 mm ( 250mm X 250mm optional )
Resolution 1 Micron
Accuracy 2 Micron / 25 mm
Repeatability 2 microns / 25 mm Bi-directional
Straightness & Flatness 2 Micron / 25 mm
Of Travel  
Drive Servo Control Drives
Z Axis Manual
   
VISION SYSTEM
CCTV Camera In-built
 
MECHANICAL
Dimensions (L) 2000 mm x (W) 807 mm x (H) 1700 mm
   
ELECTRICAL
Power 380 ± 10% VAC, 3 Phase, 50/60 Hz.

FEATURES CONVENTIONAL SYSTEM LASER SYSTEM ADVANTAGES OF LASER
TOOL DIAMOND CUTTER LASER CUTTER NON CONTACT TYPE TOOLING. MOST SUITABLE FOR THE BRITTLE MATERIALS WHICH IS USED IN SOLAR CELL.
POSITIONING SPEED   60 MM / SEC MORE POSITIONING SPEED.
CUTTING SPEED 8.00 MM /SEC 30 MM / SEC FASTER SCRIBING LEADS TO COMPARATIVELY HIGH PRODUCTIVITY.
KERF WIDTH OF THE TOOL 45 MICRONS 1 8 MICRONS LESS WASTAGE : BECAUSE A CELL COSTS AROUND $ 4.1: MORE MATERIAL SAVING, MORE ECONOMICAL.
TOOLING COST ONE DIAMOND CUTTER APPROX. CAN CUT 15,000 CELL LASER : NO REPLACEMENT OF TOOL CUTTER COST CAN BE SAVED.
DEPTH OF CUT   0.6 MM PRECISE DEPTH OF CUT CAN BE ACHIEVED.
ACCURACY   1 MICRON PRECISE ACCURACY MORE ACCURACY CAN BE ACHIEVED.
COST     VERY COST EFFECTIVE
View Complete Details

Blocking Bruiting Sawing System

All-I-In-One: Laser Diamond Blocking-Bruiting-Sawing
Higher Total Yield Compared To Conventional Methods
Almost 85% Diamond Processed In Single Setting

One Time Fixing For The Whole Process

All-in-one: laser blocking (faceting)- bruiting- table sawing
No need to stick the diamond at every stage. Single die can be used throughout the process.
Almost 85% diamond process in one machine
Recovery of extra pieces
Total yield is more compared to traditional methods.
Ergonomic design
Smooth cutting surface
User friendly software

LASER SOURCE Nd : YAG Lamp Pumped Nd : YAG Diode Pumped
WAVELENGTH 1064 nm 1064 nm
BEAM MODE TEM00 , M2 < 1.2 TEM00 , M2 < 1.2
LASER POWER 4 - 16 Watts 15 Watts
LASER CLASS IV IV
CNC MOVEMENT` 170 mm X 170 mm X 50 mm 170 mm X 170 mm X 50 mm
RESOLUTION
REPEATABILITY < 3 µ < 3 µ
DRIVE SERVO SERVO
ACCESSORIES
CHILLER  
    WATER 90 lit. DI water  
    FLOW 18 lit/min.  
    TEMPERATURE 27°C 27°C
STABILIZER/UPS 3 Ø Servo Control 1.5 KVA
ELECTRICITY 3-Ø 1-Ø, 220 V, 5/<8 Ampere, AC Supply
PULSE FREQUENCY (RF) Automatic Automatic
ROOM TEMPERATURE 25°C 25°C
SPACE REQUIRED 1300 mm X 1125 mm X 1400 mm 1300 mm X 1125 mm X 1400 mm
WEIGHT 300 kg 300 kg
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Diamond Planning System

Accurate Laser Scanning for Measuring Groove and Cavity
Precise Planning for Achieving the Best Yield

Uniform Marking of ID-Number, Text & Logo

An indiginized system for laser scanning and marking a very much essential tool in diamond processing to get maximum yield from rough diamonds.
Advanced Vision System provides accurate scanning of the diamond.
3D Algorithms to check numerous options for planning the diamond.
Maps holes & grooves using precise laser scanning.
Latest Fiber Laser Technology for marking which has longer laser source life.
Biggest remainder piece by weight on single click.
Facility of customized creation as per desired weight.
Unique ID - Number marking for each marking lines, which eliminates human errors while sawing & bruting.
Text & Logo inscription enables the user for brand identity.
Marking options, Light, Medium and Dark, provide flexibility to the user for marking darkness.
According to the type of rough diamond, flexible laser marking provides no damage risk to the diamond.
Qualitative marking lines are uniform black and aligned. So, it is easily visible while sawing & bruting.
Bruting marking with safe side, which leads to safe, accurate & faster bruting.
It can be integrated with selected bruting system so that bruting data can be transferred easilyand minimizes errors.
Multilingual software - in Gujarati & English.
New feature of impurity plane.
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Jewellery Welding System

  • Beam Source Nd : YAG
  • Pump Source Flash Lamp
  • Wavelength 1064 nm
  • Max. Pulse power 70 Joules 
  • Max. Medium output 60 W
  • Max. Pulse output 15 KW
  • Pulse Length 0.5 to 20 ms
  • Pulse Frequency Single Pulse upto 20 Hz
  • Pulse Fill Mode 10 - 100 %
  • PWM 1 - 100 %
  • Focal Length Standard 120 mm (Others on request)
  • Spot Diameter* 200 µm to 2 mm (motor adjustable)
  • Flash Lamp Voltage 160 to 500 Volts
  • Cooling Integrated air / water heat exchangers
  • Inert gas connections Dual, along the beam axis and switched on via flexible inlet.
COMPREHENSIVE.From SLT Ltd., you get state of art technological laser systems designed by our own engineers and CAD draughtsman and specially tailored to your needs. This is why from SLT Ltd. you get comprehensive laser competency from A to Z.
USER FRIENDLY.The SLT Ltd. LWI Chambertype unifies intuitive operation, excellent design and ergonomics in fascinating way. Convince yourself.
CUSTOM MADE.The innovative SLT Ltd. LWI Chambertype offers flexible solutions in individual applications. Customer specific modifications are made easily, at any time, from spot diameter and focus length to pulse modulation and handling systems.
ECONOMICAL.The SLT Ltd. Chambertype stands for the highest performance and functionality at an unbeatable and really exceptional cost-performance ratio. Because quality must be affordable.
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Siemens Controller

State of the art controller from Siemens integrated with FutureX brings you the entirely new experience in the machine operation and convenience.

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